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61. 发明授权

US06461892B2 Methods of making a connection component using a removable layer 失效
标题翻译：使用可拆卸层制作连接组件的方法
公开(公告)号：US06461892B2
公开(公告)日：2002-10-08
申请号：US09757968
申请日：2001-01-10
申请人： Masud Beroz
发明人： Masud Beroz
IPC分类号： H01L2120
CPC分类号： H01L21/6835 , H01L21/4853 , H01L21/4857 , H01L2221/68377 , H01L2224/05568 , H01L2224/05573 , H01L2224/11 , H01L2924/00014 , H01L2224/05599
摘要： A method of making a connection component includes providing a removable layer having first and second surfaces and forming vias at spaced apart first locations of the removable layer. A conductive material, such as copper, is deposited over the first surface of the removable layer and in each of the vias to form one or more flexible leads including projections which extend downwardly in the vias toward the removable layer. Each lead includes a first end integrally connected with one of the projections and a second end remote from the first end. A substrate is provided over the conductive material. The removable layer is removed so that the first and second ends of the leads are movable away from one another. As a result, at least first or second ends of the leads are connected to the substrate without using a bonding or welding step.
摘要翻译：制造连接部件的方法包括提供具有第一和第二表面的可移除层，并且在可移除层的间隔开的第一位置处形成通孔。诸如铜的导电材料沉积在可移除层的第一表面上并且在每个通孔中以形成一个或多个柔性引线，其包括在通孔中朝向可移除层向下延伸的突起。每个引线包括与其中一个突起一体连接的第一端和远离第一端的第二端。在导电材料上方设置基板。去除可移除层，使得引线的第一和第二端彼此远离地移动。结果，在不使用接合或焊接步骤的情况下，引线的至少第一端或第二端连接到基板。

62. 发明授权

US06384475B1 Lead formation using grids 有权
标题翻译：使用网格的铅形成
公开(公告)号：US06384475B1
公开(公告)日：2002-05-07
申请号：US09535620
申请日：2000-03-27
申请人： Masud Beroz , Belgacem Haba , Christopher M. Pickett
发明人： Masud Beroz , Belgacem Haba , Christopher M. Pickett
IPC分类号： H01L2348
CPC分类号： H01L23/49827 , H01L21/4846 , H01L21/563 , H01L2224/73203 , H01L2924/01079
摘要： A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The top and bottom elements are moved away from one another, thereby breaking the frangible elements and deforming the leads towards a vertically extensive disposition. A flowable composition such as dielectric material may be injected around the leads during or after the moving step. The resulting unit may be used to form permanent or temporary connections between microelectronic elements.
摘要翻译：用于制造微电子单元的部件包括散布引线的网格，各个引线的端部通过易碎元件彼此连接。每个引线的一端结合到顶部元件，并且每个引线的另一端结合到底部元件。顶部和底部元件彼此远离，从而破坏易碎元件并使引线变形成垂直方向的布置。可移动组合物如介电材料可以在移动步骤期间或之后在引线周围注入。所得到的单元可用于在微电子元件之间形成永久或临时连接。

63. 发明授权

US06338982B1 Enhancements in framed sheet processing 有权
公开(公告)号：US06338982B1
公开(公告)日：2002-01-15
申请号：US09688397
申请日：2000-10-16
申请人： Masud Beroz , Thomas H. DiStefano , Matthew T. Hendrickson , David Light , John W. Smith
发明人： Masud Beroz , Thomas H. DiStefano , Matthew T. Hendrickson , David Light , John W. Smith
IPC分类号： H01L2102
CPC分类号： H01L24/86 , B29C2043/5825 , H01L21/67144 , H01L2224/7965 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/30105 , Y10S269/909 , Y10T29/53265 , Y10T29/53435 , Y10T428/23 , Y10T428/239 , H01L2924/00
摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

64. 发明授权

US06334942B1 Selective removal of dielectric materials and plating process using same 有权
公开(公告)号：US06334942B1
公开(公告)日：2002-01-01
申请号：US09247156
申请日：1999-02-09
申请人： Belgacem Haba , Irina Poukhova , Masud Beroz
发明人： Belgacem Haba , Irina Poukhova , Masud Beroz
IPC分类号： C25D502
CPC分类号： H01L21/4828 , C25D7/12 , H05K3/062 , H05K3/108 , H05K3/4092 , H05K2203/0597 , H05K2203/095 , H05K2203/105 , H05K2203/1184
摘要： A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.

65. 发明授权

US06217972B1 Enhancements in framed sheet processing 有权
标题翻译：框架式加工中的增强功能
公开(公告)号：US06217972B1
公开(公告)日：2001-04-17
申请号：US09173797
申请日：1998-10-16
申请人： Masud Beroz , Thomas H. DiStefano , Matthew T. Hendrickson , David Light , John W. Smith
发明人： Masud Beroz , Thomas H. DiStefano , Matthew T. Hendrickson , David Light , John W. Smith
IPC分类号： B32B104
CPC分类号： H01L24/86 , B29C2043/5825 , H01L21/67144 , H01L2224/7965 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/30105 , Y10S269/909 , Y10T29/53265 , Y10T29/53435 , Y10T428/23 , Y10T428/239 , H01L2924/00
摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.
摘要翻译：用于制造微电子部件的柔性片被保持在由刚性材料形成的框架上，使得框架在处理期间将片材保持在张力下，从而稳定片材的尺寸。框架可以由诸如玻璃的刚性透光材料形成，并且框架和片材之间的结合可以由透射通过框架的光制成或释放。框架板的优选特征使得诸如蚀刻溶液的处理液体的捕获最小化，从而最小化步骤之间的处理溶液的携带。框架可以具有接触开口，其允许通过携带电镀或蚀刻电流的电极在片材上接合金属层，而不会干扰要形成或处理特征的片材的主要部分。

66. 发明授权

US08975616B2 Quantum efficiency of multiple quantum wells 有权
标题翻译：多量子阱的量子效率
公开(公告)号：US08975616B2
公开(公告)日：2015-03-10
申请号：US13541559
申请日：2012-07-03
申请人： Liang Wang , Ilyas Mohammed , Masud Beroz
发明人： Liang Wang , Ilyas Mohammed , Masud Beroz
IPC分类号： H01L29/06 , H01L31/00 , H01L33/06 , H01L31/0352 , H01L31/105 , H01L33/24 , H01S5/20 , H01S5/34 , H01S5/343 , H01S5/32
CPC分类号： H01L33/0075 , B82Y20/00 , H01L31/035236 , H01L31/105 , H01L33/0025 , H01L33/0066 , H01L33/06 , H01L33/24 , H01L33/32 , H01L33/62 , H01L2933/0033 , H01L2933/0066 , H01S5/2009 , H01S5/3205 , H01S5/3407 , H01S5/34333
摘要： Improved quantum efficiency of multiple quantum wells. In accordance with an embodiment of the present invention, an article of manufacture includes a p side for supplying holes and an n side for supplying electrons. The article of manufacture also includes a plurality of quantum well periods between the p side and the n side, each of the quantum well periods includes a quantum well layer and a barrier layer, with each of the barrier layers having a barrier height. The plurality of quantum well periods include different barrier heights.
摘要翻译：提高多量子阱的量子效率。根据本发明的实施例，制品包括用于供应空穴的p侧和用于提供电子的n侧。制品还包括在p侧和n侧之间的多个量子阱周期，每个量子阱周期包括量子阱层和阻挡层，其中每个势垒层具有势垒高度。多个量子阱周期包括不同的屏障高度。

67. 发明授权

US08963013B2 Three dimensional interposer device 有权
标题翻译：三维内插器
公开(公告)号：US08963013B2
公开(公告)日：2015-02-24
申请号：US13311501
申请日：2011-12-05
申请人： Masud Beroz
发明人： Masud Beroz
IPC分类号： H05K1/03 , H05K7/10 , H01L21/48 , H01L23/498 , G01R1/04 , G01R1/073
CPC分类号： H05K7/1061 , G01R1/0416 , G01R1/07378 , H01L21/486 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , Y10T29/49208 , H01L2924/00
摘要： A three-dimensional grid array interposer includes first and second arrays of electrical terminals arranged in grid-like patterns having grid pitches of (X1,Y1) and (X2,Y2), where each electrical terminal of the first array corresponds to an electrical terminal of the second array, forming a corresponding pair of electrical terminals. The interposer also includes a plurality of stacked substrates, each substrate having a first surface, a second surface, a first edge, and a second edge, with each substrate having a row of electrical terminals of the first array along the first surface at the first edge and a row of electrical terminals of the second array along the first surface at its second edge, with a trace running along the first surface between each electrical terminal of each corresponding pair of electrical terminals. Spacers can be used to provide desired space transformation.
摘要翻译：三维栅格阵列插入器包括布置成具有（X1，Y1）和（X2，Y2）的网格间距的网格状图案的第一和第二电端子阵列，其中第一阵列的每个电端子对应于电端子的第二阵列，形成相应的一对电端子。插入器还包括多个堆叠的衬底，每个衬底具有第一表面，第二表面，第一边缘和第二边缘，每个衬底在第一表面具有沿着第一表面的第一阵列的一排电端子边缘和一排第二阵列的电端子沿其第一边缘处的第一表面，沿着每个对应的一对电端子的每个电端子之间的第一表面延伸的迹线。间隔器可用于提供所需的空间变换。

68. 发明授权

US08525314B2 Stacked packaging improvements 有权
公开(公告)号：US08525314B2
公开(公告)日：2013-09-03
申请号：US11666975
申请日：2005-11-03
申请人： Belgacem Haba , Craig S. Mitchell , Masud Beroz
发明人： Belgacem Haba , Craig S. Mitchell , Masud Beroz
IPC分类号： H01L23/02
CPC分类号： H01L24/81 , H01L21/56 , H01L21/78 , H01L23/49575 , H01L23/49833 , H01L24/48 , H01L24/97 , H01L25/105 , H01L25/18 , H01L25/50 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/1023 , H01L2225/1029 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/15311 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the leads project from this substrate. Lead frame (452) is joined to a further substrate (470) with one or more microelectronic elements (436, 404, 406) disposed between the substrates.

69. 发明申请

US20130214296A1 HEAT SPREADING SUBSTRATE WITH EMBEDDED INTERCONNECTS 有权
标题翻译：具有嵌入式互连的热传播基板
公开(公告)号：US20130214296A1
公开(公告)日：2013-08-22
申请号：US13399941
申请日：2012-02-17
申请人： Ilyas Mohammed , Masud Beroz
发明人： Ilyas Mohammed , Masud Beroz
IPC分类号： H01L33/62 , H01L21/50
CPC分类号： H01L21/4853 , H01L21/486 , H01L21/52 , H01L21/768 , H01L23/142 , H01L23/49568 , H01L24/97 , H01L2224/16225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2924/01322 , H01L2924/12041 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要： Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.
摘要翻译：具有嵌入式互连的散热基板。在根据本发明的实施例中，一种装置包括金属平行六面体，其包括金属平行六面体内的多根线。多根金属线具有与金属平行六面体不同的晶粒结构。多个导线与金属平行六面体电绝缘。多个电线可以彼此电隔离。

70. 发明申请

US20130126867A1 HIGH YIELD SUBSTRATE ASSEMBLY 有权
公开(公告)号：US20130126867A1
公开(公告)日：2013-05-23
申请号：US13462676
申请日：2012-05-02
申请人： Liang Wang , Ilyas Mohammed , Masud Beroz
发明人： Liang Wang , Ilyas Mohammed , Masud Beroz
IPC分类号： H01L29/06 , H01L29/04 , H01L29/12 , H01L33/08 , H01L21/20
CPC分类号： H01L23/562 , H01L21/02002 , H01L21/02035 , H01L21/02378 , H01L21/02381 , H01L21/02389 , H01L21/02392 , H01L21/02395 , H01L21/02414 , H01L21/6835 , H01L23/544 , H01L24/19 , H01L24/32 , H01L24/83 , H01L25/50 , H01L27/0207 , H01L33/005 , H01L33/0062 , H01L2924/12041 , H01L2924/12042 , H01L2924/13091 , H01L2924/351 , H01L2924/00
摘要： High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.

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