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    • 3. 发明授权
    • Methods of attaching a module on wafer substrate
    • 在晶片衬底上安装模块的方法
    • US09514970B2
    • 2016-12-06
    • US13797112
    • 2013-03-12
    • Vaibhaw VishalAndrew NguyenKristopher K. HearnMei Sun
    • Vaibhaw VishalAndrew NguyenKristopher K. HearnMei Sun
    • G01K1/12H01L21/67
    • H01L21/67248Y10T29/53
    • Aspects of the present disclosure describe an attachment device for mounting a module to a substrate comprises a module leg with two ends and a module foot. One end of the module leg is configured to be attached to a bottom surface of the module and the other end of the module leg is configured to be attached to the module foot. At least a portion of the module foot is configured to be attached to the substrate. Also a portion of a surface area of the module foot is configured to be exposed outside of an area covered by the module. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    • 本公开的方面描述了用于将模块安装到基板的附接装置,包括具有两端的模块腿和模块脚。 模块腿的一端构造成附接到模块的底表面,并且模块腿的另一端构造成附接到模块脚。 模块脚的至少一部分被配置成附接到基底。 模块脚的表面区域的一部分也被配置为暴露在由模块覆盖的区域的外部。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开的主题。 提交它的理解是,它不会用于解释或限制权利要求的范围或含义。
    • 5. 发明申请
    • METHODS OF ATTACHING A MODULE ON WAFER SUBSTRATE
    • 连接晶片上的模块的方法
    • US20140202267A1
    • 2014-07-24
    • US13797112
    • 2013-03-12
    • Vaibhaw VishalAndrew NguyenKristopher K. HearnMei Sun
    • Vaibhaw VishalAndrew NguyenKristopher K. HearnMei Sun
    • H05K7/00
    • H01L21/67248Y10T29/53
    • Aspects of the present disclosure describe an attachment device for mounting a module to a substrate comprises a module leg with two ends and a module foot. One end of the module leg is configured to be attached to a bottom surface of the module and the other end of the module leg is configured to be attached to the module foot. At least a portion of the module foot is configured to be attached to the substrate. Also a portion of a surface area of the module foot is configured to be exposed outside of an area covered by the module. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    • 本公开的方面描述了用于将模块安装到基板的附接装置,包括具有两端的模块腿和模块脚。 模块腿的一端构造成附接到模块的底表面,并且模块腿的另一端构造成附接到模块脚。 模块脚的至少一部分被配置成附接到基底。 模块脚的表面区域的一部分也被配置为暴露在由模块覆盖的区域的外部。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开的主题。 提交它的理解是,它不会用于解释或限制权利要求的范围或含义。