专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

US08559000B2 Method of inspecting a semiconductor device and an apparatus thereof 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US08559000B2
公开(公告)日：2013-10-15
申请号：US13593171
申请日：2012-08-23
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/00 , G06K9/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
摘要翻译：在多个检查条件下对样本进行检查的检查方法和装置以及在多个检查条件下检查样本而获得的检查数据和对应于检查日期样本的位置信息具有相应的检查条件。多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的获得。对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

62. 发明申请

US20130250297A1 INSPECTION APPARATUS AND INSPECTION SYSTEM 审中-公开
标题翻译：检查装置和检查系统
公开(公告)号：US20130250297A1
公开(公告)日：2013-09-26
申请号：US13990103
申请日：2011-10-11
申请人： Masaaki Ito , Minori Noguchi
发明人： Masaaki Ito , Minori Noguchi
IPC分类号： G01N21/95
CPC分类号： G01N21/9501 , G01N21/95607
摘要： Disclosed here is a macro inspection apparatus for a sample such as a semiconductor wafer having a pattern formed thereon, the apparatus being capable of detecting abnormalities in dimension and size with high sensitivity.The inspection apparatus for a sample having pattern formed thereon includes: an illumination optical system which illuminates the sample having the pattern formed thereon; a detection optical system which receives scattered light from the pattern; an imaging device which is disposed over a pupil plane of the detection optical system, the imaging device acquiring Fourier images of the pattern; and a processing unit which compares the Fourier images with the Fourier image of the normal pattern to detect an irregularity of the pattern.
摘要翻译：这里公开了一种用于诸如其上形成有图案的半导体晶片的样品的宏观检查装置，该装置能够以高灵敏度检测尺寸和尺寸的异常。用于其上形成有图案的样品的检查装置包括：照射具有形成在其上的图案的样品的照明光学系统; 检测光学系统，其接收来自图案的散射光; 成像装置，其设置在所述检测光学系统的光瞳平面上，所述成像装置获取所述图案的付里叶图像; 以及处理单元，其将傅立叶图像与正常图案的傅里叶图像进行比较，以检测图案的不规则性。

63. 发明申请

US20130187667A1 Inspection Equipment and Inspection Method 有权
标题翻译：检验设备检验方法
公开(公告)号：US20130187667A1
公开(公告)日：2013-07-25
申请号：US13701678
申请日：2011-06-17
申请人： Masami Makuuchi , Minori Noguchi , Hiroshi Kawaguchi
发明人： Masami Makuuchi , Minori Noguchi , Hiroshi Kawaguchi
IPC分类号： G01N27/24
CPC分类号： G01N27/24 , H01M10/052 , H01M10/058 , H01M10/4285 , H01M10/44 , H01M10/48 , Y02T10/7011
摘要： Foreign metal inspection equipment is provided with: a conveying device for conveying a sample to be subjected to inspection; electrodes positioned so as to face the surface of the sample; a measurement device for measuring the capacitance between the electrodes and the sample being conveyed by the conveying device; and a processing unit that inspects for foreign metal mixed in the sample on the basis of the change in capacitance measured by the measurement device.
摘要翻译：外国金属检验设备设有：用于输送要进行检查的样品的输送装置; 电极定位成面对样品的表面; 用于测量由所述输送装置输送的所述电极和所述样品之间的电容的测量装置; 以及处理单元，其基于由测量装置测量的电容变化来检查样品中混合的外来金属。

64. 发明申请

US20120069329A1 SURFACE INSPECTION APPARATUS AND METHOD THEREOF 有权
标题翻译：表面检查装置及其方法
公开(公告)号：US20120069329A1
公开(公告)日：2012-03-22
申请号：US13114160
申请日：2011-05-24
申请人： Ichiro ISHIMARU , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
发明人： Ichiro ISHIMARU , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
IPC分类号： G01N21/88
CPC分类号： G01N21/88 , G01N21/474 , G01N21/94 , G01N21/9501 , G01N21/9503 , G01N2021/8825 , G01N2021/8854
摘要： A defect inspection apparatus including: a first illumination optical system which is configured to illuminate the inspection area on a sample surface from a normal line direction or a direction near thereof with respect to said sample surface; a second illumination optical system which is configured to illuminate said inspection area from a slant direction with respect to said sample surface; a detection optical system having a plurality of first detectors which are located, in front of, on the sides of, and behind said inspection area, respectively, with respect to the illumination direction of said second illumination optical system, and where the regular reflected light component, from said sample surface, by illumination light of said second illumination optical system, is not converged; and a signal processing system which is configured to inspect a defect, upon basis of signals obtained from said plurality of first detectors.
摘要翻译：一种缺陷检查装置，包括：第一照明光学系统，被配置为从相对于所述样品表面的法线方向或近似的方向照射样品表面上的检查区域; 第二照明光学系统，被配置为相对于所述样品表面从倾斜方向照射所述检查区域; 检测光学系统，具有分别相对于所述第二照明光学系统的照明方向位于所述检查区域的所述检查区域的前方和后方的多个第一检测器，并且其中所述规则反射光从所述样品表面通过所述第二照明光学系统的照明光分量不会收敛; 以及信号处理系统，其被配置为基于从所述多个第一检测器获得的信号来检查缺陷。

65. 发明授权

US08045148B2 System for monitoring foreign particles, process processing apparatus and method of electronic commerce 有权
标题翻译：电子商务监控系统，工艺处理装置及电子商务方法
公开(公告)号：US08045148B2
公开(公告)日：2011-10-25
申请号：US12395848
申请日：2009-03-02
申请人： Hidetoshi Nishiyama , Minori Noguchi , Tetsuya Watanabe , Takuaki Sekiguchi
发明人： Hidetoshi Nishiyama , Minori Noguchi , Tetsuya Watanabe , Takuaki Sekiguchi
IPC分类号： G01N21/00
CPC分类号： G01N21/94 , G01N21/9501 , Y02P90/04 , Y02P90/14 , Y02P90/18 , Y02P90/265
摘要： A system for monitoring foreign matter includes a manufacturing line having plural process processing apparatuses, a production management system which manages the processing of workpieces in the manufacturing line, plural optical heads which monitor foreign matter in relation to at least one of the workpieces, and which provide an output signal indicative thereof, and at least one image signal processing unit provided in a lesser number than a number of the plural optical heads for processing the output signal therefrom.
摘要翻译：用于监测异物的系统包括具有多个处理处理装置的生产线，管理制造线中的工件的处理的生产管理系统，与至少一个工件相关地监视异物的多个光学头，以及提供指示其的输出信号，以及至少一个图像信号处理单元，其以比用于处理其输出信号的多个光学头的数量少的数量提供。

66. 发明授权

US08040503B2 Method of inspecting a semiconductor device and an apparatus thereof 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US08040503B2
公开(公告)日：2011-10-18
申请号：US12652427
申请日：2010-01-05
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/00 , G06K9/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
摘要翻译：在多个检查条件下对样本进行检查的检查方法和装置以及在多个检查条件下检查样本而获得的检查数据和对应于检查日期样本的位置信息具有相应的检查条件。多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的获得。对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

67. 发明授权

US07952085B2 Surface inspection apparatus and method thereof 有权
标题翻译：表面检查装置及其方法
公开(公告)号：US07952085B2
公开(公告)日：2011-05-31
申请号：US12196647
申请日：2008-08-22
申请人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
发明人： Ichiro Ishimaru , Minori Noguchi , Ichiro Moriyama , Yoshikazu Tanabe , Yasuo Yatsugake , Yukio Kenbou , Kenji Watanabe , Hirofumi Tsuchiyama
IPC分类号： G01N21/88
CPC分类号： G01N21/88 , G01N21/474 , G01N21/94 , G01N21/9501 , G01N21/9503 , G01N2021/8825 , G01N2021/8854
摘要： The invention provides a surface inspection apparatus and a method for inspecting the surface of a sample that are capable of inspecting discriminatingly between the scratch of various configuration and the adhered foreign object that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to polishing process such as CMP or grinding process in semiconductor manufacturing process or magnetic head manufacturing process.
摘要翻译：本发明提供了一种表面检查装置和用于检查样品表面的方法，所述表面检查装置和检查方法能够区分各种构型的刮擦和在作业目标（例如，工件）上发生在工作目标表面上的被粘附的异物之间的差异，半导体衬底上的绝缘膜）在半导体制造工艺或磁头制造工艺中进行诸如CMP或研磨工艺的抛光工艺。

68. 发明申请

US20110032515A1 METHOD OF APPARATUS FOR DETECTING PARTICLES ON A SPECIMEN 有权
公开(公告)号：US20110032515A1
公开(公告)日：2011-02-10
申请号：US12907895
申请日：2010-10-19
申请人： Akira HAMAMATSU , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Taketo Ueno , Hiroyuki Nakano , Takahiro Jingu , Hisashi Hatano , Yukihisa Mohara , Seiji Otani , Takahiro Togashi
发明人： Akira HAMAMATSU , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Taketo Ueno , Hiroyuki Nakano , Takahiro Jingu , Hisashi Hatano , Yukihisa Mohara , Seiji Otani , Takahiro Togashi
IPC分类号： G01N21/00
CPC分类号： G01N21/956
摘要： A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

69. 发明申请

US20100271473A1 DEFECT INSPECTION SYSTEM 失效
标题翻译：缺陷检查系统
公开(公告)号：US20100271473A1
公开(公告)日：2010-10-28
申请号：US12770337
申请日：2010-04-29
申请人： Kenji AIKO , Shuichi Chikamatsu , Minori Noguchi , Hisafumi Iwata
发明人： Kenji AIKO , Shuichi Chikamatsu , Minori Noguchi , Hisafumi Iwata
IPC分类号： H04N7/18 , G01N21/88 , G02B3/02
CPC分类号： H04N7/18 , G01N21/9501 , G01N21/956 , G01N2021/8822 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A defect inspection system can suppress an effect of light from a sample rough surface or a regular circuit pattern and increasing a gain of light from a defect such as a foreign material to detect the defect on the sample surface with high sensitivity. When a lens with a large NA value is used, the outer diameter of the lens is 10a, and an angle between the sample surface and a traveling direction of the light from a defect is α1. An oblique detection optics system receives the light from the defect at a reduced elevation angle α2 with respect to the sample surface to reduce light from the sample rough surface, an oxide film rough bottom surface, and a circuit pattern, and to increase the amount of the light from the defect and detected. The diameter 10a of a lens is smaller than the diameter 10b, resulting in a reduction in the ability to focus the scattered light. When a lens with an outer diameter 10c is used to improve the focus ability, the lens interferes with the sample. To avoid the interference, a portion of the lens interfering with the sample is removed. The lens has an aperture larger than the diameter 10b while the lens receives the light scattered at the elevation angle α2, making it possible to improve the ability to detect defects and lens performance simultaneously.
摘要翻译：缺陷检查系统可以抑制来自样品粗糙表面或常规电路图案的光的影响，并且增加来自诸如异物的缺陷的光的增益以高灵敏度检测样品表面上的缺陷。当使用具有大NA值的透镜时，透镜的外径为10a，并且样品表面与来自缺陷的光的行进方向之间的角度为α1。倾斜检测光学系统以相对于样品表面的降低的仰角α2接收来自缺陷的光，以减少来自样品粗糙表面，氧化膜粗糙底表面和电路图案的光，并且增加来自缺陷的光并检测。透镜的直径10a小于直径10b，导致散射光聚焦的能力降低。当使用外径为10c的透镜来提高聚焦能力时，透镜会干扰样品。为了避免干扰，去除了与样品干扰的一部分透镜。透镜具有大于直径10b的孔径，而透镜接收以仰角α2散射的光，从而可以提高同时检测缺陷和透镜性能的能力。

70. 发明申请

US20100140474A1 METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND AN APPARATUS THEREOF 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US20100140474A1
公开(公告)日：2010-06-10
申请号：US12652427
申请日：2010-01-05
申请人： Akira HAMAMATSU , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira HAMAMATSU , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N23/00 , G01N21/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
摘要翻译：在多个检查条件下检查样本的样本的检查方法和装置以及在多个检查条件下检查样本而获得的检查数据和对应于检查日期的样本的位置信息具有相应的检查条件。多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的获得。对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式