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1. 发明授权

US08681493B2 Heat shield module for substrate-like metrology device 有权
标题翻译：用于基板状测量装置的隔热模块
公开(公告)号：US08681493B2
公开(公告)日：2014-03-25
申请号：US13104874
申请日：2011-05-10
申请人： Vaibhaw Vishal , Mei Sun
发明人： Vaibhaw Vishal , Mei Sun
IPC分类号： H05K7/20
CPC分类号： H01L21/67253 , H01L21/67115 , H01L21/67248 , H01L2924/0002 , Y10T428/249923 , H01L2924/00
摘要： A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.
摘要翻译：隔热罩模块包括由高热材料制成的顶部和底部。顶部和底部彼此附接并形成具有开口尺寸的开口的外壳，该开口的尺寸适于容纳电子部件封装，而在组件与顶部和底部之间没有中间绝缘材料。一个或多个腿部安装到顶部或底部。腿构造成将外壳附接到基底并且在底部的底表面和基底的顶表面之间形成间隙。

2. 发明申请

US20120287574A1 HEAT SHIELD MODULE FOR SUBSTRATE-LIKE METROLOGY DEVICE 有权
标题翻译：用于基板式仪器的热屏蔽模块
公开(公告)号：US20120287574A1
公开(公告)日：2012-11-15
申请号：US13104874
申请日：2011-05-10
申请人： Vaibhaw Vishal , Mei Sun
发明人： Vaibhaw Vishal , Mei Sun
IPC分类号： H05K7/20 , B32B7/08
CPC分类号： H01L21/67253 , H01L21/67115 , H01L21/67248 , H01L2924/0002 , Y10T428/249923 , H01L2924/00
摘要： A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.
摘要翻译：隔热罩模块包括由高热材料制成的顶部和底部。顶部和底部彼此附接并形成具有开口尺寸的开口的外壳，该开口的尺寸适于容纳电子部件封装，而在组件与顶部和底部之间没有中间的绝缘材料。一个或多个腿部安装到顶部或底部。腿构造成将外壳附接到基底并且在底部的底表面和基底的顶表面之间形成间隙。

3. 发明授权

US09514970B2 Methods of attaching a module on wafer substrate 有权
标题翻译：在晶片衬底上安装模块的方法
公开(公告)号：US09514970B2
公开(公告)日：2016-12-06
申请号：US13797112
申请日：2013-03-12
申请人： Vaibhaw Vishal , Andrew Nguyen , Kristopher K. Hearn , Mei Sun
发明人： Vaibhaw Vishal , Andrew Nguyen , Kristopher K. Hearn , Mei Sun
IPC分类号： G01K1/12 , H01L21/67
CPC分类号： H01L21/67248 , Y10T29/53
摘要： Aspects of the present disclosure describe an attachment device for mounting a module to a substrate comprises a module leg with two ends and a module foot. One end of the module leg is configured to be attached to a bottom surface of the module and the other end of the module leg is configured to be attached to the module foot. At least a portion of the module foot is configured to be attached to the substrate. Also a portion of a surface area of the module foot is configured to be exposed outside of an area covered by the module. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：本公开的方面描述了用于将模块安装到基板的附接装置，包括具有两端的模块腿和模块脚。模块腿的一端构造成附接到模块的底表面，并且模块腿的另一端构造成附接到模块脚。模块脚的至少一部分被配置成附接到基底。模块脚的表面区域的一部分也被配置为暴露在由模块覆盖的区域的外部。要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开的主题。提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

4. 发明授权

US09134186B2 Process condition measuring device (PCMD) and method for measuring process conditions in a workpiece processing tool configured to process production workpieces 有权
标题翻译：工艺条件测量装置（PCMD）和用于测量工件处理工具中的工艺条件的方法，该工件处理工具被配置为处理生产工件
公开(公告)号：US09134186B2
公开(公告)日：2015-09-15
申请号：US13020770
申请日：2011-02-03
申请人： Mei Sun , Farhat Quli , Earl Jensen , Paul Arleo , Vaibhaw Vishal
发明人： Mei Sun , Farhat Quli , Earl Jensen , Paul Arleo , Vaibhaw Vishal
IPC分类号： G01K17/00 , G01K1/16 , H01L21/67
CPC分类号： G01K17/00 , H01L21/67248
摘要： A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.
摘要翻译：工艺条件测量装置（PCMD）可以包括第一和第二衬底部件。一个或多个温度传感器嵌入每个基板部件内。将第一和第二基板部件夹在一起，使得第二基板部件中的每个温度传感器与位于第一基板部件中的对应的温度传感器串联对准。或者，第一和第二温度传感器可以在同一衬底中平行定位。当PCMD在工件处理工具中经受工艺条件时，可以在成对的相应温度传感器之间测量温差。工具中的工艺条件可以根据温差计算。

5. 发明申请

US20140202267A1 METHODS OF ATTACHING A MODULE ON WAFER SUBSTRATE 有权
标题翻译：连接晶片上的模块的方法
公开(公告)号：US20140202267A1
公开(公告)日：2014-07-24
申请号：US13797112
申请日：2013-03-12
申请人： Vaibhaw Vishal , Andrew Nguyen , Kristopher K. Hearn , Mei Sun
发明人： Vaibhaw Vishal , Andrew Nguyen , Kristopher K. Hearn , Mei Sun
IPC分类号： H05K7/00
CPC分类号： H01L21/67248 , Y10T29/53
摘要： Aspects of the present disclosure describe an attachment device for mounting a module to a substrate comprises a module leg with two ends and a module foot. One end of the module leg is configured to be attached to a bottom surface of the module and the other end of the module leg is configured to be attached to the module foot. At least a portion of the module foot is configured to be attached to the substrate. Also a portion of a surface area of the module foot is configured to be exposed outside of an area covered by the module. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译：本公开的方面描述了用于将模块安装到基板的附接装置，包括具有两端的模块腿和模块脚。模块腿的一端构造成附接到模块的底表面，并且模块腿的另一端构造成附接到模块脚。模块脚的至少一部分被配置成附接到基底。模块脚的表面区域的一部分也被配置为暴露在由模块覆盖的区域的外部。要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开的主题。提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

6. 发明申请

US20120203495A1 PROCESS CONDITION MEASURING DEVICE (PCMD) AND METHOD FOR MEASURING PROCESS CONDITIONS IN A WORKPIECE PROCESSING TOOL CONFIGURED TO PROCESS PRODUCTION WORKPIECES 有权
标题翻译：工艺条件测量装置（PCMD）和方法，用于在配置加工生产工作的工件加工工具中测量工艺条件
公开(公告)号：US20120203495A1
公开(公告)日：2012-08-09
申请号：US13020770
申请日：2011-02-03
申请人： Mei Sun , Farhat Quli , Earl Jensen , Paul Arleo , Vaibhaw Vishal
发明人： Mei Sun , Farhat Quli , Earl Jensen , Paul Arleo , Vaibhaw Vishal
IPC分类号： G01K17/00 , G06F15/00
CPC分类号： G01K17/00 , H01L21/67248
摘要： A process condition measuring device (PCMD) may include first and second substrate components. One or more temperature sensors are embedded within each substrate component. The first and second substrate components are sandwiched together such that each temperature sensor in the second substrate component is aligned in tandem with a corresponding temperature sensor located in the first substrate component. Alternatively first and second temperature sensors may be positioned in parallel in the same substrate. Temperature differences may be measured between pairs of corresponding temperature sensors when the PCMD is subjected to process conditions in a workpiece processing tool. Process conditions in the tool may be calculated from the temperature differences.
摘要翻译：工艺条件测量装置（PCMD）可以包括第一和第二衬底部件。一个或多个温度传感器嵌入每个基板部件内。将第一和第二基板部件夹在一起，使得第二基板部件中的每个温度传感器与位于第一基板部件中的对应的温度传感器串联对准。或者，第一和第二温度传感器可以在同一衬底中平行定位。当PCMD在工件处理工具中经受工艺条件时，可以在成对的相应温度传感器之间测量温差。工具中的工艺条件可以根据温差计算。

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