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71. 发明申请

US20090114153A1 METHOD AND APPARATUS FOR SEALING AN OPENING OF A PROCESSING CHAMBER 审中-公开
标题翻译：用于密封加工室的开口的方法和装置
公开(公告)号：US20090114153A1
公开(公告)日：2009-05-07
申请号：US12252055
申请日：2008-10-15
申请人： Shinichi Kurita , Takayuki Matsumoto , Robin L. Tiner , John M. White , Suhail Anwar
发明人： Shinichi Kurita , Takayuki Matsumoto , Robin L. Tiner , John M. White , Suhail Anwar
IPC分类号： C23C16/513 , B65D51/00 , B65D53/00 , B65D43/14 , B65D43/26
CPC分类号： C23C16/54 , C23C16/45517
摘要： A method and apparatus for sealing an opening of a processing chamber are provided. In one embodiment, the invention generally provides a closure member integrated within a wall of a process chamber for sealing an opening within the wall of the chamber. In another embodiment, the invention provides a closure member configured to seal an opening in the wall of a processing chamber from the inside of the chamber.
摘要翻译：提供一种用于密封处理室的开口的方法和装置。在一个实施例中，本发明通常提供集成在处理室的壁内的封闭构件，用于密封腔室壁内的开口。在另一个实施例中，本发明提供了一种封闭构件，其构造成将处理室的壁中的开口与室的内部密封。

72. 发明申请

US20070222817A1 METHODS AND APPARATUS FOR INKJET PRINTING USING MULTIPLE SETS OF PRINT HEADS 审中-公开
标题翻译：使用多组打印头进行喷墨打印的方法和装置
公开(公告)号：US20070222817A1
公开(公告)日：2007-09-27
申请号：US11690507
申请日：2007-03-23
申请人： Shinichi Kurita , Quanyuan Shang , John M. White
发明人： Shinichi Kurita , Quanyuan Shang , John M. White
IPC分类号： B41J2/15
CPC分类号： B41J2/15 , B41J2/2135 , B41J3/28 , B41J3/543 , B41J11/008 , B41J11/0085 , B41J11/06 , G02F1/133516
摘要： In a first aspect, a system is provided for inkjet printing. The system includes (1) a first set including a first inkjet print head having a first plurality of nozzles adapted to selectively dispense a first ink, and a second inkjet print head having a second plurality of nozzles adapted to selectively dispense a second ink, (2) a second set including a third inkjet print head having a third plurality of nozzles adapted to selectively dispense a third ink and a fourth inkjet print head having a fourth plurality of nozzles adapted to selectively dispense a fourth ink and (3) a stage adapted to support and transport the substrate below the first and second sets during a printing pass such that the first set and second sets are adapted to dispense respective first/second and third/fourth inks into adjacent color wells of a display pixel on a substrate.
摘要翻译：在第一方面，提供一种用于喷墨打印的系统。该系统包括（1）第一组，其包括具有适于选择性地分配第一油墨的第一多个喷嘴的第一喷墨打印头和具有适于选择性分配第二墨的第二多个喷嘴的第二喷墨打印头（ 2）包括第三喷墨打印头的第二组，其具有适于选择性地分配第三墨的第三多个喷嘴和具有适于选择性地分配第四墨的第四多个喷嘴的第四喷墨打印头，以及（3）适于以在打印通过期间支撑并运输基板在第一和第二组之下，使得第一组和第二组适于将相应的第一/第二和第三/第四墨水分配到基板上的显示像素的相邻色阱中。

73. 发明申请

US20070166133A1 Decoupled chamber body 有权
标题翻译：解耦室体
公开(公告)号：US20070166133A1
公开(公告)日：2007-07-19
申请号：US11332781
申请日：2006-01-13
申请人： Jae-Chull Lee , Shinichi Kurita , John M. White , Suhail Anwar
发明人： Jae-Chull Lee , Shinichi Kurita , John M. White , Suhail Anwar
IPC分类号： H01L21/677 , H01L21/306 , C23C16/00 , B65H1/00
CPC分类号： H01L21/67201 , Y10S414/139
摘要： Embodiments of the invention include a chamber body having at least one of a top or bottom decoupled from the sidewalls of the chamber body. The invention is suitable for use as a load lock chamber, substrate transfer chamber and vacuum processing chambers, among others.
摘要翻译：本发明的实施例包括室主体，其具有从腔体的侧壁分离的顶部或底部中的至少一个。本发明适用于负载锁定室，基板传送室和真空处理室等。

74. 发明授权

US08528762B2 Electron beam welding of large vacuum chamber body having a high emissivity coating 有权
标题翻译：具有高发射率涂层的大型真空室体的电子束焊接
公开(公告)号：US08528762B2
公开(公告)日：2013-09-10
申请号：US12534534
申请日：2009-08-03
申请人： Shinichi Kurita , Mehran Behdjat , Makoto Inagawa
发明人： Shinichi Kurita , Mehran Behdjat , Makoto Inagawa
IPC分类号： B65D6/28
CPC分类号： B65D7/06 , B23K15/0006 , B65D7/38 , H01L21/67379
摘要： Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
摘要翻译：本文公开的实施例涉及已经焊接在一起的大型真空室主体。腔体可以在其中的至少一个表面上具有高发射率涂层。由于腔室主体的尺寸较大，可以通过将多个部件焊接在一起而不是从单个金属件锻造主体而形成腔体。这些部件可以在与身体的角部间隔开的位置处被焊接在一起，该位置在排空期间可能处于最大的应力下，以确保可能是身体中最弱点的焊缝不会失效。室主体的至少一个表面可以涂覆有高发射率涂层，以帮助来自加热的基底的热传递。高发射率涂层可以通过降低降低衬底温度所需的时间来增加衬底通量。

75. 外观设计

USD670372S1 Heater plate and heater element assembly 有权
标题翻译：加热板和加热器组件
公开(公告)号：USD670372S1
公开(公告)日：2012-11-06
申请号：US29403680
申请日：2011-10-10
申请人： Makoto Inagawa , Shinichi Kurita
设计人： Makoto Inagawa , Shinichi Kurita

76. 发明授权

US08070408B2 Load lock chamber for large area substrate processing system 有权
标题翻译：负载锁定室用于大面积基板处理系统
公开(公告)号：US08070408B2
公开(公告)日：2011-12-06
申请号：US12199341
申请日：2008-08-27
申请人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa , Suhail Anwar
发明人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa , Suhail Anwar
IPC分类号： H01L21/677
CPC分类号： H01L21/67201 , H01L21/67236
摘要： The present invention generally includes a load lock chamber for transferring large area substrates into a vacuum processing chamber. The load lock chamber may have one or more separate, environmentally isolated environments. Each processing environment may have a plurality exhaust ports for drawing a vacuum. The exhaust ports may be located at the corners of the processing environment. When a substrate is inserted into the load lock chamber from the factory interface, the environment may need to be evacuated. Due to the exhaust ports located at the corners of the environment, any particles or contaminants that may be present may be pulled to the closest corner and out of the load lock chamber without being pulled across the substrate. Thus, substrate contamination may be reduced.
摘要翻译：本发明通常包括用于将大面积基板输送到真空处理室中的负载锁定室。负载锁定室可以具有一个或多个单独的环境隔离环境。每个处理环境可以具有用于抽真空的多个排气口。排气口可以位于处理环境的拐角处。当基板从出厂界面插入加载锁定室时，环境可能需要抽真空。由于位于环境角落处的排气口，可能存在的任何颗粒或污染物可被拉到最靠近的角落并且不被拉过载体锁定室。因此，可能降低衬底污染。

77. 发明授权

US07665951B2 Multiple slot load lock chamber and method of operation 有权
标题翻译：多槽加载锁定室和操作方法
公开(公告)号：US07665951B2
公开(公告)日：2010-02-23
申请号：US11421793
申请日：2006-06-02
申请人： Shinichi Kurita , Suhail Anwar , Jae-Chull Lee
发明人： Shinichi Kurita , Suhail Anwar , Jae-Chull Lee
IPC分类号： B65G49/07
CPC分类号： H01L21/67201 , C23C14/566 , H01L21/67109 , H01L21/67126 , H01L21/67167 , H01L21/67178 , H01L21/6719 , H01L21/67742 , H01L21/67751 , Y10S414/139
摘要： Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
摘要翻译：本发明的实施例包括负载锁定室，具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。在一个实施例中，该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。在另一个实施例中，该方法包括将基底从传递腔转移到形成在腔体中的加热腔，以及加热加热腔中的基底。在另一个实施例中，负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。衬底支撑件可在第一高度和第二高度之间移动。多个槽形成在传送腔的天花板或地板中的至少一个中，并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。

78. 发明授权

US07651315B2 Large area substrate transferring method for aligning with horizontal actuation of lever arm 有权
标题翻译：大面积基板转印方法，用于与杆臂的水平致动对齐
公开(公告)号：US07651315B2
公开(公告)日：2010-01-26
申请号：US11621039
申请日：2007-01-08
申请人： Shinichi Kurita , Wendell T. Blonigan , Yoshiaki Tanase
发明人： Shinichi Kurita , Wendell T. Blonigan , Yoshiaki Tanase
IPC分类号： B65G47/90 , B21B39/22
CPC分类号： H01L21/67201 , B65G49/064 , B65G49/067 , B65G49/068 , B65G2249/02 , H01L21/67236 , Y10S414/136 , Y10S414/137 , Y10S414/139
摘要： A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.
摘要翻译：提供了一种负载锁定室和用于传送大面积基板的方法。在一个实施例中，适于传送大面积衬底的负载锁定室包括多个垂直堆叠的单个衬底传送室。垂直堆叠的单个基板传送室的配置与现有技术的双槽双面基板设计相比，有助于减小尺寸和更大的通量。此外，在减少的泵送和排气速率下已经实现了增加的产量，这对应于由于颗粒和冷凝引起的底物污染的可能性降低。

79. 发明授权

US07316966B2 Method for transferring substrates in a load lock chamber 有权
标题翻译：在负载锁定室中传送基板的方法
公开(公告)号：US07316966B2
公开(公告)日：2008-01-08
申请号：US11278318
申请日：2006-03-31
申请人： Shinichi Kurita , Wendell T. Blonigan
发明人： Shinichi Kurita , Wendell T. Blonigan
IPC分类号： H01L21/20
CPC分类号： H01L21/67201 , H01L21/67196 , H01L21/67748
摘要： Provided herein is a substrate processing system, which comprises a cassette load station; a load lock chamber; a centrally located transfer chamber; and one or more process chambers located about the periphery of the transfer chamber. The load lock chamber comprises double dual slot load locks constructed at same location. Such system may be used for processing substrates for semiconductor manufacturing.
摘要翻译：本文提供了一种基板处理系统，其包括盒式装载台; 负载锁定室; 位于中心的传送室; 以及位于传送室的周边周围的一个或多个处理室。负载锁定室包括在相同位置构造的双重双槽加载锁。这种系统可用于处理用于半导体制造的衬底。

80. 发明申请

US20070263026A1 METHODS AND APPARATUS FOR MAINTAINING INKJET PRINT HEADS USING PARKING STRUCTURES 审中-公开
标题翻译：使用停车结构维护喷码头的方法和装置
公开(公告)号：US20070263026A1
公开(公告)日：2007-11-15
申请号：US11741723
申请日：2007-04-28
申请人： Quanyuan Shang , Shinichi Kurita , Lizhong Sun
发明人： Quanyuan Shang , Shinichi Kurita , Lizhong Sun
IPC分类号： B41J2/165
CPC分类号： B41J2/16552 , B41J2/16508 , B41J3/28
摘要： The invention provides a print head parking structure that includes a solvent and/or surface treatment bath for inkjet print heads. Print heads may be returned to the print head parking structure after a substrate has been printed, after one or more printing passes, and/or frequently enough to prevent ink from drying on or clogging the print heads. Once sealed within the print head parking structure, the print heads (or a portion thereof) may be dipped in a solvent bath or pool to dissolve or wash away any ink that has been deposited on the print heads.
摘要翻译：本发明提供了一种打印头停车结构，其包括用于喷墨打印头的溶剂和/或表面处理浴。在印刷一个或多个印刷之后，和/或经常足以防止油墨干燥或堵塞打印头，印刷头可以在印刷基板之后返回打印头停车结构。一旦密封在打印头停车结构中，打印头（或其一部分）可以浸入溶剂浴或池中以溶解或洗掉已经沉积在打印头上的任何油墨。

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