专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11465254B2 Polishing machine and a polishing method for a substrate 有权
公开(公告)号：US11465254B2
公开(公告)日：2022-10-11
申请号：US16787892
申请日：2020-02-11
申请人： Ebara Corporation
发明人： Itsuki Kobata , Katsuhide Watanabe , Hozumi Yasuda , Yuji Yagi , Nobuyuki Takahashi , Koichi Takeda
IPC分类号： B24B37/013 , B24B37/04 , B24B37/20
摘要： One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

2. 发明授权

US10293455B2 Polishing apparatus 有权
公开(公告)号：US10293455B2
公开(公告)日：2019-05-21
申请号：US15150279
申请日：2016-05-09
申请人： EBARA CORPORATION
发明人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima , Hozumi Yasuda
IPC分类号： B24B37/005 , B24B37/10 , B24B37/32 , B24B47/22 , B24B49/18 , B24B37/20 , B24B37/04 , B24B37/30 , B24B49/16 , B24B49/00
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

3. 外观设计

USD813180S1 Elastic membrane for semiconductor wafer polishing apparatus 有权
公开(公告)号：USD813180S1
公开(公告)日：2018-03-20
申请号：US29580339
申请日：2016-10-07
申请人： EBARA CORPORATION
设计人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki

4. 外观设计

USD794585S1 Retainer ring for substrate 有权
公开(公告)号：USD794585S1
公开(公告)日：2017-08-15
申请号：US29560291
申请日：2016-04-05
申请人： EBARA CORPORATION
设计人： Osamu Nabeya , Hozumi Yasuda , Makoto Fukushima , Keisuke Namiki , Shingo Togashi , Satoru Yamaki

5. 发明申请

US20170057049A1 POLISHING APPARATUS AND POLISHING METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20170057049A1
公开(公告)日：2017-03-02
申请号：US15248112
申请日：2016-08-26
申请人： Ebara Corporation
发明人： Makoto Fukushima , Hozumi Yasuda , Shingo Togashi
IPC分类号： B24B37/005
摘要： A polishing apparatus includes a polishing table for supporting a polishing pad and a substrate holding device for pressing a substrate against the polishing pad. The substrate holding device includes an elastic film to form multiple pressure chambers to press the substrate, and a pressure control unit controlling pressure of the pressure chambers. The pressure control unit includes a first flow path connected to a first pressure chamber, and first and second pressure regulation mechanisms. The pressure control unit performs switching control from first pressure regulation mechanism to second pressure regulation mechanism when a set pressure within first pressure chamber reaches a first threshold value. Then, the pressure control unit performs switching control from second pressure regulation mechanism to first pressure regulation mechanism when the set pressure within the first pressure chamber reaches a second threshold value lower than the first threshold value.
摘要翻译：抛光装置包括用于支撑抛光垫的抛光台和用于将基板压靠在抛光垫上的基板保持装置。基板保持装置包括形成多个压力室以按压基板的弹性膜，以及控制压力室压力的压力控制单元。压力控制单元包括连接到第一压力室的第一流路，以及第一和第二压力调节机构。当第一压力室内的设定压力达到第一阈值时，压力控制单元执行从第一压力调节机构到第二压力调节机构的切换控制。然后，当第一压力室内的设定压力达到低于第一阈值的第二阈值时，压力控制单元进行从第二压力调节机构到第一压力调节机构的切换控制。

6. 外观设计

USD770990S1 Elastic membrane for semiconductor wafer polishing apparatus 有权
公开(公告)号：USD770990S1
公开(公告)日：2016-11-08
申请号：US29489477
申请日：2014-04-30
申请人： EBARA CORPORATION
设计人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki

7. 发明授权

US12128523B2 Polishing apparatus 有权
公开(公告)号：US12128523B2
公开(公告)日：2024-10-29
申请号：US16890833
申请日：2020-06-02
申请人： EBARA CORPORATION
发明人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
IPC分类号： B24B37/32 , B24B37/005 , B24B49/16 , H01L21/304
CPC分类号： B24B37/32 , B24B37/005 , B24B49/16 , H01L21/304
摘要： A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface for pressing the substrate against the polishing surface and further having a retaining ring arranged so as to surround the substrate and brought into contact with the polishing surface, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface. The at least one local load exerting mechanism is arranged so as not to rotate together with the substrate holder.

8. 发明授权

US11511389B2 Polishing head and polishing apparatus 有权
公开(公告)号：US11511389B2
公开(公告)日：2022-11-29
申请号：US16575844
申请日：2019-09-19
申请人： EBARA CORPORATION
发明人： Kenichi Akazawa , Makoto Kashiwagi , Yu Ishii , Atsushi Yoshida , Kenichi Kobayashi , Tetsuji Togawa , Hozumi Yasuda
IPC分类号： B24B37/10 , B24B41/06 , B24B49/16 , B24B7/22 , B24B41/00 , B24B37/005 , B24B37/30
摘要： Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.

9. 发明授权

US10702972B2 Polishing apparatus 有权
公开(公告)号：US10702972B2
公开(公告)日：2020-07-07
申请号：US14476680
申请日：2014-09-03
申请人： EBARA CORPORATION
发明人： Makoto Fukushima , Hozumi Yasuda , Keisuke Namiki , Osamu Nabeya , Shingo Togashi , Satoru Yamaki
IPC分类号： B24B37/32 , B24B49/16 , H01L21/304 , B24B37/005
摘要： A polishing apparatus capable of precisely controlling a polishing profile, particularly a polishing profile in an edge portion, of a wafer is disclosed. The polishing apparatus includes: a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring.

10. 发明授权

US10040166B2 Polishing apparatus 有权
公开(公告)号：US10040166B2
公开(公告)日：2018-08-07
申请号：US14312641
申请日：2014-06-23
申请人： EBARA CORPORATION
发明人： Osamu Nabeya , Tetsuji Togawa , Makoto Fukushima , Hozumi Yasuda
IPC分类号： B24B37/32 , B24B37/20 , B24B37/30 , B24B47/22 , B24B49/16 , B24B37/005 , B24B37/10 , B24B49/00
CPC分类号： B24B37/20 , B24B37/005 , B24B37/042 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16 , B24B49/18 , B24B49/183
摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式