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1. 发明授权

US07229018B2 Manufacture of RFID tags and intermediate products therefor 失效
标题翻译：制造RFID标签及其中间产品
公开(公告)号：US07229018B2
公开(公告)日：2007-06-12
申请号：US11191381
申请日：2005-07-28
申请人： Arthur A. Kurz
发明人： Arthur A. Kurz
IPC分类号： G06K19/06 , G06K7/06 , H05K5/02 , H05K7/18 , H05K3/00 , H01Q1/36 , H01Q17/00 , G08R31/28
CPC分类号： H01Q1/22 , G06K19/07718 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L24/81 , H01L24/86 , H01L24/97 , H01L2221/68354 , H01L2221/68359 , H01L2224/7965 , H01L2224/81121 , H01L2224/8121 , H01L2224/81815 , H01L2224/97 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H05K3/041 , H05K3/341 , Y10T29/49004 , Y10T29/49018 , Y10T29/49117 , Y10T29/49124 , H01L2224/81
摘要： In the manufacture of RFID tags, electronic components are connected with soldered connections to antennas stamped from a thin strip of electrically conductive metal, utilizing methods and intermediate products which enable accurate registration of the leads of the electronic components with contacts on the antennas. Thus, a strip of metal is provided with contact members unitary with the strip and coupled to the strip through compliant coupling arrangements which allow compliant movement of the contact members relative to the strip for accurate alignment with electronic components juxtaposed with the contact members for soldered connections between the leads of the electronic components and the corresponding contact members. The antennas, with the electronic components soldered in place, are carried by a substrate, and the sequence of the stamping and soldering operations avoids exposing the substrate to the heat of soldering.
摘要翻译：在RFID标签的制造中，电子部件通过焊接连接连接到由薄导电金属薄片冲压的天线，利用能使电子部件的引线与天线上的触点精确对准的方法和中间产品。因此，金属条带设置有与带材一体的接触部件，并且通过柔性连接装置连接到带材上，允许接触部件相对于条带顺从移动，以便与用于焊接连接的接触部件并置的电子部件精确对准在电子部件的引线与相应的接触部件之间。将电子部件焊接在适当位置的天线由基板承载，并且冲压和焊接操作的顺序避免了将基板暴露于焊接热。

2. 发明授权

US06365436B1 Connecting multiple microelectronic elements with lead deformation 有权
标题翻译：连接多个具有铅变形的微电子元件
公开(公告)号：US06365436B1
公开(公告)日：2002-04-02
申请号：US09712631
申请日：2000-11-14
申请人： Tony Faraci , Thomas H. Distefano , John W. Smith
发明人： Tony Faraci , Thomas H. Distefano , John W. Smith
IPC分类号： H01L2144
CPC分类号： H01L24/86 , H01L24/45 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/7965 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2224/48
摘要： A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.
摘要翻译：多个单独的半导体芯片（每个具有接触表面和在该表面上的接触）被布置成阵列，使得接触表面面对并限定阵列的第一表面。具有端子的柔性介电片覆盖在半导体芯片的第一或接触支承表面上。细长引线设置在电介质元件和半导体芯片之间。每个引线具有连接到电介质元件上的端子的第一端，以及连接到阵列中的半导体芯片上的触点的第二端。所有的引线通过相对于彼此移动介质元件和阵列而同时形成，以同时相对于所有第二端移位引线的所有第一端。介电元件在形成步骤之后被细分，以便将电介质元件的一个区域连接到每个芯片，从而形成各自包括一个芯片或少量芯片的单元。

3. 发明授权

US6147400A Connecting multiple microelectronic elements with lead deformation 失效
公开(公告)号：US6147400A
公开(公告)日：2000-11-14
申请号：US95251
申请日：1998-06-10
申请人： Tony Faraci , Thomas H. DiStefano , John W. Smith
发明人： Tony Faraci , Thomas H. DiStefano , John W. Smith
IPC分类号： H01L25/18 , H01L21/60 , H01L25/04 , H01L23/34
CPC分类号： H01L24/86 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/7965 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/351
摘要： A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.

4. 发明授权

US5207369A Inner lead bonding apparatus 失效
标题翻译：内引线接合装置
公开(公告)号：US5207369A
公开(公告)日：1993-05-04
申请号：US795218
申请日：1991-11-20
申请人： Hiroshi Haji , Kiyoshi Arita
发明人： Hiroshi Haji , Kiyoshi Arita
IPC分类号： H01L21/60
CPC分类号： H01L24/86 , H01L2224/16 , H01L2224/7965 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01082 , H01L2924/14
摘要： A process for manufacturing electronic components known as TAB method comprises a process employing a single apparatus for forming bumps in a chip, a process of inner lead bonding for bonding said bumps to leads of a film carrier, and a process of outer lead bonding for bonding the leads to a circuit board after punching said film carrier. The bumps are formed by plating means or by stud bump means using a capillary tool. In another aspect of the invention there is provided an apparatus by which it is possible to form the bumps and to perform the inner lead bonding in a single apparatus. The capillary tool for forming the inner lead bonding and a pressing tool for the inner lead bonding are replaceably and selectively mounted to be held on a horn. Also, there are provided a pickup head for moving the chip furnished in a chip feeding unit to the chip stage and a moving table for moving the chip stage. The capillary tool is held by the horn, and the bumps are formed in the chip on the chip stage while pulling out a wire from the capillary tool. Next, the pressing tool is manually mounted to be held by the horn in place of the capillary tool, and the leads of the film carrier on the chip stage are bonded to the bumps formed in the chip.
摘要翻译：用于制造称为TAB方法的电子部件的方法包括使用单个装置在芯片中形成凸块的工艺，用于将所述凸块接合到薄膜载体的引线的内部引线接合的工艺，以及用于接合的外部引线接合在冲压所述胶片载体之后导向电路板。凸块由电镀装置或使用毛细管工具的螺柱凸块形成。在本发明的另一方面，提供了一种可以在单个装置中形成凸块并执行内引线接合的装置。用于形成内部引线接合的毛细管工具和用于内部引线接合的按压工具可更换和选择性地安装以保持在喇叭上。此外，还提供了一种用于将设置在芯片馈送单元中的芯片移动到芯片级的拾取头和用于移动芯片级的移动台。毛细管工具由喇叭保持，并且在从毛细管工具拉出线材时，在芯片台上的芯片中形成凸块。接下来，代替毛细管工具手动地安装按压工具以由喇叭保持，并且芯片台上的胶片载体的引线接合到芯片中形成的凸块。

5. 发明授权

US4635092A Tape automated manufacture of power semiconductor devices 失效
公开(公告)号：US4635092A
公开(公告)日：1987-01-06
申请号：US616756
申请日：1984-06-04
申请人： Alexander J. Yerman , James A. Loughran
发明人： Alexander J. Yerman , James A. Loughran
IPC分类号： H01L21/60 , H01L23/495 , H01L23/48 , H01L23/02 , B22F3/26
CPC分类号： H01L24/86 , H01L23/49562 , H01L2224/7965 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01082 , H01L2924/014 , Y10T29/49142 , Y10T428/12188
摘要： Power semiconductor devices are manufactured using a flexible metal tape carrier to facilitate automation of the manufacturing process. Control leads are fashioned from portions of the tape carrier, with a main portion of the tape carrier serving as a main current lead. The manufacturing process permits thorough electrical testing of a power semiconductor chip prior to incorporation into a relatively expensive power device package. In particular, the power chip can be tested at full-rated current, at least where the current is pulsed at a low duty cycle.

6. 发明授权

US07621043B2 Device for making an in-mold circuit 失效
标题翻译：用于制造模内电路的装置
公开(公告)号：US07621043B2
公开(公告)日：2009-11-24
申请号：US11554237
申请日：2006-10-30
申请人： Andre Cote , Detlef Duschek
发明人： Andre Cote , Detlef Duschek
IPC分类号： H05K3/07
CPC分类号： G06K19/07749 , G06K19/07718 , G06K19/0775 , G08B13/244 , H01L21/56 , H01L21/67132 , H01L24/86 , H01L24/96 , H01L24/97 , H01L2224/16 , H01L2224/7965 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/3025 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T428/14 , H01L2924/00
摘要： A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.
摘要翻译：将在机器方向上连续移动的聚酯片材加热至刚好低于其玻璃热温度的温度，以使该聚合物具有延展性。电路（例如，RFID芯片，EAS芯片，应答器，IC）被放置在聚合物片材上并且嵌入到多片材中，优选地具有耐热柔软（例如橡胶）辊，其将电路压入聚合物而不破坏电路。可以将导电条或线施加到聚合物片上或其上，以与电路的连接点（例如，导电凸块）对齐，以与电路导电连通。优选地，导电条或线被切割以形成在导线的切割部分之间不导电的间隙，以避免电路的短路和/或允许导电条或线作为电路的天线发挥作用，并因此形成芯片表带或标签。因此，聚酰胺片为电路和电线提供了保护性的子宫或屏蔽。

7. 发明申请

US20080210368A1 Method and Device for Transferring a Chip to a Contact Substrate 有权
标题翻译：将芯片转移到接触基板的方法和装置
公开(公告)号：US20080210368A1
公开(公告)日：2008-09-04
申请号：US11910771
申请日：2006-04-10
申请人： Elke Zakel , Ghassem Azdasht
发明人： Elke Zakel , Ghassem Azdasht
IPC分类号： B44C1/00 , B29C65/78
CPC分类号： H01L21/6835 , H01L21/67132 , H01L21/67144 , H01L21/6836 , H01L24/31 , H01L24/75 , H01L24/83 , H01L24/86 , H01L2221/68327 , H01L2221/68354 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/75 , H01L2224/75263 , H01L2224/75314 , H01L2224/7565 , H01L2224/7965 , H01L2224/81005 , H01L2224/81224 , H01L2224/81801 , H01L2224/83192 , H01L2224/83851 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19043 , H01L2924/00014
摘要： A method and device for transferring a chip (18) situated on a transfer substrate (26) to a contact substrate (50), and for contacting the chip with the contact substrate, in which the chip, the back side (19) of which is attached adhesively to a support surface of the transfer substrate facing the contact substrate, is charged with laser energy from behind through the transfer substrate, and the chip contacts (59, 60) thereof that are arranged opposite a contact surface (58) of the contact substrate are brought into contact with substrate contacts (56, 57) arranged on the contact surface by means of a pressing device (45, 46) from behind through the transfer substrate, and a thermal bond is created between the chip contacts and the substrate contacts.
摘要翻译：一种用于将位于转印衬底（26）上的芯片（18）转移到接触衬底（50）并将芯片与接触衬底接触的方法和装置，其中芯片的背面（19）被粘附到转移基板的面向接触基板的支撑表面上，从后面通过转印基板充满激光能量，并且其与芯片接触（59,60）相对地设置在与基板的接触表面（58）相对的位置接触基板通过从后面通过转印基板的加压装置（45,46）与布置在接触表面上的基板触点（56,57）接触，并且在芯片触头和基板之间产生热粘合联系人

8. 发明申请

US20070102486A1 WIRE EMBEDDED BRIDGE 审中-公开
标题翻译：电线嵌桥
公开(公告)号：US20070102486A1
公开(公告)日：2007-05-10
申请号：US11551995
申请日：2006-10-23
申请人： Andre Cote , Detlef Duschek
发明人： Andre Cote , Detlef Duschek
IPC分类号： A47J36/02
CPC分类号： G06K19/07749 , B29C70/82 , G06K19/07718 , H01L23/4985 , H01L24/35 , H01L24/37 , H01L24/50 , H01L24/86 , H01L2224/16 , H01L2224/37124 , H01L2224/7965 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/00
摘要： A wire embedded bridge made by the apparatus and method disclosed by example herein may be commonly used for the formation of an RFID circuit or chip strap. The process uses flexible polyester and/or other films as a base component of the bridge. A wire is heated and embedded into the poly sheet at precise locations in a continuous process, for example, with the poly continuously moving in a machine direction. The locations of the wire make chip placement onto the wire track reliable and inexpensive, preferably using heat and pressure to bond the chips with the embedded wire and form a protected RFID circuit.
摘要翻译：通过本文实施例公开的装置和方法制造的电线嵌入式桥可以通常用于形成RFID电路或芯片带。该方法使用柔性聚酯和/或其它膜作为桥的基础组分。电线在连续工艺中的精确位置被加热并嵌入聚酰胺片中，例如，多晶硅在机器方向上连续移动。电线的位置使得芯片放置在线轨上可靠和便宜，优选地使用热和压力将芯片与嵌入的线结合并形成受保护的RFID电路。

9. 发明申请

US20030111713A1 Manufacturing method of tape carrier package and the system thereof 审中-公开
标题翻译：载带封装的制造方法及其制造方法
公开(公告)号：US20030111713A1
公开(公告)日：2003-06-19
申请号：US10317882
申请日：2002-12-12
发明人： Ming-Hsiang Cheng
IPC分类号： H01L023/495
CPC分类号： H01L24/86 , H01L21/56 , H01L2224/16 , H01L2224/7965 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082
摘要： The invention discloses a manufacturing method of tape carrier package (TCP) and the system thereof, which uses an insulating resin material to attain the object of circuit protection. The resin material will be hardened after irradiating with specific light. By utilizing such characteristics of the chemical reaction, the duration necessary for curing process can be reduced greatly and the process flow in the conventional technology can be simplified.
摘要翻译：本发明公开了一种带状载体封装（TCP）的制造方法及其系统，其使用绝缘树脂材料来实现电路保护的目的。树脂材料在用特定光照射后会硬化。通过利用化学反应的这种特性，可以大大降低固化过程所需的持续时间，并且可以简化传统技术中的工艺流程。

10. 发明申请

US20010039076A1 Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device 有权
公开(公告)号：US20010039076A1
公开(公告)日：2001-11-08
申请号：US09768165
申请日：2001-01-24
申请人： Seiko Epson Corporation
发明人： Nobuaki Hashimoto
IPC分类号： H01L021/44 , H01L021/48 , H01L021/50
CPC分类号： H01L24/86 , H01L22/20 , H01L23/544 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/7965 , H01L2224/83192 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2224/81 , H01L2924/00 , H01L2224/05599
摘要： A method of manufacturing a tape carrier comprises: a step of providing a tape carrier having bonding portions formed in rows in the width direction, repeating in the longitudinal direction, and having identification marks delimiting regularly repeating matrices formed of pluralities of rows and columns of the bonding portions; a step of examining the tape carrier; a step of removing a defective location of the tape carrier detected in the examination step, and joining together the separated tape carrier to preserve the regular repetition of the matrix; and a step of forming a join mark for delimiting a matrix in which the join formed in the joining step is positioned.

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