专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09999936B2 Solder wire bobbinless coil 有权
公开(公告)号：US09999936B2
公开(公告)日：2018-06-19
申请号：US15183895
申请日：2016-06-16
申请人： NIHON SUPERIOR CO., LTD.
发明人： Tetsuro Nishimura , Yutaka Fukushima , Hideki Yoshida
IPC分类号： B23K3/06 , B23K35/02
CPC分类号： B23K3/063 , B23K35/0227
摘要： A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening.

2. 发明授权

US09919374B2 Robotic gripper sensor 有权
公开(公告)号：US09919374B2
公开(公告)日：2018-03-20
申请号：US14879569
申请日：2015-10-09
申请人： TYCO ELECTRONICS CORPORATION
发明人： Huadong Wu , Yasser M. Eldeeb
IPC分类号： B23K3/08 , B23K1/005 , B23K37/00 , B23K37/04
CPC分类号： B23K3/087 , B23K1/0016 , B23K1/0056 , B23K3/063 , B23K37/00 , B23K37/04
摘要： A gripper sensor device for aligning fine wires. The robotic gripper sensor device including a housing having a probe receiving cavity. A sensor probe is positioned in the probe receiving cavity. An arm of a positioning member includes a wire engagement section for engaging respective fine wires and a probe engagement section for engaging a portion of the sensor probe. As the wire engagement section is moved into cooperation with the wire, force is applied to the arm of the positioning member causing the probe engagement section to move relative to the portion of the probe, causing the probe to convert a stress change of the portion of the probe into a force reading.

3. 发明申请

US20180065201A1 SOLDER PROCESSING DEVICE 审中-公开
公开(公告)号：US20180065201A1
公开(公告)日：2018-03-08
申请号：US15561488
申请日：2016-03-25
申请人： AND Co., Ltd.
发明人： Mitsuo EBISAWA
IPC分类号： B23K1/002 , B23K3/03 , B23K3/06 , H05K3/34
CPC分类号： B23K1/002 , B23K3/02 , B23K3/0315 , B23K3/06 , B23K3/0615 , B23K3/063 , H05K3/34
摘要： In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).

4. 发明授权

US09889516B2 Device for dispensing and distributing flux-free solder on a substrate 有权
公开(公告)号：US09889516B2
公开(公告)日：2018-02-13
申请号：US14323420
申请日：2014-07-03
申请人： Besi Switzerland AG
发明人： Christoffer Stroemberg , Heinrich Berchtold , Charles Galea
IPC分类号： B23K1/06 , B23K3/06
CPC分类号： B23K1/06 , B23K1/0016 , B23K3/063
摘要： A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.

5. 发明申请

US20150231722A1 SEMI-AUTOMATIC BRAZING DEVICE 审中-公开
标题翻译：半自动切割装置
公开(公告)号：US20150231722A1
公开(公告)日：2015-08-20
申请号：US14703248
申请日：2015-05-04
申请人： LINCOLN GLOBAL, INC.
发明人： DAVID J NANGLE , Andreu P. Meckler , Robert M. Henson
IPC分类号： B23K3/08 , B23K3/06
CPC分类号： B23K3/08 , B23K3/0384 , B23K3/063 , B23K9/095 , B23K9/124 , B23K9/323
摘要： A semi-automatic brazing apparatus having a brazing wire feeding apparatus containing a brazing wire feed mechanism, a controller, and a user input device. The brazing wire from a brazing wire source is continuously drawn from the source through the apparatus via the feeding mechanism and is directed towards a brazing gun for a semi-automatic brazing operation.
摘要翻译：一种半自动钎焊装置，具有包含钎焊丝进给机构的钎焊丝进给装置，控制器和用户输入装置。来自铜焊丝源的钎焊线经由进给机构从源极连续地抽出，并被引导到用于半自动钎焊操作的钎焊枪。

6. 发明申请

US20140291384A1 Solder wire dispenser, a portable hand-held device to apply solder accuratel and without touching the solder wire. 审中-公开
标题翻译：焊丝分配器，便携式手持式设备，可以焊接准确而不接触焊丝。
公开(公告)号：US20140291384A1
公开(公告)日：2014-10-02
申请号：US13663499
申请日：2013-03-27
申请人： Nelson Sigfrido Canelo
发明人： Nelson Sigfrido Canelo
IPC分类号： B23K3/06
CPC分类号： B23K3/0615 , B23K3/063
摘要： A hand-held device shaped as a pencil used for dispensing solder wire onto a soldering point. Such device contains a roll of solder wire that can be gradually extracted through a hole on the tip by pressing a button in forward motion to extract the solder without touching it. The device can be held in one hand and the dispensing of the solder wire is performed by an internal servo-mechanism that controls the amount of solder and the speed at which it is dispensed. The extracted solder can be pulled back into the device in order to retrieve small portions of the already extracted solder by pressing the same or a different button in backward motion in order to maintain a desired amount of solder outside the device. The device can be electrically powered by “AA” size batteries, or by an external power supply.
摘要翻译：一种手提设备，其形状为用于将焊丝分配到焊接点上的铅笔。这种装置包含一卷焊丝，其可以通过向前运动中的按钮逐渐地从尖端上的孔中提取，以提取焊料而不接触焊料。该装置可以单手握住，并且通过控制焊料量和分配速度的内部伺服机构来执行焊丝的分配。提取的焊料可以被拉回到设备中，以便通过在相反的方向按压相同的或不同的按钮来取回已经提取的焊料的一小部分，以便在器件外部保持所需量的焊料。该设备可以由“AA”尺寸的电池或外部电源供电。

7. 发明授权

US08803033B2 Semi-automatic brazing device 有权
标题翻译：半自动钎焊装置
公开(公告)号：US08803033B2
公开(公告)日：2014-08-12
申请号：US12256041
申请日：2008-10-22
申请人： David J. Nangle , Andreu P Meckler , Robert Henson
发明人： David J. Nangle , Andreu P Meckler , Robert Henson
IPC分类号： B23K9/12
CPC分类号： B23K3/08 , B23K3/0384 , B23K3/063 , B23K9/095 , B23K9/124 , B23K9/323
摘要： A semi-automatic brazing apparatus having a brazing wire feeding apparatus containing a brazing wire feed mechanism a controller, and a user input device. The brazing wire from a brazing wire source is continuously drawn from the source through the apparatus via the feeding mechanism and is directed towards a brazing gun for a semi-automatic brazing operation.
摘要翻译：一种半自动钎焊装置，具有包含钎焊丝进给机构的钎焊丝供给装置，控制器和用户输入装置。来自铜焊丝源的钎焊线经由进给机构从源极连续地抽出，并被引导到用于半自动钎焊操作的钎焊枪。

8. 发明申请

US20120286026A1 WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR 审中-公开
标题翻译：电线，其输送方法及其设备
公开(公告)号：US20120286026A1
公开(公告)日：2012-11-15
申请号：US13469745
申请日：2012-05-11
申请人： Tetsuro Nishimura
发明人： Tetsuro Nishimura
IPC分类号： B23K1/00
CPC分类号： B23K3/063 , B23K35/0227 , B23K35/0238 , B23K35/3613 , B23K35/362 , B23K35/40 , B23K2101/42 , Y10T428/12222 , Y10T428/2938
摘要： Provided is a solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The wire solder has a single or multiple strands bound together. The wire solder is supplied from upstream of a location of soldering while the core wire is rewound under tension at a location downstream of the location of soldering.
摘要翻译：提供具有高拉伸强度和抗拉切性的焊料。焊丝具有延长的焊丝和具有比焊丝更高的拉伸强度的芯线。线焊料具有结合在一起的单股或多股。在焊接位置的下游位置，当芯线在张力下重绕时，焊丝从焊接位置的上游供电。

9. 发明授权

US08011557B1 Automatic soldering machine 有权
标题翻译：自动焊接机
公开(公告)号：US08011557B1
公开(公告)日：2011-09-06
申请号：US12850591
申请日：2010-08-04
申请人： Shao-bo Zhang , Sung-lin Chen , Xiao-lin Wu
发明人： Shao-bo Zhang , Sung-lin Chen , Xiao-lin Wu
IPC分类号： B23K37/04
CPC分类号： B23K3/063 , B23K1/0016 , B23K2101/38
摘要： An automatic soldering machine for soldering wires, each exposing at least one core wire and electronic components with at least one soldering portion respectively is disclosed. The automatic soldering machine comprises an equipment, a delivery mechanism, a plurality of clamps, a feeding mechanism, an insulation removing mechanism, a soldering mechanism, an unloading mechanism and a programmable control system. The delivery mechanism delivers the wires. The clamps locate the wires. The feeding mechanism conveys the electronic components. The insulation removing mechanism cuts the core wires and strips insulations at tops of the core wires. The soldering mechanism solders the core wires and the soldering portions of the electronic components. The unloading mechanism separates the soldered electronic components and core wires off from the clamps. The programmable control system is connect to the aforesaid mechanisms and controls thereof with high production efficacy and stable production quality.
摘要翻译：公开了一种用于焊接电线的自动焊接机，其中分别暴露至少一个芯线和至少一个焊接部分的电子部件。自动焊接机包括设备，输送机构，多个夹具，进给机构，绝缘去除机构，焊接机构，卸载机构和可编程控制系统。输送机构传送电线。夹具定位电线。送料机构传送电子元件。绝缘去除机构切割芯线并在芯线顶部剥离绝缘体。焊接机构焊接芯线和电子部件的焊接部分。卸载机构将焊接的电子部件和芯线与夹具分开。可编程控制系统与上述机械连接并具有高生产效率和稳定生产质量的控制。

10. 发明授权

US07780058B2 Braided solder 有权
标题翻译：编织焊锡
公开(公告)号：US07780058B2
公开(公告)日：2010-08-24
申请号：US12038809
申请日：2008-02-27
申请人： Siuyoung Yao , Brian Taggart
发明人： Siuyoung Yao , Brian Taggart
IPC分类号： B23K35/14 , B23K31/02
CPC分类号： B23K1/00 , B23K3/063 , B23K35/0227 , B23K35/262 , B23K35/3006 , B23K35/362 , B23K35/365 , Y10T428/12222
摘要： Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present. In accordance with one soldering technique, a method of soldering is accomplished by melting a plurality of braided solder strands to join a plurality of metallic surfaces together.
摘要翻译：公开了改进的焊料和焊接方法。根据一种技术，使用具有编织在一起的多个单独的线股的焊料。根据另一种技术，编织焊料包括单个焊丝股线中相同的焊料组成和线规。根据另一种技术，编织焊料包括用于各个焊丝线中的至少两种不同的焊料组合物。根据另一技术，编织焊料包括在单独的焊丝股线中使用的至少两种不同的线规。根据另一种技术，编织焊料包括至少一根线股，其中主表面涂覆有贵金属的薄层。根据另一种技术，编织焊料包括至少一根线束，其中存在焊剂材料。根据一种焊接技术，焊接方法是通过熔化多个编织的焊料线来将多个金属表面结合在一起来实现的。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式