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    • 62. 发明申请
    • Low refractive index polymers as underlayers for silicon-containing photoresists
    • 低折射率聚合物作为含硅光致抗蚀剂的底层
    • US20060134546A1
    • 2006-06-22
    • US11013971
    • 2004-12-16
    • Wu-Song HuangSean BurnsMahmoud Khojasteh
    • Wu-Song HuangSean BurnsMahmoud Khojasteh
    • G03C1/76
    • G03F7/091G03F7/094Y10S438/952
    • A new underlayer composition that exhibits high etch resistance and improved optical properties is disclosed. The underlayer composition comprises a vinyl or acrylate polymer, such as a methacrylate polymer, the polymer comprising at least one substituted or unsubstituted naphthalene or naphthol moiety, including mixtures thereof. Examples of the polymer of this invention include: where each R1 is independently selected from an organic moiety or a halogen; each A is independently a single bond or an organic moiety; R2 is hydrogen or a methyl group; and each X, Y and Z is an integer of 0 to 7, and Y+Z is 7 or less. The organic moiety mentioned above may be a substituted or unsubstituted hydrocarbon selected from the group consisting of a linear or branched alkyl, halogenated linear or branched alkyl, aryl, halogenated aryl, cyclic alkyl, and halogenated cyclic alkyl, and any combination thereof. The compositions are suitable for use as a planarizing underlayer in a multilayer lithographic process, including a trilayer lithographic process.
    • 公开了具有高耐蚀刻性和改善的光学性能的新型底层组合物。 底层组合物包含乙烯基或丙烯酸酯聚合物,例如甲基丙烯酸酯聚合物,该聚合物包含至少一个取代或未取代的萘或萘酚部分,包括其混合物。 本发明的聚合物的实例包括:其中每个R 1独立地选自有机部分或卤素; 每个A独立地是单键或有机部分; R 2是氢或甲基; X,Y,Z为0〜7的整数,Y + Z为7以下。 上述有机部分可以是选自直链或支链烷基,卤代直链或支链烷基,芳基,卤代芳基,环状烷基和卤代环状烷基的取代或未取代的烃及其任何组合。 该组合物适合用作多层光刻工艺中的平坦化底层,包括三层光刻工艺。
    • 64. 发明授权
    • Resist compositions comprising silyl ketals and methods of use thereof
    • 包含甲硅烷基缩酮的抗蚀剂组合物及其使用方法
    • US06641971B2
    • 2003-11-04
    • US09882234
    • 2001-06-15
    • Wu-Song HuangDavid R. Medeiros
    • Wu-Song HuangDavid R. Medeiros
    • G03F7023
    • G03F7/0758G03F7/0045Y10S430/106
    • A chemically amplified resist composition comprises an aqueous base soluble polymer or copolymer having one or more polar functional groups, wherein at least one of the functional groups is protected with a cycloaliphatic silyl ketal group but may also include other protecting groups as well as unprotected acidic functionalities. A ratio of protected to unprotected acidic functionalities is preferably selected to most effectively modulate a solubility of the resist composition in an aqueous base or other developer. The resist composition further comprises an acid generator, preferably a photoacid generator (PAG), and a casting solvent, and may also include other components, such as, a base additive and/or surfactant.
    • 化学放大抗蚀剂组合物包含具有一个或多个极性官能团的碱性水溶性聚合物或共聚物,其中至少一个官能团用脂环族甲硅烷基缩酮基团保护,但也可包括其它保护基团以及未保护的酸性官能团 。 优选选择被保护的与未保护的酸性官能度的比例以最有效地调节抗蚀剂组合物在碱性水溶液或其它显影剂中的溶解度。 抗蚀剂组合物还包含酸产生剂,优选光酸产生剂(PAG)和浇铸溶剂,并且还可以包括其它组分,例如碱添加剂和/或表面活性剂。
    • 68. 发明授权
    • Solder/polymer composite paste and method
    • 焊剂/聚合物复合材料和方法
    • US5062896A
    • 1991-11-05
    • US502090
    • 1990-03-30
    • Wu-Song HuangIgor Y. KhandrosRavi SarafLeathen Shi
    • Wu-Song HuangIgor Y. KhandrosRavi SarafLeathen Shi
    • B23K35/22B23K35/26B23K35/36B23K35/363B23K101/36C08K3/08H05K3/32H05K3/34
    • H05K3/3484B23K35/26B23K35/36C08K3/08H05K2201/0129H05K3/321
    • An improved solder/polymer fluxless composite paste interconnection material having a low reflow temperature to form electrical contacts having good bonding strength and low contact resistance. The present pastes comprise a major proportion of a meltable metal alloy powder filler, free of noble metals and preferably free of lead, a minor proportion of a solution of a temperature-stable thermoplastic polymer having a softening temperature above the melting temperature of the metal powder filler in a volatile solvent which evaporates during reflow, and a minor proportion of a fluxing agent having a boiling point lower than the reflow temperature of the composition and higher than the melting point of the eutectic alloy powder filler. An oxide-free, partially coalesced metal alloy connection is obtained, which is polymer strengthened and reworkable at a low reflow temperature, per se, or in the presence of polymer solvent.
    • 具有低回流温度的改进的焊料/聚合物无焊剂复合糊剂互连材料,以形成具有良好的接合强度和低接触电阻的电触点。 本发明的糊料主要包括不含贵金属,优选不含铅的可熔融金属合金粉末填料的主要部分,较小比例的软化温度高于金属粉末的熔融温度的温度稳定的热塑性聚合物溶液 在回流时蒸发的挥发性溶剂中的填料,以及沸点低于组合物的回流温度并且高于共晶合金粉末填料的熔点的助熔剂的一小部分。 获得无氧化物,部分聚结的金属合金连接,其在低回流温度下或在聚合物溶剂的存在下聚合物增强并可再加工。
    • 70. 发明授权
    • Method of forming a pattern of an array of shapes including a blocked region
    • 形成包括阻挡区域的形状阵列的图案的方法
    • US08492079B2
    • 2013-07-23
    • US12430919
    • 2009-04-28
    • Chia-Chen ChenWu-Song HuangWai-Kin LiChandrasekhar Sarma
    • Chia-Chen ChenWu-Song HuangWai-Kin LiChandrasekhar Sarma
    • G03F7/20
    • G03F7/70466G03F1/70G03F7/095G03F7/203Y10T428/24802
    • A second photoresist having a second photosensitivity is formed on a substrate. A first photoresist having a first photosensitivity, which is greater than second photosensitivity, is formed on the second photoresist. Preferably, the first photoresist is a gray resist that becomes transparent upon exposure. At least one portion of the first photoresist is lithographically exposed employing a first reticle having a first pattern to form at least one transparent lithographically exposed resist portion, while the second photoresist remains intact. The second photoresist is lithographically exposed employing a second reticle including a second pattern to form a plurality of lithographically exposed shapes in the second photoresist. The plurality of lithographically exposed shapes have a composite pattern which is the derived from the second pattern by limiting the second pattern only within the area of the at least one transparent lithographically exposed resist pattern.
    • 在基板上形成具有第二光敏性的第二光致抗蚀剂。 在第二光致抗蚀剂上形成具有大于第二光敏性的第一光敏性的第一光致抗蚀剂。 优选地,第一光致抗蚀剂是在曝光时变得透明的灰色抗蚀剂。 使用具有第一图案的第一掩模版将第一光致抗蚀剂的至少一部分光刻曝光以形成至少一个透明的光刻曝光的抗蚀剂部分,而第二光致抗蚀剂保持完整。 使用包括第二图案的第二掩模版将第二光致抗蚀剂光刻曝光,以在第二光致抗蚀剂中形成多个光刻曝光的形状。 多个光刻曝光的形状具有通过仅在至少一个透明光刻曝光的抗蚀剂图案的区域内限制第二图案而从第二图案导出的复合图案。