会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 61. 发明申请
    • METHOD AND SYSTEM FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE WITH WAVELENGTH CONVERSION LAYERS HAVING CONTROLLED COLOR CHARACTERISTICS
    • 用于制造具有控制颜色特性的波长转换层的发光二极管(LED)数位板的方法和系统
    • US20130065327A1
    • 2013-03-14
    • US13562519
    • 2012-07-31
    • Jui-Kang YenGeorg SoerensenMark Ewing Tuttle
    • Jui-Kang YenGeorg SoerensenMark Ewing Tuttle
    • H01L33/50
    • H01L33/501H01L33/0095H01L2933/0041
    • A method for fabricating light emitting diode (LED) dice includes the steps of coating a transparent substrate with a wavelength conversion material, continuously evaluating a correlated color temperature (CCT) of the output electromagnetic radiation produced by the wavelength conversion material and comparing the correlated color temperature (CCT) to a target correlated color temperature (CCT), and controlling the coating step responsive to feedback from the evaluating and comparing step to adjust the correlated color temperature (CCT) to achieve the target correlated color temperature (CCT). A system for fabricating light emitting diode (LED) dice includes a coating system, a monitoring system, and a control system configured to control the coating system to adjust the correlated color temperature (CCT) of the wavelength conversion material on the transparent substrate to achieve the target correlated color temperature (CCT).
    • 制造发光二极管(LED)晶片的方法包括以下步骤:用波长转换材料涂覆透明衬底,连续评估由波长转换材料产生的输出电磁辐射的相关色温(CCT),并比较相关色彩 温度(CCT)到目标相关色温(CCT),并且响应于来自评估和比较步骤的反馈来控制涂层步骤以调节相关色温(CCT)以实现目标相关色温(CCT)。 一种用于制造发光二极管(LED)裸片的系统包括涂层系统,监测系统和控制系统,其被配置为控制涂层系统以调节透明衬底上的波长转换材料的相关色温(CCT)以实现 目标相关色温(CCT)。
    • 65. 发明授权
    • Vertical light emitting diode (VLED) die having electrode frame and method of fabrication
    • 具有电极框架和制造方法的垂直发光二极管(VLED)芯片
    • US08283652B2
    • 2012-10-09
    • US12845007
    • 2010-07-28
    • Chen-Fu ChuFeng-Hsu FanHao-Chun ChengTrung Tri Doan
    • Chen-Fu ChuFeng-Hsu FanHao-Chun ChengTrung Tri Doan
    • H01L33/04
    • H01L33/38H01L33/32H01L33/405H01L33/44H01L33/641H01L33/647
    • A vertical light emitting diode (VLED) die includes a metal base; a mirror on the metal base; a p-type semiconductor layer on the reflector layer; a multiple quantum well (MQW) layer on the p-type semiconductor layer configured to emit light; and an n-type semiconductor layer on the multiple quantum well (MQW) layer. The vertical light emitting diode (VLED) die also includes an electrode and an electrode frame on the n-type semiconductor layer, and an organic or inorganic material contained within the electrode frame. The electrode and the electrode frame are configured to provide a high current capacity and to spread current from the outer periphery to the center of the n-type semiconductor layer. The vertical light emitting diode (VLED) die can also include a passivation layer formed on the metal base surrounding and electrically insulating the electrode frame, the edges of the mirror, the edges of the p-type semiconductor layer, the edges of the multiple quantum well (MQW) layer and the edges of the n-type semiconductor layer.
    • 垂直发光二极管(VLED)模具包括金属基底; 金属底座上的镜子; 反射层上的p型半导体层; 配置成发光的p型半导体层上的多量子阱(MQW)层; 和多量子阱(MQW)层上的n型半导体层。 垂直发光二极管(VLED)裸片还包括在n型半导体层上的电极和电极框架,以及包含在电极框架内的有机或无机材料。 电极和电极框架被配置为提供高电流容量并且将电流从外周延伸到n型半导体层的中心。 垂直发光二极管(VLED)裸片还可以包括形成在金属基底上的钝化层,该钝化层围绕并电绝缘电极框架,反射镜的边缘,p型半导体层的边缘,多个量子的边缘 (MQW)层和n型半导体层的边缘。
    • 70. 发明授权
    • Light-emitting diode lamp with low thermal resistance
    • 具有低热阻的发光二极管灯
    • US07863639B2
    • 2011-01-04
    • US11279530
    • 2006-04-12
    • Jui-Kang Yen
    • Jui-Kang Yen
    • H01L33/00
    • H01L33/647H01L24/73H01L33/486H01L33/641H01L2224/32225H01L2224/48227H01L2224/73265H01L2924/00012
    • A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a metal substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning it on the bottom of the light-emitting diode structure. This metal plate can then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively connected through several heat conduction layers to a large heat sink that may be included in the structure.
    • 提供了一种具有比传统LED灯具更低热传导路径的发光二极管(LED)结构。 对于一些实施例,提供了一种可表面安装的发光二极管结构,其具有沉积在金属基板上的有源层,该有源层直接接合到金属板上,该金属板通过将其定位在发光二极管的底部而基本上暴露于低热阻 结构体。 然后将该金属板焊接到包括散热器的印刷电路板(PCB)。 对于本发明的一些实施例,金属板通过几个导热层被热导电地连接到可以包括在结构中的大型散热器。