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1. 发明授权

US09606589B2 Expansion card having synergistic cooling, structural and volume reduction solutions 有权
公开(公告)号：US09606589B2
公开(公告)日：2017-03-28
申请号：US13997758
申请日：2011-11-29
申请人： Mark J. Gallina , Jason B. Chesser , Mike G. Macgregor , Mark J. Luckeroth , Brian S. Jarrett , Thu Huynh , Eric D. Mcafee , Barrett M. Faneuf , Michelle Goeppinger
发明人： Mark J. Gallina , Jason B. Chesser , Mike G. Macgregor , Mark J. Luckeroth , Brian S. Jarrett , Thu Huynh , Eric D. Mcafee , Barrett M. Faneuf , Michelle Goeppinger
IPC分类号： G06F1/20 , G06F1/18 , H05K7/20
CPC分类号： G06F1/20 , F28D15/0275 , G06F1/185 , H05K7/20145 , H05K7/20336
摘要： Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

2. 发明申请

US20150234437A1 EXPANSION CARD HAVING SYNERGISTIC COOLING, STRUCTURAL AND VOLUME REDUCTION SOLUTIONS 有权
标题翻译：具有协同冷却，结构和体积减少解决方案的扩展卡
公开(公告)号：US20150234437A1
公开(公告)日：2015-08-20
申请号：US13997758
申请日：2011-11-29
申请人： Mark J. Gallina , Jason B. Chesser , Mike G. Macgregor , Mark J. Luckeroth , Brian S. Jarrett , Thu Huynh , Eric D. Mcafee , Barrett M. Faneuf , Michelle Goeppinger
发明人： Mark J. Gallina , Jason B. Chesser , Mike G. Macgregor , Mark J. Luckeroth , Brian S. Jarrett , Thu Huynh , Eric D. Mcafee , Barrett M. Faneuf , Michelle Goeppinger
IPC分类号： G06F1/20 , G06F1/18 , H05K7/20
CPC分类号： G06F1/20 , F28D15/0275 , G06F1/185 , H05K7/20145 , H05K7/20336
摘要： Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.
摘要翻译：制造电路板组件的系统和方法可以提供一种电路板组件，其包括具有第一侧和第二侧的扩展卡，耦合到第一侧的第一组半导体封装以及耦合到第一侧的第二组半导体封装第二面。电路板组件还可以包括用于膨胀卡的冷却溶液如金属管道，离心风扇或次级板的协同组合，用于扩展卡的结构解决方案，例如夹紧结构或保持互锁，以及用于扩展卡，如一个或多个翻转的电源连接器。

3. 发明申请

US20080081489A1 Reliable land grid array socket loading device 审中-公开
标题翻译：可靠的电网阵列插座装载装置
公开(公告)号：US20080081489A1
公开(公告)日：2008-04-03
申请号：US11541714
申请日：2006-09-29
申请人： Mike G. MacGregor , Kazimierz A. Kozyra , Tod Byquist
发明人： Mike G. MacGregor , Kazimierz A. Kozyra , Tod Byquist
IPC分类号： H01R12/00
CPC分类号： H01R12/88 , H01R2201/20
摘要： An apparatus for receiving and securing a processor on a mainboard in a computer system. The apparatus includes a socket and socket loading mechanism for a land grid array. The apparatus provides a load distribution mechanism to dissipate tensile and shearing forces at the corner of the socket to protect a solder ball grid array. This improves the durability of the solder ball grid array and increases the power of the processors that may be supported by the socket.
摘要翻译：一种用于在计算机系统中的主板上接收和固定处理器的装置。该装置包括用于陆地网格阵列的插座和插座加载机构。该装置提供负载分配机构以消除插座角落处的拉伸和剪切力，以保护焊球网格阵列。这提高了焊球网格阵列的耐久性，并增加了可由插座支持的处理器的功率。

4. 发明授权

US07158381B2 Heat sink assembly and method of attaching a heat sink to an electronic device on a motherboard 有权
标题翻译：散热器组件和将散热器连接到主板上的电子设备的方法
公开(公告)号：US07158381B2
公开(公告)日：2007-01-02
申请号：US10607783
申请日：2003-06-27
申请人： Mike G MacGregor
发明人： Mike G MacGregor
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly is coupled to a motherboard and an electronic device on the motherboard. The heat sink assembly includes a heat sink with an opening extending through the heat sink, and a pin that extends through the motherboard and the opening in the heat sink to couple the heat sink to the electronic device and the motherboard. A member within the opening in the heat sink is positioned between the heat sink and the pin. A method of securing a heat sink to a motherboard and an electronic device on the motherboard includes thermally coupling a heat sink to an electronic device, securing the heat sink to a motherboard using a pin that extends through an opening in the heat sink, and positioning a member between the pin and the heat sink within the opening in the heat sink.
摘要翻译：散热器组件耦合到主板和主板上的电子设备。散热器组件包括具有延伸穿过散热器的开口的散热器，以及延伸穿过母板和散热器中的开口的销，以将散热器耦合到电子设备和母板。散热器开口内的部件位于散热片和销之间。将散热器固定到主板上的主板和电子设备的方法包括将散热器热耦合到电子设备上，使用延伸穿过散热器中的开口的引脚将散热片固定到主板上，以及定位引脚与散热片开口内的散热片之间的部件。

5. 发明授权

US07023702B2 Apparatus including circuit board and heat sink and method of making the apparatus 失效
标题翻译：装置包括电路板和散热器及其制造方法
公开(公告)号：US07023702B2
公开(公告)日：2006-04-04
申请号：US10681920
申请日：2003-10-09
申请人： Mike G. MacGregor
发明人： Mike G. MacGregor
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2224/16 , H01L2224/73253 , H01L2924/15311
摘要： In some embodiments, an apparatus includes a circuit board, a plurality of metal inserts, and a heat sink having a plurality of mounting holes. Each of the metal inserts may include at least one lower member soldered to the circuit board, and an upper portion received in a respective one of the mounting holes of the heat sink and secured to the respective one of the mounting holes by a respective fastener.
摘要翻译：在一些实施例中，装置包括电路板，多个金属插入件和具有多个安装孔的散热器。每个金属插入件可以包括焊接到电路板的至少一个下部构件，以及容纳在散热器的相应一个安装孔中的上部，并通过相应的紧固件固定到相应的一个安装孔。

6. 发明授权

US06572282B1 Digital camera stand with indexed tilt feature 有权
标题翻译：带索引倾斜功能的数码相机支架
公开(公告)号：US06572282B1
公开(公告)日：2003-06-03
申请号：US10025300
申请日：2001-12-18
申请人： James M. Okuley , Mike G. MacGregor
发明人： James M. Okuley , Mike G. MacGregor
IPC分类号： G03B1700
CPC分类号： G06T1/0007 , F16M11/10 , F16M2200/024 , F16M2200/08 , H04N1/00204 , H04N2201/0058
摘要： A digital camera stand comprising a main body and a tilting body received within a cavity formed within a top portion of the main body and coupled to the main body along a pivot axis. The tilting body includes indexed portions, preferably a parallel arrangement of notches formed along the back portion of the tilting body, adapted to engage with an indexer coupled to the main body to allow indexed tilting of the tilting body relative to the main body as the indexer is engaged with a selected one of the notches. One end of a data connector is received through a shell of the tilting body and presents a data connection adapted to couple with a complementary connector on a base portion of the digital camera maintained within a pocket of the tilting body.
摘要翻译：一种数码相机支架，包括主体和倾斜主体，所述主体和倾斜体容纳在形成在所述主体的顶部内部并且沿着枢转轴线联接到所述主体的空腔内。倾斜体包括分度部分，优选地是沿着倾斜体的后部形成的凹口的平行布置，适于与连接到主体的分度器接合，以允许倾斜体相对于主体的分度倾斜作为分度器与所选择的一个凹口接合。数据连接器的一端通过倾斜体的外壳被接收，并且呈现适于与保持在倾斜体的口袋内的数字照相机的基座部分上的互补连接器耦合的数据连接。

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