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1. 发明授权

US10012079B2 Self healing salt water barrier 有权
公开(公告)号：US10012079B2
公开(公告)日：2018-07-03
申请号：US11942638
申请日：2007-11-19
申请人： Thomas W. Beihoffer , Nataliya V. Larionova , Marek R. Mosiewicz
发明人： Thomas W. Beihoffer , Nataliya V. Larionova , Marek R. Mosiewicz
IPC分类号： E21D11/38 , B32B27/12 , E02D31/00 , B32B5/02 , B32B7/04 , B32B7/08 , B32B7/12 , B32B27/14 , B32B27/30 , B32B3/02
CPC分类号： E21D11/383 , B32B3/02 , B32B5/022 , B32B5/024 , B32B7/05 , B32B7/08 , B32B7/12 , B32B27/12 , B32B27/14 , B32B27/304 , B32B2255/02 , B32B2262/0246 , B32B2262/0253 , B32B2262/0261 , B32B2262/0276 , B32B2262/0292 , B32B2262/04 , B32B2262/101 , B32B2262/105 , B32B2307/714 , B32B2307/7145 , B32B2307/726 , B32B2307/7265 , B32B2307/728 , B32B2307/762 , B32B2419/00 , B32B2581/00 , B32B2607/00 , E02D31/004 , Y10T156/10 , Y10T428/23 , Y10T428/24942 , Y10T442/30 , Y10T442/60
摘要： Geocomposite articles that can provide a barrier against high conductivity water e.g., ocean water, are described and their method of manufacture, for waterproofing surfaces that contact high conductivity water. The geocomposite article mat includes a woven or non-woven geotextile sheet or mat containing a powdered or granular partially cross-linked acrylamide/acrylate/acrylic acid copolymer across its entire major surface(s). The powdered or granular copolymer has an unexpectedly high free-swell when hydrated with High Conductivity water, such as ocean water. A liquid-impermeable cover sheet is adhered to the upper major surfaces of the filled copolymer-carrying geotextile to provide a primary high conductivity water barrier layer that, if ruptured, is sealed by the swell of an underlying layer of water-insoluble, partially cross-linked acrylamide/acrylic acid copolymer.

2. 发明授权

US09986785B2 Laminate and method for making laminate 有权
公开(公告)号：US09986785B2
公开(公告)日：2018-06-05
申请号：US15073178
申请日：2016-03-17
申请人： NIKE, Inc.
发明人： N. Spencer Stone , Sui-Chieh Yu , Denis Schiller , Ruzica Krstic
IPC分类号： A43B13/04 , A43B7/14 , A43B13/14 , A43B13/26 , B29C45/14 , B29D35/14 , B32B25/08 , C08J5/12 , A43B13/12 , B29D35/00 , A43B13/22 , B32B27/08 , B32B3/08 , B32B3/30 , B32B7/10 , B32B7/12 , A43B13/16 , B29C39/02 , B29C43/14 , B29C35/02 , B29K9/06 , B29K21/00 , B29K67/00 , B29K75/00 , B29K621/00 , B29K105/04
CPC分类号： A43B13/04 , A43B7/1425 , A43B7/1435 , A43B7/144 , A43B13/12 , A43B13/122 , A43B13/141 , A43B13/16 , A43B13/223 , A43B13/26 , B29C35/02 , B29C39/025 , B29C43/146 , B29C45/14 , B29C45/14811 , B29D35/0009 , B29D35/142 , B29K2009/06 , B29K2021/00 , B29K2067/06 , B29K2075/00 , B29K2105/04 , B29K2621/00 , B32B3/08 , B32B3/30 , B32B7/10 , B32B7/12 , B32B25/08 , B32B27/08 , B32B2250/03 , B32B2250/24 , B32B2274/00 , B32B2437/02 , C08J5/121 , Y10T428/22 , Y10T428/23 , Y10T428/31551 , Y10T428/31826
摘要： A method of insert molding comprises placing in a first mold a curable rubber composition comprising a reactive species; placing on a surface of the rubber composition a first thermoplastic material in a film or layer comprising a group reactive with the reactive species of the rubber composition; curing the rubber composition in the mold to form a first molded article of cured rubber having a first thermoplastic material layer covalently bonded through reactive of the reactive species and the group; placing the first molded article as an insert into a second mold, the cured rubber contacting an inside surface of the second mold and the thermoplastic layer facing into the second mold cavity; closing the second mold and injecting into the second mold a second thermoplastic material that to form a second molded article comprising the first molded article thermally welded and/or covalently bonded to the second thermoplastic material.

3. 发明授权

US09902142B2 Part comprising a structure and a shape memory alloy element 有权
公开(公告)号：US09902142B2
公开(公告)日：2018-02-27
申请号：US14606251
申请日：2015-01-27
申请人： SNECMA
发明人： Adrien Fabre , Pierrick Jean , Jean-Pierre Lombard
IPC分类号： B32B38/00 , F01D5/16 , F01D5/26 , F04D29/32 , F04D29/66 , F16F1/02 , B32B37/18
CPC分类号： B32B38/0012 , B32B37/18 , B32B38/0036 , B32B2038/0028 , B32B2038/0044 , B32B2603/00 , B32B2605/18 , F01D5/16 , F01D5/26 , F04D29/324 , F04D29/668 , F05D2260/96 , F05D2300/505 , F16F1/021 , F16F2224/0258 , Y10T428/22 , Y10T428/23 , Y10T428/239 , Y10T428/249924 , Y10T428/2964 , Y10T428/31678
摘要： A part includes a structure and at least one shape memory alloy element that is prestressed and embedded at least in part within said structure. The shape memory alloy is suitable for dissipating the mechanical energy of said structure when it vibrates in a given frequency band.

4. 发明授权

US09878515B2 Packaged hot-melt pressure sensitive adhesive 有权
公开(公告)号：US09878515B2
公开(公告)日：2018-01-30
申请号：US14290539
申请日：2014-05-29
申请人： H.B. FULLER COMPANY
发明人： Peter Remmers , Dirk Laukien , Lynne Purvis , Nicholas Porro , Nicholas Taylor
IPC分类号： B32B1/02 , B65G19/18 , C09J7/02 , A61L15/22 , A61L31/04 , A61L15/58 , A61L31/14 , B32B27/30 , B32B1/08 , B32B27/18 , B32B27/22 , B32B27/32 , B65G27/00 , D06N3/00 , D06N3/04 , C09J5/06
CPC分类号： B32B1/02 , A61L15/225 , A61L15/585 , A61L31/041 , A61L31/14 , B32B1/08 , B32B27/18 , B32B27/22 , B32B27/30 , B32B27/306 , B32B27/32 , B32B27/325 , B32B27/327 , B65G19/18 , B65G27/00 , C09J5/06 , C09J7/243 , C09J7/387 , C09J2201/61 , C09J2423/003 , D06N3/0011 , D06N3/0086 , D06N3/045 , D06N2203/042 , D06N2205/06 , D06N2209/16 , D10B2509/00 , D10B2509/026 , Y10T428/1334 , Y10T428/1341 , Y10T428/1352 , Y10T428/1379 , Y10T428/23 , Y10T428/28 , Y10T428/2967 , Y10T442/2754
摘要： The present invention relates to a packaged hot-melt pressure sensitive adhesive comprising a hot-melt pressure sensitive adhesive composition and a coextrusion coating consisting of neat low density polyethylene, neat polypropylene, or neat ethylene vinyl acetate. The present invention further relates to the use of the packaged adhesive formed as individual forms in an adhesive application process, and the use of the packaged adhesive in the production of laminated articles, including nonwoven hygiene articles, disposable medical drapes, and also laminate constructions such as tapes and labels.

5. 发明授权

US09761827B2 Sealed structure, light-emitting device, electronic device, and lighting device 有权
公开(公告)号：US09761827B2
公开(公告)日：2017-09-12
申请号：US14966630
申请日：2015-12-11
申请人： Semiconductor Energy Laboratory Co., Ltd.
发明人： Shunpei Yamazaki , Daiki Nakamura , Yusuke Nishido
IPC分类号： H01L27/146 , H01L51/52 , B32B17/06 , C03C27/06 , H01L27/32
CPC分类号： H01L51/5246 , B32B17/06 , C03C27/06 , H01L27/322 , H01L27/3246 , H01L51/504 , H01L51/5056 , H01L51/5072 , H01L51/5088 , H01L51/5092 , H01L51/52 , H01L51/5206 , H01L51/5221 , H01L51/5281 , H01L51/5284 , H01L2251/533 , H01L2251/5361 , Y10T428/23
摘要： A sealed structure with high sealing capability, in which a pair of substrates is attached to each other with a glass layer is provided. The sealed structure has a first and second substrates, a first surface of the first substrate facing a first surface of the second substrate, and the glass layer which is in contact with the first and second substrates, defines a space between the first and second substrates, and is provided along the periphery of the first surface of the first substrate. The first substrate has a corner portion. The area of the first surface of the first substrate is smaller than or equal to that of the first surface of the second substrate. In at least one of respective welded regions between the glass layer and the first or second substrate, the width of the corner portion is larger than that of the side portion.

6. 发明授权

US09751264B2 Thermal interface device 有权
公开(公告)号：US09751264B2
公开(公告)日：2017-09-05
申请号：US12577148
申请日：2009-10-09
申请人： Todd R. Salamon
发明人： Todd R. Salamon
IPC分类号： F28F7/00 , B29C70/58 , B29L31/18
CPC分类号： B29C70/58 , B29K2995/0013 , B29L2031/18 , Y10T428/23
摘要： A device including an enclosure that encapsulates a plurality of particles dispersed in a matrix material. The particles are formed of a material having substantial bulk thermal conductivity of at least about one watt per meter-Kelvin (1 W/[mK]) at a standardized measurement temperature of about 68° F. In the device, the enclosure is configured upon deformation to allow a portion of the matrix material to escape while retaining at least a portion of the particles within the enclosure. A system that includes an enclosure that encapsulates a plurality of such particles dispersed in a matrix material, the enclosure being located between first and second objects. In the system, the enclosure has through-pores communicating between an interior of the enclosure and an exterior of the enclosure, and at least a portion of the particles have diameters that are larger than a maximum diameter of the through-pores.

7. 发明授权

US09739061B2 Exotensioned structural members with energy-absorbing effects 有权
公开(公告)号：US09739061B2
公开(公告)日：2017-08-22
申请号：US14806599
申请日：2015-07-22
申请人： Michael Ian Brockwell
发明人： Michael Ian Brockwell
IPC分类号： E04C3/00 , E04C3/29 , E04C3/36 , B32B37/18 , B32B38/00 , B29C70/28 , B29C70/86 , E04C3/02 , B32B37/02 , B32B37/24 , D03D3/00 , D04H3/02 , B29K105/08
CPC分类号： E04C3/29 , B29C70/28 , B29C70/86 , B29K2105/08 , B29K2715/003 , B32B37/02 , B32B37/18 , B32B37/24 , B32B38/0004 , B32B2419/00 , B32B2605/18 , D03D3/00 , D04H3/02 , E04C3/02 , E04C3/36 , Y10T29/49625 , Y10T29/49826 , Y10T29/4998 , Y10T428/23 , Y10T428/24273
摘要： Structural members having enhanced load bearing capacity per unit mass include a skeleton structure formed from strips of material. Notches may be placed on the strips and a weave of tensile material placed in the notches and woven around the skeleton structure. At least one pair of structural members can be jointed together to provide very strong joints due to a weave patterns of tensile material, such as Kevlar, that distributes stress throughout the structure, preventing stress from concentrating in one area. Methods of manufacturing such structural members include molding material into skeletons of desired cross section using a matrix of molding segments. Total catastrophic failures in composite materials are substantially avoided and the strength to weight ratio of structures can be increased.

8. 发明申请

US20170104140A1 Ultraviolet Device Encapsulant 审中-公开
公开(公告)号：US20170104140A1
公开(公告)日：2017-04-13
申请号：US15389476
申请日：2016-12-23
申请人： Sensor Electronic Technology, Inc.
发明人： Remigijus Gaska , Maxim S. Shatalov , Alexander Dobrinsky , Jinwei Yang , Michael Shur
IPC分类号： H01L33/56 , H01L33/48 , H01L31/024 , H01L33/50 , H01L31/0203 , H01L31/0232 , H01L33/58 , H01L33/64
CPC分类号： H01L33/56 , C09D163/00 , H01L31/0203 , H01L31/02322 , H01L31/02327 , H01L31/024 , H01L33/502 , H01L33/641 , H01L2933/0091 , Y10T428/23
摘要： A composite material, which can be used as an encapsulant for an ultraviolet device, is provided. The composite material includes a matrix material and at least one filler material incorporated in the matrix material that are both at least partially transparent to ultraviolet radiation of a target wavelength. The filler material includes microparticles and/or nanoparticles and can have a thermal coefficient of expansion significantly smaller than a thermal coefficient of expansion of the matrix material for relevant atmospheric conditions. The relevant atmospheric conditions can include a temperature and a pressure present during each of: a curing and a cool down process for fabrication of a device package including the composite material and normal operation of the ultraviolet device within the device package.

9. 发明授权

US09566774B2 Display panel manufacturing method and display panel 有权
标题翻译：显示面板制造方法和显示面板
公开(公告)号：US09566774B2
公开(公告)日：2017-02-14
申请号：US14396211
申请日：2013-07-23
申请人： JOLED INC.
发明人： Takashi Osako
IPC分类号： B32B37/12 , H01L51/52 , B32B38/00 , G02F1/1333 , H05B33/04 , B32B37/00 , B32B37/18
CPC分类号： B32B37/1284 , B32B37/0015 , B32B37/18 , B32B38/00 , B32B2037/1253 , B32B2038/0076 , B32B2307/40 , B32B2398/00 , B32B2457/20 , G02F1/1333 , G02F1/133308 , G02F2001/133331 , G02F2201/54 , G02F2202/28 , H01L51/524 , H05B33/04 , Y10T428/23
摘要： A display panel manufacturing method is provided. A display function unit is provided on a surface of a first substrate. Sealing material is provided in a region on the surface of the first substrate that is surrounding the display function unit. Resin is then placed in an inside region of the sealing material over the surface of the first substrate. A total volume amount of the resin placed is greater than a volume capacity of an open space surrounded by the sealing material above the surface of the first substrate. A second substrate is bonded with the first substrate via the sealing material to provide a closed space with the resin being provided in the closed space.
摘要翻译：提供一种显示面板的制造方法。显示功能单元设置在第一基板的表面上。密封材料设置在围绕显示功能单元的第一基板的表面的区域中。然后将树脂放置在第一基板的表面上的密封材料的内部区域中。放置的树脂的总体积量大于由第一基板的表面上方的密封材料包围的开放空间的体积容量。第二基板经由密封材料与第一基板接合，以提供封闭空间，树脂设置在封闭空间中。

10. 发明授权

US09562171B2 Ultraviolet device encapsulant 有权
标题翻译：紫外线装置密封剂
公开(公告)号：US09562171B2
公开(公告)日：2017-02-07
申请号：US13624162
申请日：2012-09-21
申请人： Sensor Electronic Technology, Inc.
发明人： Remigijus Gaska , Maxim S. Shatalov , Alexander Dobrinsky , Jinwei Yang , Michael Shur
IPC分类号： C09D163/00 , C09K11/02 , H01L33/56
CPC分类号： C09D163/00 , C09K11/02 , C09K11/08 , H01L33/56 , Y10T428/23
摘要： A composite material, which can be used as an encapsulant for an ultraviolet device, is provided. The composite material includes a matrix material and at least one filler material incorporated in the matrix material that are both at least partially transparent to ultraviolet radiation of a target wavelength. The filler material includes microparticles and/or nanoparticles and can have a thermal coefficient of expansion significantly smaller than a thermal coefficient of expansion of the matrix material for relevant atmospheric conditions. The relevant atmospheric conditions can include a temperature and a pressure present during each of: a curing and a cool down process for fabrication of a device package including the composite material and normal operation of the ultraviolet device within the device package.
摘要翻译：提供了可用作紫外线装置的密封剂的复合材料。复合材料包括基体材料和掺入基质材料中的至少部分对目标波长的紫外线辐射部分透明的填料。填充材料包括微粒和/或纳米颗粒，并且可以具有明显小于相关大气条件下的基质材料的热膨胀系数的热膨胀系数。相关的大气条件可以包括以下各项中存在的温度和压力：用于制造包括复合材料的器件封装的固化和冷却过程以及器件封装内的紫外线器件的正常操作。

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