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61. 发明授权

US09215089B2 Touch sensor system 有权
标题翻译：触摸传感器系统
公开(公告)号：US09215089B2
公开(公告)日：2015-12-15
申请号：US13502078
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： G06F13/00 , H04L12/40 , G01L1/14 , G01L5/22 , G06F13/376
CPC分类号： H04L12/40032 , G01L1/142 , G01L1/146 , G01L5/228 , G06F13/376 , H04L12/40013
摘要： A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.
摘要翻译：触摸传感器系统包括总线，布置在总线上的多个触摸传感器装置，以及连接到所有总线并且集成来自触摸传感器装置的信息的信息集成装置。触摸传感器装置包括传感器单元和信号处理单元，该单元通过总线将通过处理模拟传感器信号而产生的传感器数据信号发送到信息集成装置。信号处理单元包括：数字转换单元，当传感器值超过预设阈值时给出信号处理开始许可的阈值评估单元;将传感器信号加上发射机标识号的ID添加单元，以及数据发送单元，其将传感器数据信号输出到总线的信号线。快速响应是可能的，而不增加数据量和主机处理负载，同时包括许多触摸传感器元件。

62. 发明授权

US08823114B2 Sensor device having electrode draw-out portions through side of substrate 有权
标题翻译：传感器装置具有通过衬底侧的电极引出部分
公开(公告)号：US08823114B2
公开(公告)日：2014-09-02
申请号：US13502083
申请日：2010-10-13
申请人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： H01L29/84 , H01L23/48 , G01L5/22 , G01L1/14 , B81C1/00 , H01L23/00 , H01L23/10
CPC分类号： B81C1/00238 , B81B2201/0264 , B81B2207/012 , B81C2201/019 , B81C2203/032 , B81C2203/0792 , G01L1/146 , G01L1/148 , G01L5/228 , H01L23/10 , H01L24/04 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/94 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/3512 , H01L2924/00
摘要： Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.
摘要翻译：提供了一种用于封装具有接触感测表面的传感器结构和处理传感器信号的信号处理LSI的技术。传感器结构具有接触感应表面和传感器电极。信号处理集成电路嵌入在半导体衬底中。传感器结构和半导体衬底通过接合层粘接，形成传感器装置作为单个芯片。传感器电极和集成电路密封在传感器装置的内部，并且集成电路的传感器电极和外部端子通过半导体衬底的侧表面被引出到半导体衬底的背面。

63. 发明授权

US08796850B2 Wiring connection method and functional device 有权
标题翻译：接线方式及功能设备
公开(公告)号：US08796850B2
公开(公告)日：2014-08-05
申请号：US13393577
申请日：2010-09-01
申请人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
发明人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
IPC分类号： H01L23/48 , H01L23/00
CPC分类号： H01L24/16 , B81B2203/04 , B81C3/001 , B81C2203/031 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/16503 , H01L2224/81192 , H01L2224/8181 , H01L2224/81893 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01R43/0214 , H01L2224/81 , H01L2924/00
摘要： By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.
摘要翻译：通过在第一基板10的连接电极12和第二基板15的连接电极17中的至少一个上形成金属层14，将第一基板10和第二基板15放置在一起，以使连接电极12和连接电极17通过金属层14彼此面对，提高温度直到阳极接合温度，并且在保持该温度的同时在第一基板10和第二基板15之间施加直流电压，第一基板10和第二基板 15被阳极结合，同时通过熔化金属层14，连接电极12和连接电极17电连接。该方法以高产率实现了基板的阳极接合，同时建立了线路连接，对包装有效。

64. 发明申请

US20080227060A1 Driving Mechanism Using Shape Memory Alloys And Devices Equipped With The Same 有权
标题翻译：使用形状记忆合金和装备的驱动机构
公开(公告)号：US20080227060A1
公开(公告)日：2008-09-18
申请号：US10585998
申请日：2005-01-19
申请人： Masayoshi Esashi , Yoichi Haga , Masanori Mizushima , Tadao Matsunaga
发明人： Masayoshi Esashi , Yoichi Haga , Masanori Mizushima , Tadao Matsunaga
IPC分类号： G09B21/00
CPC分类号： G09B21/004 , G09B21/007
摘要： A driving mechanism using shape memory alloys comprises a first and a second shape memory alloys coils (1, 2), a pin-like drive member (3) connected to each of the shape memory alloys coils (1, 2) extending in the axis direction, a substrate (4) having a wiring pattern (11) and a drive circuit (4a) to supply current to the shape memory alloys coils (1, 2), and a magnetic latch part (9) to hold the drive member (3), and the magnetic latch part (9) has a latch position in the axis direction of the drive member (3), the drive circuit (4a) selectively current-drives the first and the second shape memory alloys coils (1, 2), the driven first or second shape memory alloys coils (1, 2) is heated and compressed to move the drive member (3) in the axis direction, and magnetic bodies (9a, 9b) provided to the drive member (3) is magnetically fixed at the latch position, thereby fixed and held in the axis direction.
摘要翻译：使用形状记忆合金的驱动机构包括第一和第二形状记忆合金线圈（1,2），连接到沿着轴线延伸的每个形状记忆合金线圈（1,2）的销状驱动构件（3）具有布线图案（11）的基板（4）和向形状记忆合金线圈（1,2）供给电流的驱动电路（7a），以及用于将驱动部件（3），并且所述磁性锁定部（9）在所述驱动部件（3）的轴向上具有闩锁位置，所述驱动电路（4a）选择性地驱动所述第一形状记忆合金线圈（1），2）中，驱动的第一或第二形状记忆合金线圈（1,2）被加热和压缩以使驱动构件（3）沿轴向方向移动，并且设置到驱动构件的磁体（9a，9b）（3）磁性固定在锁定位置，从而固定并保持在轴向。

65. 发明申请

US20080017609A1 Probe Head Manufacturing Method 审中-公开
标题翻译：探头制造方法
公开(公告)号：US20080017609A1
公开(公告)日：2008-01-24
申请号：US11628313
申请日：2005-06-01
申请人： Hirokazu Takahashi , Takahito Ono , Masayoshi Esashi
发明人： Hirokazu Takahashi , Takahito Ono , Masayoshi Esashi
IPC分类号： B44C1/22
CPC分类号： G01Q70/16 , G01Q70/14 , G01Q80/00
摘要： A beam (32) of a probe bead (30) having a uniform thickness is formed by using a silicon layer (64) of a SOI substrate. The beam of the probe head is formed by growing a boron-doped diamond and non-doped diamond on a processing substrate, respectively.
摘要翻译：通过使用SOI衬底的硅层（64）形成具有均匀厚度的探针珠（30）的梁（32）。探针头的光束分别通过在处理衬底上生长硼掺杂金刚石和非掺杂金刚石来形成。

66. 发明授权

US07276707B2 Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus 有权
标题翻译：偏转器，偏转器制造方法和带电粒子束曝光装置
公开(公告)号：US07276707B2
公开(公告)日：2007-10-02
申请号：US11196262
申请日：2005-08-04
申请人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
发明人： Yuichi Iwasaki , Masato Muraki , Kenji Tamamori , Kouji Asano , Masayoshi Esashi , Yoshinori Nakayama , Shinichi Hashimoto , Yoshiaki Moro
IPC分类号： H01J37/30
CPC分类号： H01J37/045 , B82Y10/00 , B82Y40/00 , H01J37/1477 , H01J37/3174 , H01J2237/0437 , H01J2237/31774
摘要： A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.
摘要翻译：偏转带电粒子束的偏转器包括具有带电粒子束应穿过的开口的基板和设置在开口中以偏转带电粒子束的偏转电极，并具有第一导电部件和第二导电部件，通过电镀形成。第二导电构件形成在第一导电构件的表面上，并且基本上由比第一导电构件更难氧化的材料制成。

67. 发明授权

US07271946B2 Micromirror and micromirror device 失效
标题翻译：微镜和微镜装置
公开(公告)号：US07271946B2
公开(公告)日：2007-09-18
申请号：US11616433
申请日：2006-12-27
申请人： Masayoshi Esashi , Naoki Kikuchi
发明人： Masayoshi Esashi , Naoki Kikuchi
IPC分类号： G09G3/34
CPC分类号： G02B26/0841 , B81B3/0062 , B81B2201/042 , B81B2203/0109 , B81B2203/058
摘要： There is provided a micromirror, which is provided with a reflection mirror, a first pair of torsion bars formed to protrude from the reflection mirror, a first supporting frame that supports the reflection mirror such that the reflection mirror is torsionally rotatable about a first rotation axis via the first pair of torsion bars, a second pair of torsion bars formed to protrude from the first supporting frame in a direction substantially perpendicular to a direction in which the first pair of torsion bars are extended, and a second supporting frame that supports the first supporting frame such that the first supporting frame is torsionally rotatable about a second rotation axis substantially perpendicular to the first rotation axis via the second pair of torsion bars. In this configuration, each of the second pair of torsion bars includes two separate conductive members.
摘要翻译：提供了一种微反射镜，其具有反射镜，形成为从反射镜突出的第一对扭杆，支撑反射镜的第一支撑框架，使得反射镜可绕第一旋转轴线经由所述第一对扭杆，第二对扭杆形成为在与所述第一对扭杆延伸的方向基本垂直的方向上从所述第一支撑框架突出;以及第二支撑框架，其支撑所述第一对扭杆支撑框架，使得第一支撑框架能够通过第二对扭杆围绕基本上垂直于第一旋转轴线的第二旋转轴线扭转旋转。在该构造中，第二对扭杆中的每一个包括两个单独的导电构件。

68. 发明申请

US20070171501A1 MICROMIRROR AND MICROMIRROR DEVICE 失效
标题翻译： MICROMIRROR和MICROMIRROR设备
公开(公告)号：US20070171501A1
公开(公告)日：2007-07-26
申请号：US11616433
申请日：2006-12-27
申请人： Masayoshi ESASHI , Naoki KIKUCHI
发明人： Masayoshi ESASHI , Naoki KIKUCHI
IPC分类号： G02B26/08
CPC分类号： G02B26/0841 , B81B3/0062 , B81B2201/042 , B81B2203/0109 , B81B2203/058
摘要： There is provided a micromirror, which is provided with a reflection mirror, a first pair of torsion bars formed to protrude from the reflection mirror, a first supporting frame that supports the reflection mirror such that the reflection mirror is torsionally rotatable about a first rotation axis via the first pair of torsion bars, a second pair of torsion bars formed to protrude from the first supporting frame in a direction substantially perpendicular to a direction in which the first pair of torsion bars are extended, and a second supporting frame that supports the first supporting frame such that the first supporting frame is torsionally rotatable about a second rotation axis substantially perpendicular to the first rotation axis via the second pair of torsion bars. In this configuration, each of the second pair of torsion bars includes two separate conductive members.
摘要翻译：提供了一种微反射镜，其具有反射镜，形成为从反射镜突出的第一对扭杆，支撑反射镜的第一支撑框架，使得反射镜可绕第一旋转轴线经由所述第一对扭杆，第二对扭杆形成为在与所述第一对扭杆延伸的方向基本垂直的方向上从所述第一支撑框架突出;以及第二支撑框架，其支撑所述第一对扭杆支撑框架，使得第一支撑框架能够通过第二对扭杆围绕基本上垂直于第一旋转轴线的第二旋转轴线扭转旋转。在该构造中，第二对扭杆中的每一个包括两个单独的导电构件。

69. 发明申请

US20060273692A1 Bimorph switch, bimorph switch manufacturing method, electronic circuitry and electronic circuitry manufacturing method 有权
标题翻译：双压电开关，双压电晶片开关制造方法，电子电路和电子电路制造方法
公开(公告)号：US20060273692A1
公开(公告)日：2006-12-07
申请号：US11504381
申请日：2006-08-15
申请人： Hirokazu Sanpei , Jun Mizuno , Masazumi Yasuoka , Humikazu Takayanagi , Takehisa Tokoshima , Masaru Miyazaki , Masayoshi Esashi
发明人： Hirokazu Sanpei , Jun Mizuno , Masazumi Yasuoka , Humikazu Takayanagi , Takehisa Tokoshima , Masaru Miyazaki , Masayoshi Esashi
IPC分类号： H01L41/08
CPC分类号： H01H61/00 , H01H1/0036 , H01H2061/006
摘要： A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.
摘要翻译：电动连接行走触点和固定触点的双压电晶片开关。开关包括具有前表面，后表面和从前表面到后表面穿透的通孔的基板; 从所述通孔的孔的边缘部分朝向所述孔的内部延伸的固定接触; 以及将移动接触件保持在面对孔径的位置并驱动行驶接触件的双压电晶片部分。双晶片部分的一端可以形成在形成在基板的正面上的氧化硅层上。

70. 发明授权

US06938489B2 Oscillatory type pressure sensor 有权
标题翻译：振荡式压力传感器
公开(公告)号：US06938489B2
公开(公告)日：2005-09-06
申请号：US10486331
申请日：2003-01-20
申请人： Masayoshi Esashi , Kaoru Hirata
发明人： Masayoshi Esashi , Kaoru Hirata
IPC分类号： G01L9/00 , G01L11/00
CPC分类号： G01L9/0017
摘要： A high-sensitive and high accuracy vibrating type pressure sensor (1) allowing a corrosive gas pressure to be directly applied thereto, having a heat resistance, and having no room for mixing of noise into a vibrator, comprising a stainless steel pressure receiving diaphragm (4) for receiving a fluid pressure P on a rear surface side, the vibrator (12) formed on the front surface side of the pressure receiving diaphragm (4), a wall body (8) disposed so as to surround the periphery of the vibrator (12), and a permeable part (20) for light transmission for changing an internal space in which the vibrator (12) is present into a vacuum chamber (10) by closing an opening part (8a) in the wall body (8), whereby, since the diaphragm (4) is formed of the stainless steel with corrosion resistance, the sensor can also be applied to corrosive fluid, since circuit wiring is eliminated from the vibrator (12) and the vibrator is isolatedly disposed in the vacuum chamber (10), mixing of electromagnetic noise can be eliminated, and since the resonance frequency fn of the vibrator (12) is performed by optical measurement in the state of non-contact, extremely high-sensitive and high-accuracy detection can be performed. A forced vibration device (57) can also be operated by piezo driving and electrostatic driving from the outside without generating noise.
摘要翻译：一种高灵敏度和高精度的振动式压力传感器（1），其允许直接施加腐蚀性气体压力，具有耐热性，并且不具有混合振动器的噪声的空间，包括不锈钢压力接收膜片（ 4），用于在后表面侧接收流体压力P，形成在压力接收膜（4）的前表面侧上的振动器（12），围绕振动器的周边设置的壁体（8）（12）和用于通过封闭所述壁体（8）中的开口部（8a）而将存在所述振动器（12）的内部空间改变为真空室（10）的透光性透过部（20）），由于隔膜（4）由具有耐腐蚀性的不锈钢形成，所以传感器也可以应用于腐蚀性流体，因为电路布线从振动器（12）中消除并且振动器被隔离地设置在真空中室（1 0），可以消除电磁噪声的混合，并且由于振动器（12）的共振频率fn通过非接触状态下的光学测量进行，因此可以进行极高灵敏度和高精度的检测。强制振动装置（57）也可以通过压电驱动和静电驱动从外部操作而不产生噪声。

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