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    • 72. 发明申请
    • Method and system of coating polymer solution on surface of a substrate
    • 在基体表面涂覆聚合物溶液的方法和系统
    • US20050148204A1
    • 2005-07-07
    • US10748370
    • 2003-12-29
    • Andrew Nguyen
    • Andrew Nguyen
    • G03F7/16H01L21/31H01L21/469
    • G03F7/162
    • A method and system of coating a polymer solution on a substrate such as a semiconductor wafer. The method includes providing a substrate. Dispensing a polymer solution onto the surface of the substrate using a pump. The pump is connected in-line with a buffer tank and a polymer solution source such that the pump draws the polymer solution from the polymer solution source and the buffer tank in a continuous fluid path to dispense the polymer solution. The polymer solution source is connected to a pressure source capable of causing a transfer of the polymer solution from the polymer solution source into the buffer tank. The buffer tank to maintain a relatively constant level of polymer solution.
    • 一种在诸如半导体晶片的衬底上涂覆聚合物溶液的方法和系统。 该方法包括提供基板。 使用泵将聚合物溶液分配到基材的表面上。 泵与缓冲罐和聚合物溶液源成直线连接,使得泵以聚合物溶液源和缓冲罐在连续的流体路径中抽取聚合物溶液以分配聚合物溶液。 聚合物溶液源连接到能够将聚合物溶液从聚合物溶液源转移到缓冲罐中的压力源。 缓冲罐保持相对恒定的聚合物溶液水平。
    • 73. 发明申请
    • Method and system for coating polymer solution on a substrate in a solvent saturated chamber
    • 在溶剂饱和室中在基材上涂覆聚合物溶液的方法和系统
    • US20050147748A1
    • 2005-07-07
    • US10748457
    • 2003-12-29
    • Andrew Nguyen
    • Andrew Nguyen
    • B05D1/00B05D3/04G03F7/16H01L21/00B05D3/12B05C11/02
    • H01L21/6715B05D1/005B05D3/0486G03F7/162
    • A method and apparatus of coating a polymer solution on a substrate such as a semiconductor wafer. The apparatus includes a coating chamber having a rotatable chuck to support a substrate to be coated with a polymer solution. A dispenser to dispense the polymer solution over the substrate extends into the coating chamber. A vapor distributor having a solvent vapor generator communicable with the coating chamber is included to cause a solvent to be transformed into a solvent vapor. A carrier gas is mixed with the solvent vapor to form a carrier-solvent vapor mixture. The carrier-solvent vapor mixture is flown into the coating chamber to saturate the coating chamber. A solvent remover communicable with the coating chamber is included to remove excess solvent that does not get transformed into the solvent vapor to prevent the excess solvent from dropping on the substrate.
    • 一种在诸如半导体晶片的衬底上涂覆聚合物溶液的方法和设备。 该设备包括具有可旋转卡盘的涂覆室,以支撑待涂覆聚合物溶液的基材。 将聚合物溶液分配在基材上的分配器延伸到涂布室中。 包括具有与涂覆室可连通的溶剂蒸汽发生器的蒸气分配器,以使溶剂转化为溶剂蒸汽。 将载气与溶剂蒸气混合以形成载体 - 溶剂蒸气混合物。 载体 - 溶剂蒸气混合物流入涂覆室以使涂覆室饱和。 包括可与涂布室通信的溶剂去除剂以除去不被转化为溶剂蒸气的多余溶剂,以防止过量的溶剂滴落在基材上。
    • 74. 发明授权
    • Externally excited torroidal plasma source with a gas distribution plate
    • 外部激发的环形等离子体源与气体分配板
    • US06551446B1
    • 2003-04-22
    • US09637174
    • 2000-08-11
    • Hiroji HanawaYan YeKenneth S. CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • Hiroji HanawaYan YeKenneth S. CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • C23C1600
    • H01J37/321H01J37/32082
    • A plasma reactor for processing a workpiece includes a vacuum enclosure, including a wall, defining a vacuum chamber, the vacuum chamber having a main chamber portion on one side of the wall and a plenum on another side of the wall, the plenum communicating with the chamber portion through at least one opening in the wall, a workpiece support within the main chamber portion and facing the wall. A gas distribution plate is adjacent the wall and faces the workpiece support and is coupled to a reactive process gas supply for injecting reactive process gases directly into a process region adjacent the workpiece support. A gas injection port at the plenum is coupled to a diluent gas supply for injecting diluent gases into the plenum. A coil antenna adapted to accept RF power is inductively coupled to the interior of said plenum, and is capable of maintaining a plasma in a reentrant path through the plenum and across the process region.
    • 用于处理工件的等离子体反应器包括真空封壳,其包括限定真空室的壁,所述真空室具有在壁的一侧上的主室部分和在壁的另一侧上的增压室, 室部分通过壁中的至少一个开口,主室部分内的工件支撑件并面向壁。 气体分配板邻近壁并且面向工件支撑件并且与反应性工艺气体供应件相连接,用于将反应性工艺气体直接注入到与工件支撑件相邻的工艺区域中。 增压室处的气体注入口与稀释气体供应装置连接,用于将稀释气体注入气室。 适于接收RF功率的线圈天线感应耦合到所述增压室的内部,并且能够将等离子体维持在通过充气室并且跨越过程区域的折返路径中。
    • 75. 发明授权
    • Externally excited torroidal plasma source using a gas distribution plate
    • 使用气体分配板的外部激发的环形等离子体源
    • US06453842B1
    • 2002-09-24
    • US09636700
    • 2000-08-11
    • Hiroji HanawaYan YeKenneth S CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • Hiroji HanawaYan YeKenneth S CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • C23C1600
    • H01J37/321H01J37/32082
    • A plasma chamber defining an evacuated interior environment for processing a substrate includes a substrate support, an apertured gas distribution plate in spaced facing relationship to the substrate support, and adapted to flow process gases into the chamber interior environment adjacent the substrate support, the gas distribution plate and substrate support defining a substrate processing region therebetween, a hollow reentrant conduit having respective ends opening into the substrate processing region on opposite sides of the gas distribution plate, with the interior of said conduit sharing the interior environment. The conduit is adapted to accept irradiation of processing gases within the conduit to sustain a plasma in a path extending around the conduit interior and across the substrate processing region within the chamber interior environment.
    • 限定用于处理衬底的抽空的内部环境的等离子体室包括衬底支撑件,与衬底支撑件间隔开的面对关系的多孔气体分配板,并且适于将工艺气体流入邻近衬底支撑件的腔室内部环境中,气体分布 板和基板支撑件,其间限定了其间的基板加工区域,中空折痕导管,其相应的端部通向气体分配板的相对侧上的基板处理区域,所述导管的内部共享内部环境。 导管适于接受管道内的处理气体的照射,以在围绕导管内部延伸并且在腔室内部环境内的衬底处理区域上延伸的路径中维持等离子体。
    • 80. 发明授权
    • Methods of attaching a module on wafer substrate
    • 在晶片衬底上安装模块的方法
    • US09514970B2
    • 2016-12-06
    • US13797112
    • 2013-03-12
    • Vaibhaw VishalAndrew NguyenKristopher K. HearnMei Sun
    • Vaibhaw VishalAndrew NguyenKristopher K. HearnMei Sun
    • G01K1/12H01L21/67
    • H01L21/67248Y10T29/53
    • Aspects of the present disclosure describe an attachment device for mounting a module to a substrate comprises a module leg with two ends and a module foot. One end of the module leg is configured to be attached to a bottom surface of the module and the other end of the module leg is configured to be attached to the module foot. At least a portion of the module foot is configured to be attached to the substrate. Also a portion of a surface area of the module foot is configured to be exposed outside of an area covered by the module. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    • 本公开的方面描述了用于将模块安装到基板的附接装置,包括具有两端的模块腿和模块脚。 模块腿的一端构造成附接到模块的底表面,并且模块腿的另一端构造成附接到模块脚。 模块脚的至少一部分被配置成附接到基底。 模块脚的表面区域的一部分也被配置为暴露在由模块覆盖的区域的外部。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开的主题。 提交它的理解是,它不会用于解释或限制权利要求的范围或含义。