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    • 70. 发明申请
    • Thin film removing device and thin removing method
    • 薄膜去除装置和薄去除方法
    • US20040226916A1
    • 2004-11-18
    • US10841548
    • 2004-05-10
    • TOKYO ELECTRON LIMITED
    • Shinji KobayashiNorihisa Koga
    • C23F001/00
    • H01L21/6708Y10S134/902Y10T156/1111Y10T156/1928Y10T156/1989
    • A thin film removing device and a thin film removing method are capable of removing straight parts of a thin film formed on a square substrate from corners of the substrate, and of suppressing the formation of mists. An approach stage 20 having flat stage plates 23 capable of being disposed substantially flush with the surface of a substrate M mounted on a support table 22 is positioned close to the substrate M mounted on the support table 22. Removing nozzles 30 jet a solvent toward edge parts of the substrate M and suck a solution produced by dissolving part of the resist in the solvent while the removing nozzles 30 are moved along side edges of the substrate M and the approach stage 20 disposed close to the substrate M. Thus, the removing nozzles 30 jet the solvent uniformly over the edge parts and corners of the substrate M and suck the solution without changing modes of jetting the solvent and sucking the solution. Consequently, straight parts of a thin film formed on the square substrate M can be removed from the corners of the substrate M, and the formation of mists can be suppressed.
    • 薄膜去除装置和薄膜去除方法能够从基板的角部去除在正方形基板上形成的薄膜的直线部分,并且抑制雾的形成。 具有能够与安装在支撑台22上的基板M的表面基本齐平的平台台23的接近台20靠近安装在支撑台22上的基板M定位。去除喷嘴30向边缘喷射溶剂 将基板M的一部分吸附并且将去除喷嘴30沿着基板M和接近台20的侧边缘移动而将抗蚀剂的一部分溶解在溶剂中而产生的溶液。因此,除去喷嘴 30将溶剂均匀地喷射在基板M的边缘部分和拐角上,并吸取溶液,而不改变喷射溶剂并吸取溶液的模式。 因此,可以从基板M的角部去除在正方形基板M上形成的薄膜的直线部分,并且可以抑制雾的形成。