专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明授权

US07735715B2 Dispensing solder for mounting semiconductor chips 有权
标题翻译：分配用于安装半导体芯片的焊料
公开(公告)号：US07735715B2
公开(公告)日：2010-06-15
申请号：US11952296
申请日：2007-12-07
申请人： Kui Kam Lam , Chun Hung Samuel Ip
发明人： Kui Kam Lam , Chun Hung Samuel Ip
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K3/063 , B23K2101/40 , H01L24/743 , H01L2224/743 , H01L2924/07802 , H01L2924/14 , H01L2924/00
摘要： A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.
摘要翻译：将半导体芯片安装到衬底上的方法包括以下步骤：将焊料分配器定位在衬底上并将一定长度的焊丝通过焊料分配器传送到衬底。在送丝方向上将丝线馈送到基片上用送丝机进行控制。焊料分配器相对于基板移动，其中定位装置沿着两个正交轴线中的至少一个垂直于馈送方向，同时将焊丝馈送到基板的表面，以将熔融焊料线分配到基质。然后将半导体芯片安装到已经分配到基板上的熔融焊料上。

62. 发明授权

US07667355B2 Apparatus for generating amplified cooling air flows 有权
标题翻译：用于产生放大的冷却空气流的装置
公开(公告)号：US07667355B2
公开(公告)日：2010-02-23
申请号：US11969575
申请日：2008-01-04
申请人： Yuk Cheung Au , Kin Yik Hung , Wing Chiu Derek Lai , Pak Kin Leung , Cheuk Wah Chester Tang , Wai Lam
发明人： Yuk Cheung Au , Kin Yik Hung , Wing Chiu Derek Lai , Pak Kin Leung , Cheuk Wah Chester Tang , Wai Lam
IPC分类号： H02K41/00
CPC分类号： H02K41/03 , H02K5/20 , H02K9/02
摘要： A linear motor comprising a coil assembly and a magnet assembly is provided with a cooling apparatus which comprises a segmented air knife assembly. The segmented air knife assembly has a plurality of slot openings distributed along its length which is coupled to the linear motor and it is operative to discharge cooling air into a gap between the coil assembly and magnet assembly in a discharge direction. An inclined surface extends from the plurality of slot openings and slopes at an obtuse angle away from the discharge direction of the cooling air. Each slot opening is individually configured to discharge the cooling air in the discharge direction at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the cooling air that is so discharged.
摘要翻译：包括线圈组件和磁体组件的线性电动机设置有包括分段气刀组件的冷却装置。分段气刀组件具有沿其长度分布的多个槽口，其连接到线性电动机，并且其可操作以沿排出方向将冷却空气排出到线圈组件和磁体组件之间的间隙中。倾斜表面从多个狭槽开口和斜角以钝角远离冷却空气的排放方向延伸。每个槽口单独地构造成以足够的速度在排出方向排出冷却空气，以沿着倾斜表面夹带大气，以放大这样排出的冷却空气。

63. 发明授权

US07654436B2 Wire bonding system utilizing multiple positioning tables 有权
标题翻译：使用多个定位台的接线系统
公开(公告)号：US07654436B2
公开(公告)日：2010-02-02
申请号：US11858505
申请日：2007-09-20
申请人： Wing Cheung James Ho , Hon Shing Eddie Law , Kam Hong Kenneth Lam , Wai Lok Ben To
发明人： Wing Cheung James Ho , Hon Shing Eddie Law , Kam Hong Kenneth Lam , Wai Lok Ben To
IPC分类号： B23K31/02
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/78301 , H01L2224/78313 , H01L2224/78801 , H01L2224/85121 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.
摘要翻译：一种引线接合装置和方法，其中提供单独的第一和第二定位台用于安装待接线的电子设备，并且在用于接合电子设备的接合位置处提供接合工具。提供第一和第二装载/卸载位置用于将电子装置从定位台装载或卸载电子装置。第一和第二定位台可操作以彼此独立地移动，使得第一定位台可在第一装载/卸载位置和结合位置之间移动，并且第二定位台可在第二装载/卸载位置与粘接位置。

64. 发明授权

US07649333B2 Active damping device for a positioning stage 有权
标题翻译：用于定位平台的主动阻尼装置
公开(公告)号：US07649333B2
公开(公告)日：2010-01-19
申请号：US11623171
申请日：2007-01-15
申请人： Ping Kong Joseph Choy , Siu Wing Or , Chung Sheung Yung , Chou Kee Peter Liu , Lai Wa Helen Chan-Wong
发明人： Ping Kong Joseph Choy , Siu Wing Or , Chung Sheung Yung , Chou Kee Peter Liu , Lai Wa Helen Chan-Wong
IPC分类号： G05B5/01
CPC分类号： G05B19/404 , G03F7/70716 , G03F7/709 , G05B2219/49054
摘要： A damping apparatus is provided for a positioning stage that is operative to move and position an object along a motion axis. The damping apparatus comprises a motion transformation device operative to rotate the positioning stage about a rotary axis that is substantially perpendicular to the motion axis, in response to forces generated to the positioning stage during acceleration or deceleration thereof. Resilient elements connected to the positioning stage serve to reduce transmission of vibration generated from the positioning stage.
摘要翻译：提供了一种用于定位台的阻尼装置，其可操作以沿着运动轴线移动和定位物体。阻尼装置包括运动变换装置，其响应于在其加速或减速期间产生到定位台的力而可操作地围绕基本上垂直于运动轴线的旋转轴旋转定位台。连接到定位台的弹性元件用于减少从定位台产生的振动的传播。

65. 发明授权

US07462926B2 Leadframe comprising tin plating or an intermetallic layer formed therefrom 有权
标题翻译：引线框架包括镀锡或由其形成的金属间层
公开(公告)号：US07462926B2
公开(公告)日：2008-12-09
申请号：US11293711
申请日：2005-12-01
申请人： Ran Fu , Deming Liu , Yiu Fai Kwan
发明人： Ran Fu , Deming Liu , Yiu Fai Kwan
IPC分类号： H01L23/495 , H01L21/00 , B32B15/00
CPC分类号： H01L23/49582 , H01L2924/00014 , H01L2924/0002 , Y10T428/12694 , Y10T428/12708 , Y10T428/12771 , Y10T428/12882 , Y10T428/12903 , H01L2224/45099 , H01L2924/00
摘要： A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.
摘要翻译：提供一种制造引线框架的方法，该方法包括以下步骤：提供基板，用锡层镀基材，在锡层上镀镍层，然后在该层上镀覆一层或多层保护层的镍。引线框架之后可以被加热以产生包含锡的一个或多个金属间层，其阻止铜从引线框架的基底材料向其表面的向外扩散。

66. 发明授权

US07410039B2 Tunable vibration absorption device 有权
标题翻译：可调振动吸收装置
公开(公告)号：US07410039B2
公开(公告)日：2008-08-12
申请号：US11051155
申请日：2005-02-04
申请人： Siu Wing Or , Lai Wa Helen Chan-Wong , Ping Kong Joseph Choy , Chou Kee Peter Liu
发明人： Siu Wing Or , Lai Wa Helen Chan-Wong , Ping Kong Joseph Choy , Chou Kee Peter Liu
IPC分类号： F16F7/10
CPC分类号： F16F7/104 , F16F7/1005
摘要： A tunable vibration absorption device is provided that is suitable for active or semi-active vibration absorption or damping of vibrations in vibrating structures. It comprises a stack including a force actuator mechanism for generating an axial actuation force and a force sensor mechanism which is responsive to an external force acting on the stack to generate a force signal. A controller unit is electrically connected to the force sensor mechanism for receiving the force signal generated by the force sensor mechanism, and it is also electrically connected to the force actuator mechanism for adjusting the axial actuation force generated by the force actuator mechanism in response to the received force signal generated by the force sensor mechanism.
摘要翻译：提供了一种适用于振动结构中振动的主动或半主动振动吸收或阻尼的可调振动吸收装置。它包括一个堆叠，其包括用于产生轴向致动力的力致动器机构和响应于作用在堆叠上的外力产生力信号的力传感器机构。控制器单元电连接到力传感器机构，用于接收由力传感器机构产生的力信号，并且其还与力致动器机构电连接，以响应于所述力致动器机构产生的轴向致动力由力传感器机构产生的受力信号。

67. 发明申请

US20070126096A1 Leadframe comprising tin plating or an intermetallic layer formed therefrom 有权
标题翻译：引线框架包括镀锡或由其形成的金属间层
公开(公告)号：US20070126096A1
公开(公告)日：2007-06-07
申请号：US11293711
申请日：2005-12-01
申请人： Ran Fu , Deming Liu , Yiu Kwan
发明人： Ran Fu , Deming Liu , Yiu Kwan
IPC分类号： H01L23/495
CPC分类号： H01L23/49582 , H01L2924/00014 , H01L2924/0002 , Y10T428/12694 , Y10T428/12708 , Y10T428/12771 , Y10T428/12882 , Y10T428/12903 , H01L2224/45099 , H01L2924/00
摘要： A method of producing a leadframe is provided comprising the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.
摘要翻译：提供一种制造引线框架的方法，包括以下步骤：提供基板，用锡层镀基板，在锡层上镀镍层，然后在镍层上镀覆一层或多层保护层。引线框架之后可以被加热以产生包含锡的一个或多个金属间层，其阻止铜从引线框架的基底材料向其表面的向外扩散。

68. 发明授权

US07182118B2 Pick and place assembly for transporting a film of material 有权
标题翻译：拾取和放置用于运输材料膜的组装
公开(公告)号：US07182118B2
公开(公告)日：2007-02-27
申请号：US10452993
申请日：2003-06-02
申请人： Yiu Ming Cheung , Chi Ming Chong
发明人： Yiu Ming Cheung , Chi Ming Chong
IPC分类号： B29C65/78
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/6838 , H01L24/29 , H01L24/743 , H01L2224/27334 , H01L2224/2919 , H01L2224/83101 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2224/8388 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , Y10T156/171 , Y10T156/1744 , H01L2924/00
摘要： The invention provides a pick and place assembly for transferring a film of material. The assembly comprises a collet having a substantially convex contact surface for contacting the film, the collet including a vacuum suction device operative to generate a force to hold the film. The film may comprise a thermoplastic adhesive tape or B-stage thermoset epoxy coated film.
摘要翻译：本发明提供了一种用于转移材料膜的拾取和放置组件。组件包括具有用于接触薄膜的基本凸形的接触表面的夹头，该夹头包括用于产生保持薄膜的力的真空抽吸装置。该膜可以包含热塑性胶带或B级热固性环氧涂层膜。

69. 发明授权

US07147721B2 Apparatus and method for cleaning electronic packages 有权
标题翻译：电子包装清洗装置及方法
公开(公告)号：US07147721B2
公开(公告)日：2006-12-12
申请号：US10698379
申请日：2003-11-03
申请人： Chi Wah Cheng , Yui Ko Wong , Tim Wai Mak
发明人： Chi Wah Cheng , Yui Ko Wong , Tim Wai Mak
IPC分类号： B08B3/10
CPC分类号： B08B3/12 , B08B3/123 , H01L21/481 , H01L21/67051
摘要： The invention provides an apparatus and method for cleaning a plurality of electronic components. A tank is provided for containing a cleaning fluid and an ultrasonic resonator is mounted in communication with the cleaning fluid for charging ultrasonic energy thereto. A support platform positionable over a top surface of the cleaning fluid supports the electronic components such that the electronic components are in contact with said top surface of the cleaning fluid in use. Further, a cleaning fluid supply system is configured to generate a continuous flow of cleaning fluid into the tank for cleaning the electronic components in contact with said top surface of the cleaning fluid.
摘要翻译：本发明提供一种用于清洁多个电子部件的装置和方法。提供容器用于容纳清洁液体，并且超声波谐振器被安装成与用于向其提供超声波能量的清洁流体连通。可在清洁流体的顶表面上定位的支撑平台支撑电子部件，使得电子部件在使用中与清洁流体的所述顶表面接触。此外，清洁流体供应系统被配置为产生连续的清洁流体流入罐中，用于清洁与清洁流体的所述顶表面接触的电子部件。

70. 发明授权

US07087202B2 Particulate reinforced aluminum composites, their components and the near net shape forming process of the components 有权
标题翻译：颗粒增强铝复合材料，其组分和组分的近净形状成型过程
公开(公告)号：US07087202B2
公开(公告)日：2006-08-08
申请号：US10628528
申请日：2003-07-28
申请人： Deming Liu , Chou Kee Peter Liu , Jian Zhong Fan , Jun Xu , Tao Zuo , Zhao Zu Gao
发明人： Deming Liu , Chou Kee Peter Liu , Jian Zhong Fan , Jun Xu , Tao Zuo , Zhao Zu Gao
IPC分类号： B22F3/12
CPC分类号： C22F1/047 , B22D17/007 , B22F2009/041 , B22F2998/10 , C22C2001/1073 , C22F1/04 , Y10T428/256 , B22F9/04 , B22F3/04 , C22C1/1036
摘要： This invention concerns particulate reinforced Al-based composites, and the near net shape forming process of their components. The average size of the reinforced particle in the invented composites is 0.1–3.5 μm and the volume percentage is 10–40%, and a good interfacial bonding between the reinforced particulate and the matrix is formed with the reinforced particles uniformly distributed. The production method of its billet is to have the reinforced particles and Al-base alloy powder receive variable-speed high-energy ball-milling in the balling drum. Then, with addition of a liquid surfactant, the ball-mill proceeds to carry on ball-milling. After the ball-milling, the produced composite powder undergoes cold isostatic pressing and the subsequent vacuum sintering or vacuum hot-pressing to be shaped into a hot compressed billet, which in turn undergoes semisolid thixotropic forming and may be shaped into complex-shaped components. These components can be used in various fields. This product is featured with excellent property, good machinability, stable quality, component near net shape forming and cost effective and higher performance.
摘要翻译：本发明涉及颗粒增强的基于Al的复合材料及其组分的近净形状形成过程。本发明复合材料中增强颗粒的平均尺寸为0.1-3.5μm，体积百分比为10-40％，增强颗粒与基质之间形成良好的界面结合，增强颗粒均匀分布。钢坯的生产方法是将球磨机中的增强颗粒和Al基合金粉末接受可变速高能球磨。然后，加入液体表面活性剂，使球磨机进行球磨。在球磨后，所生产的复合粉末进行冷等静压，随后进行真空烧结或真空热压成型为热压缩坯料，其又进行半固体触变形成并且可以成形为复杂形状的组分。这些组件可用于各种领域。本产品具有优良的性能，良好的机械加工性，质量稳定性，近净成型成分，成本效益高，性能更高。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式