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    • 73. 发明授权
    • Clamping ring apparatus for processing semiconductor wafers
    • 用于处理半导体晶圆的夹紧环装置
    • US5316278A
    • 1994-05-31
    • US947212
    • 1992-09-18
    • Semyon SherstinskyMei ChangCharles C. HarrisAlfred MakJames F. RobertsSimon W. TamWen T. Chang
    • Semyon SherstinskyMei ChangCharles C. HarrisAlfred MakJames F. RobertsSimon W. TamWen T. Chang
    • H01L21/687B25B1/00
    • H01L21/68721Y10S269/903
    • An improved clamping ring apparatus is disclosed comprising a clamping ring means for yieldably engaging a generally circular semiconductor wafer to peripherally clamp the wafer to a support pedestal to provide a peripheral seal between the wafer and the surface of the pedestal facing the wafer, adjacent the generally circular end edge of the wafer by providing a central generally circular opening in the clamping ring and a series of slots which radially extend outwardly from the central opening in the clamping ring means to thereby divide the inner portion of the clamping ring means into a series of yieldable fingers inwardly extending toward the central opening in the clamping ring means.In one embodiment, the sidewalls of the slots are slanted with respect to the planar surface of the clamping ring means at an angle sufficient, with respect to the thickness of the clamping ring means and the width of the slot,, to prevent a ray or a particle from a plasma, traveling in a direction perpendicular to the plane of the surface of the clamping ring means from striking surfaces underlying the clamping ring means, through the slot.
    • 公开了一种改进的夹紧环装置,其包括夹紧环装置,用于可屈服地接合大致圆形的半导体晶片以将晶片周边夹持到支撑基座,以在晶片与面对晶片的基座的表面之间提供周边密封, 通过在夹紧环中提供中心大致圆形的开口,以及从夹紧环装置中的中心开口径向向外延伸的一系列槽,从而将夹紧环装置的内部分成一系列 可伸缩的手指向内延伸朝向夹紧环装置中的中心开口。 在一个实施例中,槽的侧壁相对于夹紧环装置的平坦表面以相对于夹紧环装置的厚度和槽的宽度足够的角度倾斜以防止光线或 来自等离子体的颗粒通过狭槽从垂直于夹紧环装置的表面的平面的方向通过夹紧环装置下方的冲击表面行进。