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    • 63. 发明授权
    • Method of fabricating a floating gate
    • 制造浮栅的方法
    • US06919247B1
    • 2005-07-19
    • US10655936
    • 2003-09-04
    • Yider WuKuo-Tung Chang
    • Yider WuKuo-Tung Chang
    • H01L21/28H01L21/8247
    • H01L21/28273
    • A method of fabricating a floating gate for a semiconductor device is disclosed and provided. According to this method, an undoped polycrystalline silicon layer is deposited on a tunnel oxide layer. The undoped polycrystalline silicon layer has a first thickness. Moreover, a doped polycrystalline silicon layer is deposited on the undoped polycrystalline silicon layer. The doped polycrystalline silicon layer has a second thickness. The undoped polycrystalline silicon layer and the doped polycrystalline silicon layer form the floating gate having a third thickness. In an embodiment, the semiconductor device is a flash memory device.
    • 公开并提供了制造用于半导体器件的浮栅的方法。 根据该方法,在隧道氧化物层上沉积未掺杂的多晶硅层。 未掺杂的多晶硅层具有第一厚度。 此外,掺杂的多晶硅层沉积在未掺杂的多晶硅层上。 掺杂多晶硅层具有第二厚度。 未掺杂多晶硅层和掺杂多晶硅层形成具有第三厚度的浮动栅极。 在一个实施例中,半导体器件是闪存器件。
    • 69. 发明授权
    • Process for forming electrically programmable read-only memory cell with
a merged select/control gate
    • 用于形成具有合并的选择/控制门的电可编程只读存储器单元的处理
    • US5429969A
    • 1995-07-04
    • US251162
    • 1994-05-31
    • Kuo-Tung Chang
    • Kuo-Tung Chang
    • H01L21/8247H01L27/115H01L29/423
    • H01L27/11521H01L27/115H01L29/42324Y10S257/90
    • Flash EEPROM cells having merged select/control gates may be formed, so that the portions of the channel regions that correspond to select transistors are formed after spacers are formed but prior to patterning a merged select/control gate layer. Because the portions of the channel regions that correspond to the select transistors are not determined by the patterning of the merged select/control gate layer, misalignment of the mask used to pattern the merged select/control gate layer does not affect the size of the select transistor portion of the channel region. The spacers may be left on over the substrate in the finished devices thereby saving at least one processing step. The memory structure may also be used in other EPROM-type memory cells, such as individually erasable EEPROMs and EPROMs that are not electrically erasable.
    • 可以形成具有合并的选择/控制栅极的闪速EEPROM单元,使得对应于选择晶体管的沟道区域的部分在形成间隔物之后但在构图合并的选择/控制栅极层之前形成。 由于与选择晶体管相对应的沟道区域的部分不是通过合并选择/控制栅极层的构图来确定的,所以用于对合并的选择/控制栅极层进行图案化的掩模的未对准不会影响选择 晶体管部分。 间隔物可以留在成品装置中的衬底上,从而节省至少一个处理步骤。 存储器结构也可以用于其它EPROM型存储单元,例如不可电擦除的单独可擦除EEPROM和EPROM。
    • 70. 发明授权
    • EEPROM memory device having a sidewall spacer floating gate electrode
and process
    • 具有侧壁间隔物浮栅电极和工艺的EEPROM存储器件
    • US5422504A
    • 1995-06-06
    • US235994
    • 1994-05-02
    • Kuo-Tung ChangUmesh SharmaJack Higman
    • Kuo-Tung ChangUmesh SharmaJack Higman
    • H01L27/115H01L29/423H01L29/788H01L21/8247
    • H01L27/115H01L29/42324H01L29/42328
    • An EEPROM memory array includes a plurality of memory cells having a floating gate electrode (22) formed as a sidewall spacer adjacent to a control gate electrode (20). Source and drain regions (12, 14) reside in a semiconductor substrate (10) and define a segmented channel region (16) therebetween. A select gate electrode (18) overlies a first channel region (24) and separates the floating gate electrode (22) from the source region (12). The control gate electrode (20) overlies a third channel region (28) and separates the floating gate electrode (22) from the drain region (14). The floating gate electrode (22) overlies a second channel region (26) and is separated therefrom by a thin tunnel oxide layer (42). The EEPROM device of the invention can be programmed by either source side injection, or by Fowler-Nordheim tunneling. Additionally, a process is provided for the fabrication of an EEPROM array utilizing adjacent select gate electrodes (18, 18') as a doping mask.
    • EEPROM存储器阵列包括具有形成为与控制栅极(20)相邻的侧壁间隔的浮栅电极(22)的多个存储单元。 源极和漏极区域(12,14)驻留在半导体衬底(10)中并且在它们之间限定分割的沟道区域(16)。 选择栅极(18)覆盖在第一沟道区(24)上,并将浮栅电极(22)与源极区(12)分离。 控制栅电极(20)覆盖第三沟道区(28),并将浮栅电极(22)与漏区(14)分离。 浮栅电极(22)覆盖第二沟道区(26),并由薄隧道氧化物层(42)分离。 本发明的EEPROM装置可以通过源侧注入或通过Fowler-Nordheim隧道进行编程。 此外,提供了一种制造使用相邻的选择栅电极(18,18')作为掺杂掩模的EEPROM阵列的工艺。