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    • 71. 发明授权
    • Electroless metal adhesion to organic dielectric material with phase
separated morphology
    • 无机金属与相分离形态的有机介电材料粘合
    • US5310580A
    • 1994-05-10
    • US874665
    • 1992-04-27
    • Eugene J. O'SullivanTerrence R. O'TooleJudith M. RoldanLubomyr T. RomankiwCarlos J. SambucettiRavi Saraf
    • Eugene J. O'SullivanTerrence R. O'TooleJudith M. RoldanLubomyr T. RomankiwCarlos J. SambucettiRavi Saraf
    • B05D1/34C23C18/20H05K3/18H05K3/38B05D2/06
    • H05K3/387B05D1/34C23C18/20C23C18/2033C23C18/208C23C18/24C23C18/30H05K2201/0154H05K2201/0212H05K2203/0759H05K2203/0773H05K2203/0793H05K3/181H05K3/381
    • Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation. Upon exposure to alkaline solution there is etching of one of the polymer phases at a faster rate and simultaneous opening of the seeding colloid. The rough surface is overcoated with a photoresist, exposed and developed. Subsequent electroless metal deposition results in improved metal to dielectric layer adhesion. The method is applicable to selective deposition of electroless copper onto a polyimide layer.
    • 沉积在具有相分离形态的有机电介质层上的化学金属的改善的粘附通过自发形成形态和形貌上粗糙的表面来实现。 在一个实施方案中,可以将不同顺序的两相分离的相同聚合物的极性溶剂和两种聚合物前体的三元溶液在基材上成膜并加热形成不同阶数的两相以自发产生粗糙表面。 在暴露于碱性溶液时,以比另一相更快的速率蚀刻一相。 在粗糙表面上的金属的接种和无电沉积导致金属对电介质层的附着力提高。 在第二个实施方案中,将极性溶剂,接种剂,可以在两相中分离的相同聚合物的两种聚合物前体的四元溶液浇铸在基材上的薄膜中,并加热形成三相。 固化前体由于相分离而导致表面粗糙化。 暴露在碱性溶液中时,以更快的速率蚀刻聚合物相之一并同时打开接种胶体。 粗糙表面用光致抗蚀剂涂覆,曝光和显影。 随后的无电金属沉积导致金属与电介质层粘附性的改善。 该方法适用于将化学镀铜选择性沉积到聚酰亚胺层上。
    • 72. 发明授权
    • Electrochemical tool for uniform metal removal during electropolishing
    • 电解抛光时用于均匀金属去除的电化学工具
    • US5217586A
    • 1993-06-08
    • US819298
    • 1992-01-09
    • Madhav DattaLubomyr T. Romankiw
    • Madhav DattaLubomyr T. Romankiw
    • B23H3/04C25F7/00
    • C25F7/00
    • The present invention relates to an electropolishing tool for the removal of metal from a workpiece, said electropolishing tool comprising a container means for retaining an electrolytic solution, a cathode assembly in the shape of a pyramid the height of which is adjustable, a power supply means including a negative terminal and a positive terminal with said negative terminal being electrically connectable to said cathode assembly, a plate means for holding the workpiece and for forming an electrical connection to the workpiece, said plate means connected to the positive terminal of said power supply means, and an enclosure means placed over the workpiece leaving only the surface of the workpiece which is to be polished exposed to the electrolytic solution such that when the workpiece is secured to said plate means and said cathode assembly is connected to the negative terminal of said power supply means and is placed over the said enclosure means directly facing the workpiece enclosed therein, that portion of the workpiece exposed to the electrolytic solution undergoes electropolishing.
    • 本发明涉及一种用于从工件去除金属的电抛光工具,所述电抛光工具包括用于保持电解液的容器装置,高度可调的金字塔形状的阴极组件,电源装置 包括负端子和正极端子,所述负极端子可电连接到所述阴极组件;板装置,用于保持所述工件并形成与所述工件的电连接,所述板装置连接到所述电源装置的正极端子 以及放置在工件上的外壳装置,仅留下要被抛光的工件的表面暴露于电解溶液,使得当工件固定到所述板装置并且所述阴极组件连接到所述电源的负极端子时 供给装置并且被放置在直接面向工件的所述外壳装置上 在其中暴露于电解液的工件的那部分进行电解抛光。
    • 80. 发明授权
    • Method for controlling chemical species concentration
    • 控制化学物质浓度的方法
    • US5352350A
    • 1994-10-04
    • US837468
    • 1992-02-14
    • Panayotis C. AndricacosJohn O. DukovicLubomyr T. Romankiw
    • Panayotis C. AndricacosJohn O. DukovicLubomyr T. Romankiw
    • C23C18/16C23F1/00C25D21/14G03F7/30G05D11/13G05D21/02C25D21/18C25D21/20
    • G03F7/3071C23C18/1617C23F1/00C25D21/14G05D11/139G05D21/02B01J2208/00628
    • A method is described for maintaining constant chemical composition in solutions used for wet chemical processing. All chemical species that are deliberately included in the bath are kept at constant concentration primarily by a method of compensating for their depletion or generation with a set of feed solutions that are formulated and dosed into the bath in accordance with an overall material balance. Further, all chemical species not deliberately included in the bath are kept at constant concentration primarily by keeping the aggregate volume of replenishing stocks in strict proportion to the process service performed by the bath (e.g. the charge passed in an electroplating cell). Finally, a time-based scheme completes the control of the concentration of all bath species by controlling any species (whether deliberately included in the bath or not) that is depleted or generated as the result of chemical reactions which occur independently and/or spontaneously with time. Maintaining all bath chemical species at constant concentration prevents bath aging and permits production of more uniform work pieces from the bath.
    • 描述了一种用于在用于湿化学处理的溶液中保持恒定化学成分的方法。 有意包含在浴中的所有化学物质主要通过补偿其消耗或产生的方法保持恒定浓度,所述方法通过根据整体物料平衡配制并投入浴中的一组进料溶液。 此外,不是故意包括在浴中的所有化学物质都保持恒定浓度,主要是通过保持补充料的总体积与由浴进行的处理服务(例如在电镀槽中通过的电荷)严格成比例。 最后,基于时间的方案通过控制任何物种(无论是故意包括在浴中)是否完全控制所有沐浴物种的浓度,由于化学反应的结果而耗尽或产生,这些化学反应独立地和/或自发地发生, 时间。 保持恒定浓度的所有浴化学物质可以防止沐浴老化,并允许从浴中生产更均匀的工件。