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    • 71. 发明申请
    • DEFECT INSPECTION DEVICE AND METHOD OF INSPECTING DEFECT
    • 缺陷检查装置和检查缺陷的方法
    • US20120293795A1
    • 2012-11-22
    • US13575050
    • 2011-02-09
    • Takahiro UranoToshifumi Honda
    • Takahiro UranoToshifumi Honda
    • G01N21/956
    • G01N21/9501
    • Disclosed is a defect inspection device comprising: an illumination optical portion which illuminates an object to be inspected with illuminating light; a detection optical portion system illuminated by the illumination optical portion and provided with a plurality of detectors which respectively detects components of scattering light which scatter from the inspected object each in a different direction of azimuthal angle or in a different direction of angle of elevation with respect to a surface of the inspected object; and a signal processing portion which makes gain adjustments and defect decisions in parallel on plural signals based on the components of the scattering light from the inspected object detected by the detectors, respectively, the defect decisions being based on a threshold value decision, and which extracts defects based on results of the gain adjustments and of the defect decisions.
    • 公开了一种缺陷检查装置,包括:照明光学部,其利用照明光照射被检查物体; 由照明光学部分照射的检测光学部分系统,并且设置有多个检测器,其分别检测沿着方位角的不同方向或与不同的仰角方向相对地从被检查物体散射的散射光的分量 到被检查物体的表面; 以及信号处理部分,分别基于由检测器检测到的来自被检查对象的散射光的分量,对多个信号并行地进行增益调整和缺陷判定,所述缺陷判定基于阈值判定,并且提取 基于增益调整结果和缺陷决定的缺陷。
    • 72. 发明申请
    • DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD
    • 缺陷检查装置和缺陷检查方法
    • US20120229618A1
    • 2012-09-13
    • US13387369
    • 2010-08-30
    • Takahiro UranoKaoru SakaiToshifumi Honda
    • Takahiro UranoKaoru SakaiToshifumi Honda
    • G06K9/60H04N7/18
    • G01N21/9501G01N21/95607G01N2021/8825G01N2021/9513G06T7/0004G06T2207/10061G06T2207/30121G06T2207/30148H01L22/12
    • Disclosed is a defect inspection device that has an illumination optical system; a detection optical system; and a processing unit which includes a defect feature quantity calculation unit that calculates the feature quantities of each defect candidate, a defect candidate grouping unit that groups the aforementioned defect candidates on the basis of the feature quantities, a defect classification evaluation value calculation unit that calculates defect classification evaluation values for the aforementioned defect candidates, a defect classification evaluation value updating unit that, on the basis of instructions, updates the evaluation values, a defect classification threshold determination unit that, on the basis of evaluation valued updated by the aforementioned defect classification evaluation value updating unit, determines a classification boundary that is a threshold for classifying defect types of the aforementioned defect candidates, and a defect detection unit that detects defects using the thresholds.
    • 公开了一种具有照明光学系统的缺陷检查装置, 检测光学系统; 以及处理单元,其包括:缺陷特征量计算单元,其计算每个缺陷候选的特征量;缺陷候选分组单元,其基于所述特征量对所述缺陷候选进行分组;缺陷分类评估值计算单元,其计算 上述缺陷候补的缺陷分类评价值,基于指示更新评价值的缺陷分类评价值更新部,基于上述缺陷分类更新的评价值的缺陷分类阈值判定部 评估值更新单元,确定作为用于分类上述缺陷候选的缺陷类型的阈值的分类边界,以及使用阈值来检测缺陷的缺陷检测单元。
    • 73. 发明申请
    • FLAW INSPECTING METHOD AND DEVICE THEREFOR
    • FLAW检查方法及其设备
    • US20120194807A1
    • 2012-08-02
    • US13387120
    • 2010-07-28
    • Shigenobu MaruyamaToshifumi HondaToshiyuki NakaoYuta Urano
    • Shigenobu MaruyamaToshifumi HondaToshiyuki NakaoYuta Urano
    • G01N21/95
    • G01N21/9501G01N21/47
    • In order to maximize the effect of signal addition during inspection of foreign substances in wafers, a device structure including line sensors arranged in plural directions is effective. Low-angle detection optical systems that detect light beams in plural azimuth directions, the light beams being scattered in low angle directions among those scattered from a linear area on a sample illuminated by illuminating means, each include a combination of a first imaging lens group (330) and a diffraction grating (340) and a combination of a second imaging lens group (333) and an image detector (350) having a plurality of light receiving surfaces. A signal processing unit processes signals from the image detectors of the low-angle detection optical systems by adding the signals from the light receiving surfaces corresponding between the image detectors.
    • 为了最大限度地发挥在晶片中异物检查期间信号增加的效果,包括沿多个方向布置的线传感器的装置结构是有效的。 检测在多个方位方向上的光束的低角度检测光学系统,所述光束在从照明装置照射的样品上的线性区域散射的那些中以低角度方向散射,各自包括第一成像透镜组( 330)和衍射光栅(340)以及具有多个光接收表面的第二成像透镜组(333)和图像检测器(350)的组合。 信号处理单元通过将来自相应于图像检测器之间的光接收表面的信号相加来处理来自低角度检测光学系统的图像检测器的信号。
    • 74. 发明授权
    • Method and apparatus for reviewing defects
    • 检查缺陷的方法和装置
    • US08093557B2
    • 2012-01-10
    • US12573479
    • 2009-10-05
    • Hidetoshi NishiyamaToshifumi HondaSachio Uto
    • Hidetoshi NishiyamaToshifumi HondaSachio Uto
    • G01N23/00
    • G01N23/225G02B15/14G02B21/0016H01J37/226H01J37/28H01J2237/216H01J2237/2482H01J2237/2817H01K3/02
    • A method of inspecting defects of a sample includes a first step for, on a basis of position information of defects on a sample placed on a movable table which is previously detected and obtained by an other inspection system, driving the table so that the defects come into a viewing field of an optical microscope having a focus which is adjusted, a second step for re-detecting the defects to obtain a first detection result, a third step for correcting the position information of defects on a basis of position information of defects re-detected of the first detection result, and a fourth step for reviewing the defects whose position information is corrected to obtain a second detection result. The method includes classifying types of defects on basis of the first detection result and the second detection result.
    • 检查样本缺陷的方法包括:第一步骤,基于放置在可移动台上的样本上的缺陷的位置信息,该样本预先由另一检查系统检测并获得,驱动所述台,使得缺陷到达 进入具有调整焦点的光学显微镜的观察区域,第二步骤,用于重新检测缺陷以获得第一检测结果;第三步骤,基于缺陷的位置信息来校正缺陷的位置信息 - 检测到第一检测结果,以及第四步骤,用于检查其位置信息被校正以获得第二检测结果的缺陷。 该方法包括基于第一检测结果和第二检测结果对缺陷的类型进行分类。
    • 75. 发明申请
    • INSPECTION APPARATUS AND AN INSPECTION METHOD FOR INSPECTING A CIRCUIT PATTERN
    • 检查装置和检查电路图案的检查方法
    • US20090226075A1
    • 2009-09-10
    • US12393827
    • 2009-02-26
    • Takashi HiroiTakeyuki YoshidaNaoki HosoyaToshifumi Honda
    • Takashi HiroiTakeyuki YoshidaNaoki HosoyaToshifumi Honda
    • G06K9/00
    • G01N21/95607G06T7/001G06T2207/10056G06T2207/30121G06T2207/30148H01L22/12H01L2924/0002H01L2924/00
    • Disclosed herein are a circuit-pattern inspection apparatus, and a circuit-pattern inspection method, which are capable of making a highly sensitive defect judgment of an area including the most circumferential portion of a memory mat of a semiconductor chip formed on a semiconductor wafer.In order to achieve the above object, the present invention includes the steps of: on the basis of the repeatability of a circuit pattern of a die formed on a semiconductor wafer, distributing data of an image to a plurality of image memories and storing the data therein; comparing the pieces of data of the image stored in the image memories with a combined reference image to generate a difference image, the combined reference image being combined by adding and averaging in a direction of the repeatability; judging that an area in which a difference value of the difference image is larger than a predetermined threshold value is a defect; and integrating and outputting a plurality of pieces of defect information, the defect information including image data judged to be defective and coordinates indicative of the defect.
    • 这里公开了一种电路图案检查装置和电路图案检查方法,其能够对形成在半导体晶片上的半导体芯片的存储器垫的最周围部分的区域进行高灵敏度的缺陷判断。 为了实现上述目的,本发明包括以下步骤:基于在半导体晶片上形成的管芯的电路图案的重复性,将图像的数据分配给多个图像存储器并存储数据 其中 将存储在图像存储器中的图像的数据与组合的参考图像进行比较以生成差分图像,通过在重复性的方向上相加和求平均来组合参考图像; 判断差分图像的差值大于预定阈值的区域是缺陷; 并且整合并输出多条缺陷信息,所述缺陷信息包括判断为缺陷的图像数据和指示缺陷的坐标。
    • 77. 发明申请
    • SCANNING ELECTRON MICROSCOPE AND METHOD FOR PROCESSING AN IMAGE OBTAINED BY THE SCANNING ELECTRON MICROSCOPE
    • 扫描电子显微镜和扫描电子显微镜获得的图像的处理方法
    • US20080251719A1
    • 2008-10-16
    • US12016290
    • 2008-01-18
    • Kenji NakahiraToshifumi HondaAtsushi Miyamoto
    • Kenji NakahiraToshifumi HondaAtsushi Miyamoto
    • G01N23/00
    • G01N23/225G01N2223/401
    • In the case where a specimen is imaged by a scanning electron microscope, it is intended to acquire an image of a high quality having a noise component reduced, thereby to improve the precision of an image processing. The intensity distribution of a beam is calculated on the basis of an imaging condition or specimen information, and an image restoration is performed by using a resolving power deterioration factor other than the beam intensity distribution as a target of a deterioration mode, so that a high resolving power image can be acquired under various conditions. In the scanning electron microscope for semiconductor inspections and semiconductor measurements, the restored image is used for pattern size measurement, defect detections, defect classifications and so on, so that the measurements can be improved in precision and so that the defect detections and classifications can be made high precise.
    • 在通过扫描电子显微镜对样本进行成像的情况下,旨在获取具有降低噪声成分的高质量图像,从而提高图像处理的精度。 基于成像条件或样本信息计算光束的强度分布,并且通过使用除了光束强度分布之外的分辨率劣化因子作为劣化模式的目标来执行图像恢复,使得高 可以在各种条件下获得分辨率的图像。 在用于半导体检查和半导体测量的扫描电子显微镜中,恢复的图像用于图案尺寸测量,缺陷检测,缺陷分类等,从而可以提高测量精度,从而可以使缺陷检测和分类 做出高精度。
    • 78. 发明申请
    • SEM-TYPE REVIEWING APPARATUS AND A METHOD FOR REVIEWING DEFECTS USING THE SAME
    • SEM型检查装置和使用该方法检查缺陷的方法
    • US20080067371A1
    • 2008-03-20
    • US11747253
    • 2007-05-11
    • Masaki KuriharaToshifumi HondaRyo Nakagaki
    • Masaki KuriharaToshifumi HondaRyo Nakagaki
    • G01N23/00
    • G01N21/9501G01N2223/053G01N2223/6116
    • In order to achieve high throughput in a SEM-type defect-reviewing apparatus and method for automatically acquiring images of review defects present on samples, including: a cell comparison step subdivided into the steps of (a) providing a defect detection success ratio or defect detection success map due to at least a cell comparison scheme for each wafer or each chip, (b) selecting a review sequence of either the cell comparison scheme or a die comparison scheme on the basis of the provided defect detection success ratio or defect detection success map, (c) if the cell comparison scheme is selected, judging whether detection of the review defect is possible by executing the cell comparison scheme; and a die comparison step in which die comparison is performed if the judgment result indicates that the detection of the review defect is impossible, or if the die comparison scheme is selected in the selection step.
    • 为了在SEM型缺陷检查装置中实现高通量,以及用于自动获取样品上存在的检查缺陷的图像的方法,包括:细胞比较步骤,其细分为以下步骤:(a)提供缺陷检测成功率或缺陷 检测成功图由于至少每个晶片或每个芯片的单元比较方案,(b)基于提供的缺陷检测成功率或缺陷检测成功来选择单元比较方案或管芯比较方案的检查序列 映射,(c)如果选择了小区比较方案,则通过执行小区比较方案判断检查缺陷的检测是否可能; 以及如果判断结果指示检查缺陷的检测不可能执行管芯比较,或者在选择步骤中选择管芯比较方案的管芯比较步骤。
    • 80. 发明申请
    • Scanning electron microscope and system for inspecting semiconductor device
    • 扫描电子显微镜和半导体器件检测系统
    • US20060108525A1
    • 2006-05-25
    • US11268568
    • 2005-11-08
    • Ryo NakagakiToshifumi Honda
    • Ryo NakagakiToshifumi Honda
    • G21K7/00
    • H01J37/222G03F7/7065H01J37/265H01J37/28H01J2237/24592H01J2237/2817
    • A scanning electron microscope has an electron source for illuminating a primary electron beam on a specimen wafer, an accelerating electrode, a condenser lens, a deflector, an objective lens, a detector for acquiring a digital image by sampling a signal of emissive electrons generated from the specimen wafer, a digitizing means, an image memory for storing, displaying or processing the acquired digital image, an input/output unit, an image creation unit and an image processor. The scanning electron microscope is provided with a sampling unit for sampling the emissive electron signal at intervals each smaller than the pixel size of the digital image to be stored, displayed or processed and an image creation process means for enlarging the pixel size on the basis of the sampled emissive electron signal to create a digital image.
    • 扫描电子显微镜具有用于照射样品晶片上的一次电子束的电子源,加速电极,聚光透镜,偏转器,物镜,用于通过对从...产生的发射电子的信号进行采样来获取数字图像的检测器 样本晶片,数字化装置,用于存储,显示或处理所获取的数字图像的图像存储器,输入/输出单元,图像创建单元和图像处理器。 该扫描电子显微镜设置有采样单元,用于以比要存储,显示或处理的数字图像的像素大小更小的间隔对发射电子信号进行采样,以及图像创建处理装置,用于基于 采样发射电子信号以产生数字图像。