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61. 发明授权

US5168887A Single wafer processor apparatus 失效
标题翻译：单波长加工设备
公开(公告)号：US5168887A
公开(公告)日：1992-12-08
申请号：US526243
申请日：1990-05-18
申请人： Raymon F. Thompson , Aleksander Owczarz
发明人： Raymon F. Thompson , Aleksander Owczarz
IPC分类号： B08B11/02 , G11B7/26 , H01L21/00 , H01L21/304 , H01L21/306 , H01L21/677 , H01L21/683 , H01L21/687
CPC分类号： H01L21/6719 , H01L21/6708 , H01L21/67086 , H01L21/68707 , H01L21/68728 , H01L21/68785 , H01L21/68792 , G11B7/26 , Y10S134/902
摘要： A single wafer processing apparatus includes a portable processing head that can be a portable module or a movable unit mounted to a supporting machine frame. The processing head has movable fingers adapted to grip a wafer. The fingers protrude from a protective wafer plate. Indexing and rotation monitoring assemblies are provided for automation of the wafer processing steps. A complementary processing base includes an upwardly-open bowl that receives a wafer held by the portable processing head. It has a full-diameter movable bottom wall for rapid draining purposes. Liquid and/or gas jets and nozzles supply fluids required within the bowl for processing of wafers.
摘要翻译：单个晶片处理装置包括便携式处理头，其可以是安装到支撑机架的便携式模块或可移动单元。处理头具有适于夹紧晶片的活动指状物。指状物从保护性晶片板突出。提供分度和旋转监测组件用于晶片处理步骤的自动化。补充处理基座包括接收由便携式处理头保持的晶片的向上开口的碗。它具有用于快速排水的全直径可移动底壁。液体和/或气体喷嘴和喷嘴提供碗内所需的流体用于处理晶片。

62. 发明授权

US5154199A Semiconductor processor draining 失效
标题翻译：半导体处理器排水
公开(公告)号：US5154199A
公开(公告)日：1992-10-13
申请号：US653491
申请日：1991-02-08
申请人： Raymon F. Thompson , Aleksander Owczarz
发明人： Raymon F. Thompson , Aleksander Owczarz
IPC分类号： H01L21/304 , B08B3/02 , G03F1/08 , H01L21/00
CPC分类号： H01L21/67028 , B08B3/02 , Y10S134/902
摘要： Rinser dryer system for rising process chemical from silicon or gallium arsenide wafers, substrates, masks or disks and drying of silicon or gallium arsenide wafers, substrates, masks or disks positioned in a wafer cassette. A wafer cassette is positioned in a rotor assembly and the rotor assembly positioned within a removable heated chamber bowl. The wafer cassette rotates past rising and drying manifold nozzles. The removable chamber bowl is secured to a rinser mounting plate by quick disconnect hardware for removal and for external cleansing. A broken chip collector in a lower portion of an exhaust manifold assembly removes small broken chip remains. An acidity sensor is positioned in a bottom portion of the exhaust manifold assembly for monitoring rinse effluent during the rising process. A gated exhaust valve in an exhaust gas manifold of the exhaust manifold assembly provides for gases to exhaust to an external location. A computer controls cycling of the process modes as the silicon or gallium arsenide wafers, substrates, masks or disks are sprayed, washed, rinsed, and dried.

63. 发明授权

US5085560A Low contamination blending and metering systems for semiconductor processing 失效
标题翻译：用于半导体加工的低污染混合和计量系统
公开(公告)号：US5085560A
公开(公告)日：1992-02-04
申请号：US464101
申请日：1990-01-12
申请人： Raymon F. Thompson , Aleksander Owczarz
发明人： Raymon F. Thompson , Aleksander Owczarz
IPC分类号： B01F3/08 , F04B9/105 , F04B43/08 , H01L21/00
CPC分类号： H01L21/67023 , B01F3/088 , F04B43/08 , F04B9/105
摘要： Blending and pumping systems for accurately delivering desired amounts of processing fluids, particularly for use in semiconductor processing and semiconductor processors. Thee blending systems include one or more supply tanks from which a processing fluid is accurately pumped using the novel metering pump and associated pumping and blending methods. The blending systems preferably include a recycle line which includes a control valve which is controlled to recycle process fluid during an initial startup period. The outflow from the pump is preferably totally recycled during this startup period by blocking flow of process fluid to the blending container. The metering pump includes a pump housing having a pumping chamber which is partially defined by a displacement member, such as a flexible bellows structure. The pumping chamber is isolated from inlet and outlet via inlet and outlet valves, respectively. The inlet and outlet valves are positively controlled into open and closed positions using a control system which preferably includes an elctronic controller. The controller appropriately sequences the operation of the pump inlet and outlet valves relative to a displacement member actuator which drives the displacement member. The control is preferably accomplished by using electrically operated solenoid valves which control the flow of an intermediary control fluid, such as air or other suitable gas. The invention further includes methods of blending and pumping to provide accurate and low contamination of the process fluids being metered.
摘要翻译：用于精确输送所需量的处理流体的混合和泵送系统，特别是用于半导体处理和半导体处理器。您的混合系统包括一个或多个供应罐，使用新颖的计量泵以及相关联的泵送和混合方法，精确地泵送处理流体。混合系统优选地包括循环管线，其包括控制阀，控制阀在初始启动期间被控制以再循环过程流体。泵的流出优选在该启动期间通过阻止加工流体流入混合容器而完全再循环。计量泵包括具有泵送室的泵壳体，该泵室部分地由位移构件限定，例如柔性波纹管结构。泵送室分别通过入口和出口阀从入口和出口隔离。使用优选包括电子控制器的控制系统将入口和出口阀积极地控制到打开和关闭位置。控制器适当地排列泵入口和出口阀相对于驱动位移构件的位移构件致动器的操作。该控制优选通过使用控制中间控制流体（例如空气或其它合适气体）的流动的电动电磁阀来实现。本发明还包括混合和泵送的方法，以提供准确和低污染待测量的工艺流体。

64. 发明授权

US07542134B2 System, method and apparatus for in-situ substrate inspection 有权
标题翻译：用于原位底物检查的系统，方法和装置
公开(公告)号：US07542134B2
公开(公告)日：2009-06-02
申请号：US12131909
申请日：2008-06-02
申请人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.
摘要翻译：用于检查基板的系统包括照相机和光源。相机朝向视场。该视场包括该基板的第一表面的至少第一部分。光源相对于衬底的第一表面以第一角度β朝向视场定向。也包括检查基板的方法。

65. 发明申请

US20080273195A1 SYSTEM, METHOD AND APPARATUS FOR IN-SITU SUBSTRATE INSPECTION 有权
标题翻译：用于现场基板检查的系统，方法和装置
公开(公告)号：US20080273195A1
公开(公告)日：2008-11-06
申请号：US12131909
申请日：2008-06-02
申请人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
IPC分类号： G01N21/00 , H01L21/66
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.
摘要翻译：用于检查基板的系统包括照相机和光源。相机朝向视场。该视场包括该基板的第一表面的至少第一部分。光源相对于衬底的第一表面以第一角度β朝向视场定向。也包括检查基板的方法。

66. 发明授权

US07309618B2 Method and apparatus for real time metal film thickness measurement 有权
标题翻译：用于实时金属膜厚度测量的方法和装置
公开(公告)号：US07309618B2
公开(公告)日：2007-12-18
申请号：US10463525
申请日：2003-06-18
申请人： Yehiel Gotkis , Rodney Kistler , Aleksander Owczarz , David Hemker , Nicolas J. Bright
发明人： Yehiel Gotkis , Rodney Kistler , Aleksander Owczarz , David Hemker , Nicolas J. Bright
IPC分类号： H01L21/00
CPC分类号： B24B37/013 , B24B1/005 , B24B49/105 , B24B57/02 , H01L21/67253
摘要： A semiconductor processing system is provided. The semiconductor processing system includes a first sensor configured to isolate and measure a film thickness signal portion for a wafer having a film disposed over a substrate. A second sensor is configured to detect a film thickness dependent signal in situ during processing, i.e. under real process conditions and in real time. A controller configured to receive a signal from the first sensor and a signal from the second sensor. The controller is capable of determining a calibration coefficient from data represented by the signal from the first sensor. The controller is capable of applying the calibration coefficient to the data associated with the second sensor, wherein the calibration coefficient substantially eliminates inaccuracies introduced to the film thickness dependent signal from the substrate. A method for calibrating an eddy current sensor is also provided.
摘要翻译：提供半导体处理系统。半导体处理系统包括：第一传感器，被配置为隔离和测量具有设置在基板上的膜的晶片的膜厚度信号部分。第二传感器被配置为在处理期间，即在实际工艺条件下和实时地在原位检测膜厚依赖信号。控制器，被配置为从第一传感器接收信号和来自第二传感器的信号。控制器能够根据来自第一传感器的信号表示的数据确定校准系数。控制器能够将校准系数应用于与第二传感器相关联的数据，其中校准系数基本上消除了从衬底引入与膜厚度相关的信号的不准确性。还提供了用于校准涡流传感器的方法。

67. 发明申请

US20060139450A1 System, method and apparatus for in-situ substrate inspection 失效
公开(公告)号：US20060139450A1
公开(公告)日：2006-06-29
申请号：US11016022
申请日：2004-12-17
申请人： Aleksander Owczarz , Jaroslaw Winniczek , Luai Nasser , Alan Schoepp , Fred Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw Winniczek , Luai Nasser , Alan Schoepp , Fred Redeker , Erik Edelberg
IPC分类号： H04N7/18 , H04N9/47
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.

68. 发明申请

US20050066739A1 Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring 审中-公开
标题翻译：用于晶片机械应力监测和晶片热应力监测的方法和装置
公开(公告)号：US20050066739A1
公开(公告)日：2005-03-31
申请号：US10671978
申请日：2003-09-26
申请人： Yehiel Gotkis , Rodney Kistler , Aleksander Owczarz , David Hemker , Nicolas Bright
发明人： Yehiel Gotkis , Rodney Kistler , Aleksander Owczarz , David Hemker , Nicolas Bright
IPC分类号： B24B37/04 , B24B49/14 , B24B49/16 , G01L1/00
CPC分类号： B24B37/015 , B24B49/16
摘要： A chemical mechanical planarization (CMP) system is provided. The CMP system includes a wafer carrier configured to support a wafer during a planarization process, the wafer carrier including a sensor configured to detect a signal indicating a stress being experienced by the wafer during planarization. A computing device in communication with the sensor is included. The computing device is configured to translate the signal to generate a stress map for analysis. A stress relief device responsive to a signal received from the computing device is included. The stress relief device is configured to relieve the stress being experienced by the wafer.
摘要翻译：提供化学机械平面化（CMP）系统。 CMP系统包括被配置为在平坦化处理期间支撑晶片的晶片载体，晶片载体包括被配置成在平坦化期间检测指示由晶片经历的应力的信号的传感器。包括与传感器通信的计算设备。计算设备被配置为平移信号以产生用于分析的应力图。包括响应于从计算设备接收的信号的应力消除装置。应力释放装置被构造成减轻晶片经历的应力。

69. 发明申请

US20050007107A1 Complementary sensors metrological process and method and apparatus for implementing the same 失效
标题翻译：互补传感器计量过程及其实现方法和装置
公开(公告)号：US20050007107A1
公开(公告)日：2005-01-13
申请号：US10914017
申请日：2004-08-05
申请人： Yehiel Gotkis , Rodney Kistler , Aleksander Owczarz , David Hemker , Nicolas Bright
发明人： Yehiel Gotkis , Rodney Kistler , Aleksander Owczarz , David Hemker , Nicolas Bright
IPC分类号： H01L21/66 , G01B7/06
CPC分类号： H01L22/26
摘要： A method for detecting a thickness of a layer of a wafer to be processed is provided. The method includes defining a plurality of sensors configured to create a set of complementary sensors proximate the wafer. Further included in the method is distributing the plurality of sensors along a particular radius of the wafer such that each sensor of the plurality of sensors is out of phase with an adjacent sensor by a same angle. The method also includes measuring signals generated by the plurality of sensors. Further included is averaging the signals generated by the plurality of sensors so as to generate a combination signal. The averaging is configured to remove noise from the combination signal such that the combination signal is capable of being correlated to identify the thickness of the layer.
摘要翻译：提供了一种用于检测待处理晶片层的厚度的方法。该方法包括限定配置成在晶片附近产生一组互补传感器的多个传感器。该方法中还包括沿着晶片的特定半径分布多个传感器，使得多个传感器中的每个传感器与相邻的传感器相异相同角度。该方法还包括测量由多个传感器产生的信号。还包括对由多个传感器产生的信号进行平均以产生组合信号。平均化被配置为从组合信号去除噪声，使得组合信号能够被相关联以识别层的厚度。

70. 发明授权

US06769961B1 Chemical mechanical planarization (CMP) apparatus 失效
标题翻译：化学机械平面化（CMP）装置
公开(公告)号：US06769961B1
公开(公告)日：2004-08-03
申请号：US10345694
申请日：2003-01-15
申请人： Rodney C. Kistler , Aleksander Owczarz
发明人： Rodney C. Kistler , Aleksander Owczarz
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B37/26 , B24B57/02
摘要： A chemical mechanical planarization (CMP) apparatus includes a bath of an aqueous solution. A first holder, which is configured to support a wafer, is disposed within the bath. A first spindle is configured to rotate the first holder. A second holder, which is rotated by a second spindle, is disposed above the first holder. The second holder supports a planarization media, which is disposed within the bath. The planarization media is oriented to face the surface of the first holder on which the wafer is to be supported. The planarization media can be a pad containing polyurethane or a substrate having an overlying abrasive film. The CMP apparatus also can include a system for recirculating and reconditioning the aqueous solution. A method for performing a CMP process also is described.
摘要翻译：化学机械平面化（CMP）装置包括水溶液浴。被配置为支撑晶片的第一保持器设置在浴槽内。第一主轴构造成旋转第一保持器。由第二主轴旋转的第二保持器设置在第一保持器的上方。第二支架支撑设置在浴槽内的平坦化介质。平面化介质被定向为面对要在其上支撑晶片的第一保持器的表面。平坦化介质可以是含有聚氨酯的垫或具有上覆磨料膜的基材。 CMP设备还可以包括用于再循环和修复水溶液的系统。还描述了用于执行CMP处理的方法。

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