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    • 1. 发明授权
    • Externally excited torroidal plasma source
    • 外部激发环形等离子体源
    • US07094316B1
    • 2006-08-22
    • US09638075
    • 2000-08-11
    • Hiroji HanawaKenneth S CollinsKartik RamaswamyAndrew NguyenTsutomu TanakaYan Ye
    • Hiroji HanawaKenneth S CollinsKartik RamaswamyAndrew NguyenTsutomu TanakaYan Ye
    • C23C16/00C23F1/02
    • H01J37/321H01J37/32082
    • A plasma reactor for processing a workpiece, including an enclosure defining a vacuum chamber, a workpiece support within the enclosure facing an overlying portion of the enclosure, the enclosure having at least first and second openings therethrough near generally opposite sides of the workpiece support. At least one hollow conduit is connected to the first and second openings. A closed torroidal path is provided through the conduit and extending between the first and second openings across the wafer surface. A process gas supply is coupled to the interior of the chamber for supplying process gas to the torroidal path. A coil antenna is coupled to an RF power source and inductively, coupled to the interior of the hollow conduit and capable of maintaining a plasma in the torroidal path.
    • 一种用于处理工件的等离子体反应器,包括限定真空室的外壳,位于所述外壳内的工件支撑件面向所述外壳的上部,所述外壳具有穿过所述工件支撑件的大致相对侧的至少第一和第二开口。 至少一个中空管道连接到第一和第二开口。 通过导管提供封闭的环形路径,并且在第一和第二开口之间跨越晶片表面延伸。 工艺气体供应件连接到室的内部,用于将工艺气体供应到环形路径。 线圈天线​​耦合到RF电源并且感应地耦合到中空导管的内部并且能够将等离子体保持在环形路径中。
    • 2. 发明授权
    • Externally excited torroidal plasma source with a gas distribution plate
    • 外部激发的环形等离子体源与气体分配板
    • US06551446B1
    • 2003-04-22
    • US09637174
    • 2000-08-11
    • Hiroji HanawaYan YeKenneth S. CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • Hiroji HanawaYan YeKenneth S. CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • C23C1600
    • H01J37/321H01J37/32082
    • A plasma reactor for processing a workpiece includes a vacuum enclosure, including a wall, defining a vacuum chamber, the vacuum chamber having a main chamber portion on one side of the wall and a plenum on another side of the wall, the plenum communicating with the chamber portion through at least one opening in the wall, a workpiece support within the main chamber portion and facing the wall. A gas distribution plate is adjacent the wall and faces the workpiece support and is coupled to a reactive process gas supply for injecting reactive process gases directly into a process region adjacent the workpiece support. A gas injection port at the plenum is coupled to a diluent gas supply for injecting diluent gases into the plenum. A coil antenna adapted to accept RF power is inductively coupled to the interior of said plenum, and is capable of maintaining a plasma in a reentrant path through the plenum and across the process region.
    • 用于处理工件的等离子体反应器包括真空封壳,其包括限定真空室的壁,所述真空室具有在壁的一侧上的主室部分和在壁的另一侧上的增压室, 室部分通过壁中的至少一个开口,主室部分内的工件支撑件并面向壁。 气体分配板邻近壁并且面向工件支撑件并且与反应性工艺气体供应件相连接,用于将反应性工艺气体直接注入到与工件支撑件相邻的工艺区域中。 增压室处的气体注入口与稀释气体供应装置连接,用于将稀释气体注入气室。 适于接收RF功率的线圈天线感应耦合到所述增压室的内部,并且能够将等离子体维持在通过充气室并且跨越过程区域的折返路径中。
    • 3. 发明授权
    • Externally excited torroidal plasma source using a gas distribution plate
    • 使用气体分配板的外部激发的环形等离子体源
    • US06453842B1
    • 2002-09-24
    • US09636700
    • 2000-08-11
    • Hiroji HanawaYan YeKenneth S CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • Hiroji HanawaYan YeKenneth S CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • C23C1600
    • H01J37/321H01J37/32082
    • A plasma chamber defining an evacuated interior environment for processing a substrate includes a substrate support, an apertured gas distribution plate in spaced facing relationship to the substrate support, and adapted to flow process gases into the chamber interior environment adjacent the substrate support, the gas distribution plate and substrate support defining a substrate processing region therebetween, a hollow reentrant conduit having respective ends opening into the substrate processing region on opposite sides of the gas distribution plate, with the interior of said conduit sharing the interior environment. The conduit is adapted to accept irradiation of processing gases within the conduit to sustain a plasma in a path extending around the conduit interior and across the substrate processing region within the chamber interior environment.
    • 限定用于处理衬底的抽空的内部环境的等离子体室包括衬底支撑件,与衬底支撑件间隔开的面对关系的多孔气体分配板,并且适于将工艺气体流入邻近衬底支撑件的腔室内部环境中,气体分布 板和基板支撑件,其间限定了其间的基板加工区域,中空折痕导管,其相应的端部通向气体分配板的相对侧上的基板处理区域,所述导管的内部共享内部环境。 导管适于接受管道内的处理气体的照射,以在围绕导管内部延伸并且在腔室内部环境内的衬底处理区域上延伸的路径中维持等离子体。
    • 6. 发明授权
    • Externally excited multiple torroidal plasma source
    • 外激发多环形等离子体源
    • US06494986B1
    • 2002-12-17
    • US09636435
    • 2000-08-11
    • Hiroji HanawaYan YeKenneth S CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • Hiroji HanawaYan YeKenneth S CollinsKartik RamaswamyAndrew NguyenTsutomu Tanaka
    • H05H100
    • H01J37/321H01J37/32082
    • A plasma reactor for processing a workpiece, including an enclosure defining a vacuum chamber, a workpiece support within the enclosure facing an overlying portion of the enclosure, the enclosure having at least first and second pairs of openings therethrough near generally opposite sides of the workpiece support. At least first and second hollow conduits are connected to respective pairs of the openings to provide at least first and second closed torroidal paths through the respective conduits and extending between respective pairs of the openings across the wafer surface. A process gas supply is coupled to the interior of the chamber for supplying process gas to the torroidal paths. Coil antennas are coupled to RF power sources and inductively coupled to the interior of the hollow conduits and capable of maintaining a plasma in the torroidal paths.
    • 一种用于处理工件的等离子体反应器,包括限定真空室的外壳,位于所述外壳内的面向所述外壳的上部的工件支撑件,所述外壳具有穿过所述工件支撑件的大体相对侧的至少第一和第二对开口 。 至少第一和第二空心管道连接到相应的一对开口,以提供至少第一和第二封闭的环形路径穿过相应的导管并且在相应的成对开口之间跨越晶片表面延伸。 工艺气体供应件连接到室的内部,用于将工艺气体供应到环形路径。 线圈天线​​耦合到RF功率源,并且感应耦合到中空导管的内部并且能够将等离子体保持在环形路径中。
    • 10. 发明授权
    • Plasma immersion ion implantation reactor having multiple ion shower grids
    • 具有多个离子淋浴网格的等离子体浸没离子注入反应器
    • US08058156B2
    • 2011-11-15
    • US10895784
    • 2004-07-20
    • Hiroji HanawaTsutomu TanakaKenneth S. CollinsAmir Al-BayatiKartik RamaswamyAndrew Nguyen
    • Hiroji HanawaTsutomu TanakaKenneth S. CollinsAmir Al-BayatiKartik RamaswamyAndrew Nguyen
    • H01L21/425
    • H01J37/32357C23C14/046C23C14/48C23C16/045H01J37/32412
    • A plasma immersion ion implantation process for implanting a selected species at a desired ion implantation depth profile in a workpiece is carried out in a reactor chamber having a set of plural parallel ion shower grids that divide the chamber into an upper ion generation region and a lower process region, each of the ion shower grids having plural orifices in mutual registration from grid to grid, the plural orifices oriented in a non-parallel direction relative to a surface plane of the respective ion shower grid. The process includes placing a workpiece in the process region, the workpiece having a workpiece surface generally facing the surface plane of the closest one of the plural ion shower grids, and furnishing the selected species into the ion generation region. The process further includes evacuating the process region, and applying plasma source power to generate a plasma of the selected species in the ion generation region. The process also includes applying successive grid potentials to successive ones of the grids and applying a bias potential to the workpiece. The combination of the grid and bias potentials corresponds to the desired ion implantation depth profile in the workpiece.
    • 在具有一组多个并联离子淋浴网格的反应室中进行用于在工件中以期望的离子注入深度分布植入选定物种的等离子体浸没离子注入方法,该多个平行离子淋浴网将腔室分成上部离子产生区域和下部 处理区域,每个离子淋浴栅格具有从栅格到栅格相互配准的多个孔,多个孔相对于各个离子喷淋栅格的表面平行于非平行方向。 该工艺包括将工件放置在工艺区域中,工件具有大致面对多个离子淋浴栅格中最接近的一个的表面的工件表面,并将所选择的物质提供到离子产生区域中。 该方法还包括抽空处理区域,以及施加等离子体源功率以在离子产生区域中产生所选物种的等离子体。 该过程还包括将连续的栅格电势施加到连续的栅格并向工件施加偏置电位。 栅格和偏置电位的组合对应于工件中期望的离子注入深度分布。