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61. 发明申请

US20090300912A1 Flex Circuit Apparatus and Method for Adding Capacitance while Conserving Circuit Board Surface Area 审中-公开
标题翻译：柔性电路设备和方法，同时节省电路板表面积
公开(公告)号：US20090300912A1
公开(公告)日：2009-12-10
申请号：US12542503
申请日：2009-08-17
申请人： John Thomas , Russell Rapport , Robert Washburn
发明人： John Thomas , Russell Rapport , Robert Washburn
IPC分类号： H05K3/30
CPC分类号： H05K1/0231 , H01G4/232 , H01G4/30 , H01G4/38 , H01L23/50 , H01L23/5387 , H01L2224/16 , H01L2924/15311 , H05K1/112 , H05K1/141 , H05K1/162 , H05K2201/049 , H05K2201/10734 , Y10T29/4913
摘要： An apparatus and a method for adding capacitance while conserving circuit board surface area. An apparatus for adding capacitance while conserving circuit board surface area includes a flex capacitor circuit with an upper surface and a lower surface and a plurality of conductive layers and an integrated-circuit (IC) device mounted on to the upper surface of the flex capacitor circuit and electrically connected to the flex capacitor circuit. The flex capacitor circuit is configured to provide bypass capacitance and, therefore, adds capacitance to the IC device when the IC device is mounted on the flex capacitor circuit.
摘要翻译：一种在节省电路板表面积的同时增加电容的装置和方法。在保持电路板表面积的同时增加电容的装置包括具有上表面和下表面的柔性电容电路和多个导电层以及安装在柔性电容器电路的上表面上的集成电路（IC）装置并电连接到柔性电容器电路。柔性电容器电路被配置为提供旁路电容，并且因此当IC器件安装在柔性电容器电路上时，向IC器件增加电容。

62. 发明申请

US20090294948A1 Contrast Interposer Stacking System And Method 审中-公开
标题翻译：对比度内插系统和方法
公开(公告)号：US20090294948A1
公开(公告)日：2009-12-03
申请号：US12538757
申请日：2009-08-10
申请人： Julian Partridge , Roel Perez , Leland Szewerenko
发明人： Julian Partridge , Roel Perez , Leland Szewerenko
IPC分类号： H01L23/02 , H01L23/495
CPC分类号： H01L25/105 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/141 , H05K2201/049 , H05K2201/10378 , H05K2201/10515 , H05K2201/10689 , H01L2924/00
摘要： The present description provides increased contrast between interposer and leads in a stack embodiment that employs an interposer that extends beyond a boundary or perimeter established by the leads of the constituent IC devices.
摘要翻译：本描述提供了在堆叠实施例中的插入器和引线之间的增加的对比度，其采用延伸超过由组成IC器件的引线建立的边界或周边的插入器。

63. 发明申请

US20090267205A1 Zero-reflow TSOP stacking 审中-公开
标题翻译：零回流TSOP堆叠
公开(公告)号：US20090267205A1
公开(公告)日：2009-10-29
申请号：US12150406
申请日：2008-04-28
申请人： Paul M. Goodwin , Ron Weindorf
发明人： Paul M. Goodwin , Ron Weindorf
IPC分类号： H01L23/488
CPC分类号： H05K1/141 , H01L23/5387 , H01L25/105 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/147 , H05K1/189 , H05K3/305 , H05K3/3421 , H05K3/3478 , H05K2201/049 , H05K2201/10515 , H05K2201/10689 , H05K2203/0415 , Y02P70/613 , H01L2924/00
摘要： The present invention mechanically integrates a flexible printed circuit pre-disposed with solder and flux and two or more leaded integrated circuit packages into an assembly that does not require a solder reflow process prior to the reflow cycle to attach the assembly to a printed circuit module. Each IC device includes: (1) a package having a top, a bottom and sides; and (2) external leads that extend out from one or more sides for electrical connectivity to a printed circuit module. Each flexible circuit includes: (1) a multi-segment pattern for each IC connection where there is a segment for: (a) attaching a package lead to the flexible printed circuit; (b) a segment for attaching a preformed piece of solder and flux; (c) a bridge for the solder to flow when heated to the package lead attach segment; (2) solder and flux and (3) adhesive to bond the flexible printed circuit to the packages and bond the packages together.
摘要翻译：本发明将预先配置有焊料和焊剂的柔性印刷电路以及两个或多个引线集成电路封装机械地集成到在回流循环之前不需要回流焊工艺的组件中，以将组件附接到印刷电路模块。每个IC器件包括：（1）具有顶部，底部和侧面的封装; 和（2）从一个或多个侧面延伸出来以与印刷电路模块电连接的外部引线。每个柔性电路包括：（1）用于每个IC连接的多段图案，其中存在用于以下部分的段：（a）将封装引线附接到柔性印刷电路; （b）用于连接预成型的焊料和焊剂的段; （c）加热到封装引线连接段时焊料流动的桥; （2）焊料和焊剂，（3）粘合剂将柔性印刷电路连接到封装并将封装粘合在一起。

64. 发明申请

US20090251874A1 SOLDER BALL INTERFACE 有权
标题翻译：焊球接口
公开(公告)号：US20090251874A1
公开(公告)日：2009-10-08
申请号：US12062196
申请日：2008-04-03
申请人： Glenn Goodman
发明人： Glenn Goodman
IPC分类号： H01R9/00 , H01L21/60
CPC分类号： H05K1/141 , H05K3/3436 , H05K3/3452 , H05K2201/049 , H05K2201/0979 , H05K2201/099 , H05K2201/10689
摘要： An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling component.
摘要翻译：提供了将集成电路封装的器件引线电连接到衬底的互耦合部件。该包装包括外部装置引线，每个装置引线具有靠近封装主体一侧的向下延伸的部分，并且相互联接部件包括绝缘支撑部件。所述支撑构件包括第一表面，所述第一表面包括第一电连接位置，每个所述第一电连接位置被配置为与所述封装的相应的一个所述器件引线进行电连接。支撑构件还包括相对的第二表面，其包括与第一电连接位置电接触的第二电附接位置，每个第二电附接位置包括与每个装置引线相关联的多个焊球。多个焊球用于在基板上的每个表面安装焊盘和相互联结部件的对应导电焊盘之间形成电连接。

65. 发明授权

US07558072B2 Adapter module 有权
标题翻译：适配器模块
公开(公告)号：US07558072B2
公开(公告)日：2009-07-07
申请号：US11339582
申请日：2006-01-26
申请人： Yueh-Chih Chen , Kai-Shun Chang
发明人： Yueh-Chih Chen , Kai-Shun Chang
IPC分类号： H01R12/16
CPC分类号： H05K7/1092 , H05K1/141 , H05K2201/049 , H05K2201/10325 , H05K2201/10704
摘要： An adapter module is described. The adapter module includes a circuit board, a first socket and an adapter device. One face of the first socket is electrically connected to the circuit board on the first face of the circuit. The other face of the first socket connects to a first central processing unit (CPU). One face of the adapter base is electrically connected to the circuit board on the second face of the circuit board. The other face of the adapter base connects to a second socket. The circuit board sends signals from the second socket, through the adapter base and the first socket, to the first CPU. When the adapter base is not connected to the second socket, the second socket is capable of connecting to a second kind of CPU.
摘要翻译：描述适配器模块。适配器模块包括电路板，第一插座和适配器装置。第一插座的一个面电连接到电路的第一面上的电路板。第一插座的另一面连接到第一中央处理单元（CPU）。适配器基座的一个面电连接到电路板的第二面上的电路板。适配器底座的另一面连接到第二个插座。电路板通过适配器底座和第一个插座将信号从第二个插座发送到第一个CPU。当适配器底座未连接到第二个插座时，第二个插座能够连接到第二种CPU。

66. 发明申请

US20090168383A1 ELECTRONIC APPARATUS AND SYSTEM 审中-公开
标题翻译：电子设备和系统
公开(公告)号：US20090168383A1
公开(公告)日：2009-07-02
申请号：US12337087
申请日：2008-12-17
申请人： Katsuichi GOTO , Eiji Takizawa
发明人： Katsuichi GOTO , Eiji Takizawa
IPC分类号： H01R12/16
CPC分类号： G06F1/1658 , G06F1/1616 , G06F1/1632 , G06F1/1635 , G06F1/1684 , H01R12/79 , H05K1/141 , H05K1/147 , H05K2201/049 , H05K2201/10189
摘要： An electronic apparatus has a first circuit board and a second circuit board. The first circuit board has a first connector mounted thereto. The second circuit board has a second connector which is mounted to a first surface and is mechanically coupled to the first connector, and a third connector which is mounted to a second surface positioned on a backside of the first surface in an overlapping relation to the second connector with the second circuit board interposed between the second and third connectors, and which is mechanically coupled to a connector of an external device.
摘要翻译：电子设备具有第一电路板和第二电路板。第一电路板具有安装在其上的第一连接器。第二电路板具有第二连接器，该第二连接器被安装到第一表面并机械耦合到第一连接器，第三连接器被安装到位于第一表面的后侧上的与第二连接器重叠的第二表面连接器，其中第二电路板插入在第二和第三连接器之间，并且机械地耦合到外部设备的连接器。

67. 发明授权

US07535090B2 LSI package provided with interface module 失效
标题翻译： LSI封装提供了接口模块
公开(公告)号：US07535090B2
公开(公告)日：2009-05-19
申请号：US11015013
申请日：2004-12-20
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , H01L25/18 , H01L2924/0002 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H05K1/0268 , H05K1/141 , H05K7/023 , H05K2201/049 , H05K2201/10704 , H05K2201/10719 , H01L2924/00
摘要： A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting terminals are assigned as interposer-site monitoring terminals; a signal processing LSI mounted on the interposer; and an I/F module having a plurality of interposer-connecting terminals, which are arranged to correspond to arrangement of the module-connecting terminals, and a transmission line to establish an external interconnection of signal, which is transmitted from the signal processing LSI, part of the interposer-connecting terminals are assigned as module-site monitoring terminals. The interposer-site and module-site monitoring terminals are configured to flow a monitoring current to confirm electric contact between the signal processing LSI and the I/F module.
摘要翻译： LSI封装包括：具有板连接接头的插入件，其便于与印刷线路板的连接，以及模块连接端子，部分模块连接端子被分配为插入器位置监视端子; 安装在所述插入器上的信号处理LSI; 以及具有多个插入器连接端子的I / F模块，其被配置为对应于模块连接端子的配置，以及传输线，用于建立从信号处理LSI发送的信号的外部互连，插入器连接端子的一部分被分配为模块站点监视终端。中介站点和模块现场监视终端被配置为流动监视电流以确认信号处理LSI与I / F模块之间的电接触。

68. 发明授权

US07506092B2 Bridge card for converting a bus connection of a parallel daughter card mounted thereon to a different bus connection of a mother board 失效
标题翻译：桥接卡，用于将安装在其上的并行子卡的总线连接转换成母板的不同总线连接
公开(公告)号：US07506092B2
公开(公告)日：2009-03-17
申请号：US11555777
申请日：2006-11-02
申请人： Yi-Hsiung Su
发明人： Yi-Hsiung Su
IPC分类号： G06F13/00 , H05K1/14
CPC分类号： H05K1/144 , G06F1/185 , H05K1/117 , H05K2201/049 , H05K2201/10189
摘要： The present invention discloses an apparatus for operatively connecting a PCI-X or AGP device card (having a PCI-X or AGP bus) to a PCI-E bus connection on a mother board by mounting the PCI-X or AGP device card to a right edge connector mounted on a surface of an adapter card, the adapter card having a PCI-X (or AGP) to PCI-E bridge circuit for interconnecting a PCI-X (or AGP) bus to a PCI-E bus.
摘要翻译：本发明公开了一种用于通过将PCI-X或AGP设备卡安装到主板上来将PCI-X或AGP设备卡（具有PCI-X或AGP总线）可操作地连接到母板上的PCI-E总线连接的装置右侧连接器安装在适配器卡的表面上，适配器卡具有用于将PCI-X（或AGP）总线与PCI-E总线互连的PCI-E桥接电路的PCI-X（或AGP）。

69. 发明申请

US20080224786A1 Apparatus and method for temperature compensating an ovenized oscillator 审中-公开
标题翻译：用于温度补偿加热振荡器的装置和方法
公开(公告)号：US20080224786A1
公开(公告)日：2008-09-18
申请号：US12075589
申请日：2008-03-12
申请人： James L. Stolpman , Thomas A. Knecht , Jerry L. Shirar
发明人： James L. Stolpman , Thomas A. Knecht , Jerry L. Shirar
IPC分类号： H03B5/04 , H03L1/04
CPC分类号： H03B5/04 , H03B5/36 , H03L1/04 , H05K1/0201 , H05K1/141 , H05K3/3405 , H05K3/3436 , H05K3/403 , H05K2201/045 , H05K2201/049 , H05K2201/09181 , H05K2201/10068 , H05K2201/10151 , H05K2201/10166 , H05K2201/10371 , H05K2201/10446 , H05K2201/10462 , H05K2201/10515 , H05K2201/10651
摘要： An oscillator assembly includes an oscillator circuit that is configured to generate a frequency signal. A temperature compensation circuit is in communication with the oscillator circuit and adapted to adjust the frequency signal in response to changes in temperature. The oscillator and temperature compensation circuits are located within an oven. A heater and a temperature sensor in communication with the heater are also both located in the oven. The temperature sensor is adapted to directly control the heater in response to changes in temperature. In one embodiment, the oscillator components are mounted to a ball grid array substrate which, in turn, is mounted on a printed circuit board. In this embodiment, a resonator overlies the ball grid array substrate and a lid covers and defines an oven and enclosure for the resonator and the ball grid array substrate. The oscillator and temperature compensation circuit are defined on the ball grid array substrate.
摘要翻译：振荡器组件包括被配置为产生频率信号的振荡器电路。温度补偿电路与振荡器电路通信，并且适于根据温度变化调整频率信号。振荡器和温度补偿电路位于烤箱内。与加热器连通的加热器和温度传感器也都位于烤箱中。温度传感器适用于根据温度变化直接控制加热器。在一个实施例中，振荡器部件被安装到球栅阵列基板，该栅格阵列基板又安装在印刷电路板上。在该实施例中，谐振器覆盖在球栅阵列基板上，并且盖覆盖并限定用于谐振器和球栅阵列基板的烤箱和外壳。振荡器和温度补偿电路定义在球栅阵列基板上。

70. 发明申请

US20080174730A1 LIQUID CRYSTAL DISPLAY DEVICE 有权
标题翻译：液晶显示装置
公开(公告)号：US20080174730A1
公开(公告)日：2008-07-24
申请号：US12056622
申请日：2008-03-27
申请人： Jeoung-Gwen LEE , Seung-Je LEE , Hyun-Su PARK
发明人： Jeoung-Gwen LEE , Seung-Je LEE , Hyun-Su PARK
IPC分类号： G02F1/1337
CPC分类号： H05K1/182 , G02B6/0031 , G02B6/0055 , G02B6/0065 , G02B6/0083 , G02B6/0088 , G02B6/009 , G02F1/133308 , G02F1/1336 , G02F1/133608 , G02F1/133615 , G02F1/13452 , G02F2001/133314 , G02F2201/465 , G06F1/1616 , G06F1/1637 , G06F1/1654 , H04M1/22 , H05K1/141 , H05K1/148 , H05K3/366 , H05K2201/049 , H05K2201/1003 , H05K2201/10189
摘要： Disclosed is a liquid crystal display device of which overall size and weight can be minimized. The liquid crystal display device has a light generating unit for generating a light. A light guiding plate guides the light to a display unit for displaying an image. A reflection plate is disposed under the light guiding plate for reflecting the light to the light guiding plate. A receiving container receives the reflection plate, the light guiding plate and the light generating unit. At least one boss is formed on a bottom of the receiving container for preventing the light generating unit from being moved by guiding a position of the light generating unit. Accordingly, the number of the parts installed in the liquid crystal display device can be reduced, and the manufacturing cost can be decreased because the manufacturing process is simplified in comparison with the liquid crystal display device including a separate lamp cover.
摘要翻译：公开了一种液晶显示装置，其总体尺寸和重量可以最小化。液晶显示装置具有用于产生光的光产生单元。导光板将光引导到用于显示图像的显示单元。反射板设置在导光板的下方，用于将光反射到导光板。接收容器容纳反射板，导光板和光产生单元。在接收容器的底部形成有至少一个凸台，用于通过引导光产生单元的位置来防止光产生单元的移动。因此，与包括单独的灯罩的液晶显示装置相比，可以减少安装在液晶显示装置中的部件的数量，并且制造成本可以降低，因为制造工艺简化。

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