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    • 2. 发明授权
    • Method for inspecting pattern defect and device for realizing the same
    • 检查图案缺陷的方法及其实现方法
    • US08748795B2
    • 2014-06-10
    • US12329274
    • 2008-12-05
    • Yuta UranoHiroyuki NakanoShunji MaedaSachio Uto
    • Yuta UranoHiroyuki NakanoShunji MaedaSachio Uto
    • G01N21/00
    • G01N21/9501G01N21/47G01N21/4788G01N21/94G01N21/956
    • When using a CCD sensor as a photo-detector in a device for inspecting foreign matters and defects, it has a problem of causing electric noise while converting the signal charge, produced inside by photoelectric conversion, into voltage and reading it. Therefore, the weak detected signal obtained by detecting reflected and scattered light from small foreign matters and defects is buried in the electric noise, which has been an obstacle in detecting small foreign matters and defects. In order to solve the above problem, according to the present invention, an electron multiplying CCD sensor is used as a photo-detector. The electron multiplying CCD sensor is capable of enlarging signals brought about by inputted light relatively to the electric noise by multiplying the electrons produced through photoelectric conversion and reading them. Accordingly, compared to a conventional CCD sensor, it can detect weaker light and, therefore, smaller foreign matters and defects.
    • 当在用于检查异物和缺陷的装置中使用CCD传感器作为光检测器时,存在在将由光电转换产生的信号电荷转换成电压并读取的同时将电噪声引起的问题。 因此,通过检测来自小异物和缺陷的反射和散射光获得的弱检测信号被埋在电噪声中,这是检测小异物和缺陷的障碍。 为了解决上述问题,根据本发明,使用电子倍增CCD传感器作为光检测器。 电子倍增CCD传感器能够通过将通过光电转换产生的电子与其进行读取而相对于电噪声放大由输入的光产生的信号。 因此,与常规CCD传感器相比,它可以检测较弱的光,因此可以检测较小的异物和缺陷。
    • 3. 发明申请
    • DEFECT INSPECTION METHOD, LOW LIGHT DETECTING METHOD AND LOW LIGHT DETECTOR
    • 缺陷检测方法,低光检测方法和低光检测器
    • US20130321798A1
    • 2013-12-05
    • US13882542
    • 2011-10-14
    • Yuta UranoToshifumi HondaTakahiro Jingu
    • Yuta UranoToshifumi HondaTakahiro Jingu
    • G01N21/88
    • G01N21/8806G01N21/4795G01N21/8851G01N21/9501G01N21/956G01N2021/8835
    • A defect inspection method includes an illumination light adjustment step of adjusting light emitted from a light source, an illumination intensity distribution control step of forming light flux obtained in the illumination light adjustment step into desired illumination intensity distribution, a sample scanning step of displacing a sample in a direction substantially perpendicular to a longitudinal direction of the illumination intensity distribution, a scattered light detection step of counting the number of photons of scattered light emitted from plural small areas in an area irradiated with illumination light to produce plural scattered light detection signals corresponding to the plural small areas, a defect judgment step of processing the plural scattered light detection signals to judge presence of a defect, a defect dimension judgment step of judging dimensions of the defect in each place in which the defect is judged to be present and a display step of displaying a position on sample surface and the dimensions of the defect in each place in which the defect is judged to be present.
    • 缺陷检查方法包括调整从光源发出的光的照明光调节步骤,将在所述照明光调节步骤中获得的光束形成为期望的照度分布的照度分布控制步骤,将样品置换的样本扫描步骤 在与照明强度分布的长度方向大致正交的方向上,对从照明光照射的区域的多个小区域发射的散射光的光数进行计数,生成与多个散射光检测信号对应的散射光检测信号的散射光检测步骤 多个小区域,处理多个散射光检测信号以判断缺陷的存在的缺陷判断步骤,判断存在缺陷的每个位置的缺陷的尺寸的缺陷维度判断步骤和显示 显示位置的步骤o n样品表面和缺陷的每个位置的缺陷的尺寸。
    • 4. 发明申请
    • DEFECT TESTING METHOD AND DEVICE FOR DEFECT TESTING
    • 缺陷测试方法和缺陷测试装置
    • US20130293880A1
    • 2013-11-07
    • US13882547
    • 2011-11-01
    • Toshifumi HondaYuta UranoYukihiro Shibata
    • Toshifumi HondaYuta UranoYukihiro Shibata
    • G01N21/95
    • G01N21/9501
    • In a defect inspection method and an apparatus of the same, for enabling to conduct an inspection of fine defects without applying thermal damages on a sample, the following steps are conducted: mounting a sample on a rotatable table to rotate; irradiating a pulse laser emitting from a laser light source upon the sample rotating; detecting a reflected light from the sample, upon which the pulse laser is irradiated; detecting the reflected light from the sample detected; and detecting a defect on the sample through processing of a signal obtained through the detection, wherein irradiation of the pulse laser emitting from the laser light source upon the sample rotating is conducted by dividing the one pulse emitted from the laser light source into plural numbers of pulses, and irradiating each of the divided pulse lasers upon each of separate positions on the sample, respectively.
    • 在缺陷检查方法及其装置中,为了能够在对样品施加热损伤的情况下进行细小缺陷的检查,进行以下步骤:将样品安装在旋转台上旋转; 照射从激光光源发射的脉冲激光器对样品旋转; 检测来自所述脉冲激光器的样品的反射光; 检测检测到的样品的反射光; 并且通过处理通过检测获得的信号来检测样本上的缺陷,其中通过将从激光光源发射的一个脉冲除以多个数量来进行从样品旋转时从激光源发射的脉冲激光的照射 脉冲,并且分别在样品上的每个分离位置上照射每个分割的脉冲激光器。
    • 6. 发明授权
    • Inspection method and inspection device
    • 检验方法和检验装置
    • US07777876B2
    • 2010-08-17
    • US12167570
    • 2008-07-03
    • Izuo HoraiHirokazu KoyabuYuta UranoTakahiro Jingu
    • Izuo HoraiHirokazu KoyabuYuta UranoTakahiro Jingu
    • G01N21/00
    • G01N21/9501G01N21/65G01N21/9505G01N2021/4711G01N2021/473G01N2021/8861G01N2021/8864
    • An inspection method and an inspection device, or apparatus each capable of conducting composition analysis of a defect detected by elastic or stokes scattered light, an inspection surface or defect on the surface of the inspection surface, or a defect on the surface of the inspection object and its internal composition. A surface inspection method for optically detecting elastic or stokes scattering or inelastic or anti-stokes scattered light from inside the surface of the inspection object, for detecting existence of defects of the inspection object and features of the defects, for detecting positions of the detected defects on the surface of the inspection object, classifying and analyzing the detected defects in accordance with their features on the basis of the positions of the defects and the features of the defects or the classification result of the defects.
    • 检查方法和检查装置或装置,其能够对由检查表面的弹性或sto kes散射光,检查面或缺陷检测到的缺陷或检​​查对象的表面上的缺陷进行组成分析 及其内在组成。 一种表面检查方法,用于光学检测来自检查对象的表面内的弹性或斯托克斯散射或非弹性或反射散射光,用于检测检查对象的缺陷的存在和缺陷的特征,用于检测检测到的缺陷的位置 在检查对象的表面上,根据缺陷的位置和缺陷的特征或缺陷的分类结果,根据其特征对检测到的缺陷进行分类和分析。
    • 8. 发明授权
    • Method and apparatus for detecting defects
    • 检测缺陷的方法和装置
    • US07528942B2
    • 2009-05-05
    • US11472426
    • 2006-06-22
    • Hiroyuki NakanoToshihiko NakataSachio UtoAkira HamamatsuShunji MaedaYuta Urano
    • Hiroyuki NakanoToshihiko NakataSachio UtoAkira HamamatsuShunji MaedaYuta Urano
    • G01N21/88
    • G01N21/956G01N21/47G01N21/94G01N21/9501G01N2021/8822
    • A method and apparatus for detecting defects are provided for detecting harmful defects or foreign matter with high sensitivity on an object to be inspected with a transparent film, such as an oxide film, by reducing noise due to a circuit pattern. The apparatus for detecting defects includes a stage part on which a substrate specimen is put and which is arbitrarily movable in each of the X-Y-Z-θ directions, an illumination system for irradiating the circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. Furthermore, a spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector from the specimen is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip. If these signals are not identical to each other, the foreign matter is determined to exist on the specimen in detection.
    • 提供一种用于检测缺陷的方法和装置,用于通过减少由于电路图案引起的噪声来检测对诸如氧化物膜的透明膜在内的待检查物体的高灵敏度的有害缺陷或异物。 用于检测缺陷的装置包括:载置基板试样的载台部分,其可以在XYZ-θ方向中任意移动;照射系统,用于利用来自倾斜方向的光照射电路图案;以及图像形成 光学系统,用于从上下方向在检测器上形成照射的检测区域的图像。 利用这种布置,收集通过照明系统的照明在电路图案上产生的衍射光和散射光。 此外,在傅立叶变换表面上提供空间滤波器,用于阻挡来自电路图形的线性部分的衍射光。 由检测器从样本接收的散射和反射光被转换成电信号。 将一个芯片的转换电信号与另一个芯片的转换电信号进行比较。 如果这些信号彼此不相同,则检测到异物被确定为存在于样品上。