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61. 发明申请

US20160165751A1 PARTITIONED COOLING FOR ELECTRONIC DEVICES AND SYSTEMS 审中-公开
标题翻译：电子设备和系统的分体式冷却
公开(公告)号：US20160165751A1
公开(公告)日：2016-06-09
申请号：US14905275
申请日：2014-08-22
申请人： INTEL CORPORATION
发明人： Krishnakumar Varadarajan , Anand V. Reddy
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20136 , G06F1/20 , G06F1/206 , H05K7/20336
摘要： Partitioned cooling for electronic devices and systems. An embodiment of an apparatus includes a casing; one or more components, including one or more components that include an active thermal element; a partition to separate area within the casing into a first cooling zone and a second cooling zone, wherein the first cooling zone provides cooling for the one or more components that include an active thermal element; and a first fan located in the first cooling zone, the first fan to produce airflow for cooling in the first cooling zone and a second fan located in the second cooling zone to produce airflow for the cooling in the second cooling zone.
摘要翻译：电子设备和系统的分配冷却。装置的一个实施例包括壳体; 一个或多个组件，包括一个或多个包括活性热元件的组件; 分隔件，其将所述壳体内的区域分隔成第一冷却区域和第二冷却区域，其中所述第一冷却区段为包括有源热元件的所述一个或多个部件提供冷却; 以及位于所述第一冷却区域中的第一风扇，所述第一风扇产生用于在所述第一冷却区域中冷却的气流，以及位于所述第二冷却区域中的第二风扇，以产生用于在所述第二冷却区域中进行冷却的气流。

62. 发明授权

US09307678B2 Low thermal resistance cooler module for embedded system 有权
标题翻译：用于嵌入式系统的低热阻冷却器模块
公开(公告)号：US09307678B2
公开(公告)日：2016-04-05
申请号：US13733597
申请日：2013-01-03
申请人： ADLINK TECHNOLOGY INC.
发明人： Li-Jie Yu
IPC分类号： H05K7/20 , F28D15/02 , H01L23/427 , G06F1/20
CPC分类号： H05K7/20809 , F28D15/0275 , G06F1/20 , G06F2200/201 , H01L23/427 , H01L2924/0002 , H05K7/20336 , H01L2924/00
摘要： A low thermal resistance cooler module includes a heat-transfer base member defining a recess and multiple elongated, curved locating grooves, flat heat pipes set in the elongated, curved locating grooves with respective hot interfaces thereof suspending in the recess and respective cold interfaces thereof bonded to the heat-transfer base member, a heat-transfer block fixedly mounted with the hot interfaces of the flat heat pipes in the recess of the heat-transfer base member for transferring waste heat from a heat source of an external circuit board by direct contact, and connection plates respectively connected between the heat-transfer block and the heat-transfer base member.
摘要翻译：低热阻冷却器模块包括限定凹部的传热基部构件和多个细长的弯曲定位槽，设置在细长的弯曲定位槽中的扁平热管，其各自的热界面悬挂在凹部中并且其各自的冷界面被粘合传热基板，传热块，其固定地安装有传热基体的凹部中的平坦热管的热界面，用于通过直接接触从外部电路板的热源传送废热以及分别连接在传热块和传热基体之间的连接板。

63. 发明申请

US20160044831A1 SMALL FORM FACTOR DESKTOP COMPUTER 审中-公开
标题翻译：小型桌面计算机
公开(公告)号：US20160044831A1
公开(公告)日：2016-02-11
申请号：US14822762
申请日：2015-08-10
申请人： Apple Inc.
发明人： Chiew-Siang Goh , Houtan R. Farahani , Eric A. Knopf , Ricardo A. Mariano , Joseph B. Moak , Matthew S. Theobald
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20336 , B23C3/30 , B23C5/08 , B23C2220/36 , B26D3/14 , G06F1/16 , G06F1/181 , G06F1/182 , G06F1/185 , G06F1/187 , G06F1/20 , G06F1/203 , H05K13/00 , Y10T29/49002 , Y10T29/49117 , Y10T29/49169 , Y10T29/49826 , Y10T83/04 , Y10T83/869 , Y10T83/9391
摘要： An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.
摘要翻译：描述了美观的小型台式计算机。小型台式计算机可以由单件无缝外壳形成，在所述实施例中，由单个铝合金坯加工。单件无缝外壳包括美观的脚部支撑件，其具有由RF透明材料形成的至少一部分，其提供用户对所选择的内部部件的访问以及提供电磁（EM）屏蔽。除了与美学外观相关的设计外，这种简单的设计可以为小型台式电脑带来许多优点。组装小型台式计算机可能需要更少的组件和更少的时间和精力，并且在单件外壳中不存在接缝可以提供良好的防止内部组件的环境污染以及EM屏蔽的保护。

64. 发明授权

US09237677B2 Cooling device, printed circuit board unit, and electronic device 有权
标题翻译：冷却装置，印刷电路板单元和电子设备
公开(公告)号：US09237677B2
公开(公告)日：2016-01-12
申请号：US13763932
申请日：2013-02-11
申请人： FUJITSU LIMITED
发明人： Shuji Honda , Masao Honda
IPC分类号： H05K7/20 , H01L23/40 , H01L23/427 , G06F1/20 , F28D15/02 , H01L23/34 , H01L23/467
CPC分类号： H05K7/20336 , F28D15/0233 , F28D15/0275 , G06F1/203 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A cooling device includes: a heat sink and a heat pipe that are connected with each other; a metal plate that is connected with the heat pipe; an elastic member that is provided in the metal plate; and a securing member that is attachable with a printed circuit board on which a heating part is mounted, is able to be secured to the elastic member to be elastically deformed such that the metal plate is pushed to the heating part, and is able to position the metal plate in a state where the securing member is not secured to the elastic member.
摘要翻译：冷却装置包括：散热器和热管，彼此连接; 与热管连接的金属板; 设置在所述金属板中的弹性部件; 并且能够与其上安装有加热部件的印刷电路板可固定的固定构件能够被固定到弹性构件以弹性变形，使得金属板被推动到加热部分，并且能够定位金属板处于固定构件未固定到弹性构件的状态。

65. 发明申请

US20150350392A1 WATCH TYPE MOBILE TERMINAL 有权
标题翻译：手表类型移动终端
公开(公告)号：US20150350392A1
公开(公告)日：2015-12-03
申请号：US14643784
申请日：2015-03-10
申请人： LG ELECTRONICS INC.
发明人： Kyungui PARK , Donghyun KIM , Joseph LEE , Wonkee AHN , Donghyun KIM , Changwoo SONG
IPC分类号： H04M1/02 , H05K7/20
CPC分类号： H04M1/0202 , G04G21/00 , H05K7/20336 , H05K7/2039
摘要： A watch type mobile terminal includes a main body configured to include an electric apparatus unit in which an electronic part is mounted, a band configured to be worn on a wrist of a user in a manner of being combined with the main body, a heat pipe configured to include a first pipe positioned at the main body and a second pipe positioned at the band wherein the first pipe and the second pipe forms a loop in a manner of being connected with each other, a first working fluid injected into the heat pipe and a second working fluid different from the first working fluid in density. The watch type mobile terminal can emit heat of the main body at the band using the heat pipe.
摘要翻译：手表式移动终端包括主体，其被构造成包括其中安装有电子部件的电气设备单元，被配置为以与主体组合的方式佩戴在用户的手腕上的带;热管被配置为包括位于主体处的第一管和位于所述带处的第二管，其中所述第一管和所述第二管以彼此连接的方式形成环，将第一工作流体注入到所述热管中，与第一工作流体密度不同的第二工作流体。表型移动终端可以使用热管在带上发射主体的热量。

66. 发明申请

US20150323262A1 HEAT DISSIPATING APPARATUS AND ELECTRONIC DEVICE HAVING THE SAME 有权
标题翻译：散热装置和具有该散热装置的电子装置
公开(公告)号：US20150323262A1
公开(公告)日：2015-11-12
申请号：US14667035
申请日：2015-03-24
申请人： Samsung Electronics Co., Ltd.
发明人： Hae-Soo KIM
IPC分类号： F28D15/02 , H05K7/20
CPC分类号： G06F1/203 , F28D15/0233 , F28D15/046 , F28F21/02 , F28F21/081 , F28F21/083 , F28F21/084 , F28F21/085 , F28F21/089 , F28F2265/10 , H01L23/427 , H05K7/20336
摘要： A heat dissipating apparatus and an electronic device having the same are provided. The electronic device includes a body, an internal circuit board provided in the body and including at least one heat generating element, and a heat diffusion type heat dissipating module provided in the body and stacked on a surface of the internal circuit board, so as to diffuse heat generated by the heat generating element toward a low temperature region having a temperature lower than a temperature of the at least one heat generating unit. The heat diffusion type heat dissipating module has a sheet shape which extends from the heat generating element toward a circumference surface of an inside of the body so that the heat is transferred from the heat generating element to the low temperature region.
摘要翻译：提供了一种散热装置和具有该散热装置的电子装置。电子设备包括主体，设置在主体中的内部电路板，并且包括至少一个发热元件，以及散热型散热模块，其设置在主体中，堆叠在内部电路板的表面上，以便由发热元件向具有低于至少一个发热单元的温度的低温区域产生的散热。热扩散型散热模块具有从发热元件朝向主体内侧的周面延伸的片状，使得热量从发热元件传递到低温区域。

67. 发明申请

US20150318588A1 METHOD AND SYSTEM FOR AUTOMOTIVE BATTERY COOLING 有权
标题翻译：汽车电池冷却方法与系统
公开(公告)号：US20150318588A1
公开(公告)日：2015-11-05
申请号：US14799926
申请日：2015-07-15
申请人： ThermoTek, Inc.
发明人： Tony Quisenberry
IPC分类号： H01M10/6569 , H01M10/613 , H01M10/66 , H01M10/625
CPC分类号： H05K7/20336 , B60K2001/003 , B60L11/1879 , F28D15/0233 , F28D15/0275 , H01M10/613 , H01M10/617 , H01M10/625 , H01M10/6552 , H01M10/6557 , H01M10/6561 , H01M10/6569 , H01M10/66 , H01M2220/20 , Y02T10/7005 , Y02T10/7011 , Y02T10/705
摘要： A battery-cooling system includes a battery array and a plurality of heat pipes that each include a low-profile extrusion having a plurality of hollow tubes formed therein. A heat transfer fluid is disposed in the plurality of hollow tubes. Each heat pipe includes an evaporator portion and a condenser portion. The evaporator portion is disposed between successive batteries within the battery array and the condenser portion is disposed outside of the battery array and exposed to a heat sink.
摘要翻译：电池冷却系统包括电池阵列和多个热管，每个热管包括其中形成有多个中空管的低轮廓挤出。传热流体设置在多个中空管中。每个热管包括蒸发器部分和冷凝器部分。蒸发器部分设置在电池阵列内的连续电池之间，并且冷凝器部分设置在电池阵列的外部并暴露于散热器。

68. 发明申请

US20150253823A1 SUPPORT FRAME WITH INTEGRATED THERMAL MANAGEMENT FEATURES 有权
标题翻译：支持框架与集成热管理功能
公开(公告)号：US20150253823A1
公开(公告)日：2015-09-10
申请号：US14197662
申请日：2014-03-05
申请人： Futurewei Technologies, Inc.
发明人： Qian HAN
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/203 , G06F1/1656 , G06F2200/201 , H05K7/20336
摘要： This invention describes a novel solution to providing heat redistribution and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. Liquid (e.g., coolants) contained in the portion of the heat management features most proximate to the processing components evaporates due to the absorbed heat, and is conducted (via convection) towards the other end of the heat management features, where the temperature is cooler. Once sufficiently cooled, the evaporated coolant condenses back into liquid form and flows back towards the other end of the heat management features.
摘要翻译：本发明描述了一种用于向电子设备提供热再分配和冷却的新颖解决方案。根据各种实施例，在计算设备中的处理部件的操作期间产生的热量被集成在支撑中间框架内的热管理特征所吸收。包含在最接近处理部件的热管理特征部分中的液体（例如，冷却剂）由于吸收的热而蒸发，并且通过对流传导到热管理特征的另一端，其中温度较冷。一旦充分冷却，蒸发的冷却剂冷凝回液态并流向热管理特征的另一端。

69. 发明授权

US09121645B2 Variable thickness heat pipe 有权
标题翻译：可变厚度热管
公开(公告)号：US09121645B2
公开(公告)日：2015-09-01
申请号：US13764111
申请日：2013-02-11
申请人： Google Inc.
发明人： Felix Jose Alvarez Rivera , James Tanner , William Riis Hamburgen
IPC分类号： G06F1/20 , H05K5/00 , H05K7/20 , F28D15/02
CPC分类号： G06F1/20 , F28D15/0233 , F28D15/0275 , G06F1/203 , H01L21/4882 , H01L23/427 , H01L23/467 , H01L2924/0002 , H05K7/20336 , H05K7/20663 , H01L2924/00
摘要： In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.
摘要翻译：在一个方面，提供了一种用于计算设备的冷却系统，例如膝上型计算机，蜂窝电话和平板计算机。冷却系统包括通过具有中线的热管联接到散热器的散热器。热管包括沿着中线纵向延伸的第一端部部分，沿着中线纵向延伸的第二端部部分和沿着中线部分纵向延伸的中间部分。中间部分位于第一端部和第二端部之间，并且其厚度大于第一部分和第二部分的厚度，从而降低热管的总体热阻。

70. 发明申请

US20150234437A1 EXPANSION CARD HAVING SYNERGISTIC COOLING, STRUCTURAL AND VOLUME REDUCTION SOLUTIONS 有权
标题翻译：具有协同冷却，结构和体积减少解决方案的扩展卡
公开(公告)号：US20150234437A1
公开(公告)日：2015-08-20
申请号：US13997758
申请日：2011-11-29
申请人： Mark J. Gallina , Jason B. Chesser , Mike G. Macgregor , Mark J. Luckeroth , Brian S. Jarrett , Thu Huynh , Eric D. Mcafee , Barrett M. Faneuf , Michelle Goeppinger
发明人： Mark J. Gallina , Jason B. Chesser , Mike G. Macgregor , Mark J. Luckeroth , Brian S. Jarrett , Thu Huynh , Eric D. Mcafee , Barrett M. Faneuf , Michelle Goeppinger
IPC分类号： G06F1/20 , G06F1/18 , H05K7/20
CPC分类号： G06F1/20 , F28D15/0275 , G06F1/185 , H05K7/20145 , H05K7/20336
摘要： Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.
摘要翻译：制造电路板组件的系统和方法可以提供一种电路板组件，其包括具有第一侧和第二侧的扩展卡，耦合到第一侧的第一组半导体封装以及耦合到第一侧的第二组半导体封装第二面。电路板组件还可以包括用于膨胀卡的冷却溶液如金属管道，离心风扇或次级板的协同组合，用于扩展卡的结构解决方案，例如夹紧结构或保持互锁，以及用于扩展卡，如一个或多个翻转的电源连接器。

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