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51. 发明授权

US07367769B2 Semiconductor production system, cluster tool, control method of semiconductor production system and maintenance method of cluster tool 有权
标题翻译：半导体生产系统，集群工具，半导体生产系统的控制方法和集群工具的维护方法
公开(公告)号：US07367769B2
公开(公告)日：2008-05-06
申请号：US10471289
申请日：2002-03-18
申请人： Tomoyuki Ishii , Masahiro Numakura
发明人： Tomoyuki Ishii , Masahiro Numakura
IPC分类号： H01L21/677 , G06F7/00
CPC分类号： H01L21/67276 , G05B2219/45032 , Y10S414/139
摘要： PS control sections MC1, MC2 configured to independently control the operations in process ships PS1, PS2 are provided respectively, and an LM control section MC3 configured to control the operation in a loader module LM is provided independently.With this structure, the operations of the process ships PS1, PS2 and the loader module LM can be checked while the process ships PS1, PS2 are not coupled to the loader module LM.
摘要翻译：分别提供被配置为独立地控制处理船舶PS 1，PS 2中的操作的PS控制部分MC 1，MC 2，并且独立地提供被配置为控制加载器模块LM中的操作的LM控制部分MC 3。利用这种结构，可以在处理装置PS 1，PS 2未联接到装载机模块LM的同时检查处理船PS 1，PS 2和装载机模块LM的操作。

52. 发明授权

US07335277B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US07335277B2
公开(公告)日：2008-02-26
申请号：US10656334
申请日：2003-09-08
申请人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
发明人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00
CPC分类号： H01L21/6719 , H01L21/67017 , Y10S414/135 , Y10S414/139
摘要： A vacuum processing apparatus comprising a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas; and a mass flow controller unit interposed between two processing chambers for supplying gas to the chambers.
摘要翻译：一种真空处理装置，包括设置在其中心的转印单元，多个处理室，每个处理室具有用于支撑待处理物体的处理台，并使用气体进行处理; 以及插入在用于向所述室供应气体的两个处理室之间的质量流量控制器单元。

53. 发明授权

US07331751B2 Vacuum processing method 有权
标题翻译：真空加工方法
公开(公告)号：US07331751B2
公开(公告)日：2008-02-19
申请号：US10658291
申请日：2003-09-10
申请人： Naoyuki Tamura
发明人： Naoyuki Tamura
IPC分类号： B65H1/00 , C23F1/00 , H01L21/306 , C23C16/00
CPC分类号： H01L21/67259 , C23C14/54 , C23C14/566 , C23C14/568 , H01L21/67155 , Y10S414/135 , Y10S414/136 , Y10S414/139
摘要： A vacuum processing method includes an atmospheric transfer step of transferring a wafer in atmospheric air to a vacuum transfer chamber using atmospheric transfer equipment disposed in atmospheric air, a vacuum transfer step of transferring the wafer received from the atmospheric transfer equipment to a position for a predetermined treatment within a vacuum processing chamber using vacuum transfer equipment disposed within the vacuum transfer chamber connecting the atmospheric transfer equipment and the vacuum processing chamber, a step of detecting the displacement of the wafer in a transverse direction with respect to a traveling direction near an ingress path of the wafer to the vacuum processing chamber by comparing a correct position of the wafer passing a line which is predetermined in advance with an actual position of said wafer being transferred by the vacuum transfer equipment, and a step of correcting the detected displacement of the wafer.
摘要翻译：一种真空处理方法，其特征在于，包括使用大气输送装置将大气中的晶片转移到真空输送室的大气转移步骤，将从大气压输送装置接收的晶片转移到预定的位置的真空转印工序; 使用设置在连接大气传送设备和真空处理室的真空传送室内的真空转移设备在真空处理室内进行处理;检测晶片相对于进入路径附近的行进方向在横向上的位移的步骤通过将通过预先确定的线的晶片的正确位置与通过真空传输设备传送的所述晶片的实际位置进行比较来确定晶片的位置，以及校正检测到的晶片位移的步骤。

54. 发明申请

US20070237609A1 APPARATUS FOR STORING AND MOVING A CASSETTE 审中-公开
标题翻译：存储和移动CASSETTE的装置
公开(公告)号：US20070237609A1
公开(公告)日：2007-10-11
申请号：US11766093
申请日：2007-06-20
申请人： Jaim Nulman , Nissim Sidi
发明人： Jaim Nulman , Nissim Sidi
IPC分类号： B65H1/00
CPC分类号： H01L21/67769 , H01L21/67028 , H01L21/67271 , H01L21/68707 , Y10S414/139 , Y10S414/14
摘要： A cassette stocker includes a plurality of cassette storage shelves positioned adjacent a cleanroom wall and vertically disposed relative to a plurality of cassette docking stations, and a cassette mover to carry a cassette between the shelves and the docking stations. An interstation transfer apparatus includes a support beam and a transfer arm adapted to carry a cassette between processing stations.
摘要翻译：盒式存储器包括多个相邻于洁净室壁定位并相对于多个盒式对接站垂直设置的盒式存放架，以及盒式移动器，用于在盒架和对接站之间承载盒。站间传送设备包括支撑梁和适于在处理站之间携带盒的传送臂。

55. 发明申请

US20070175588A1 HIGH THROUGHPUT PLASMA TREATMENT SYSTEM 审中-公开
标题翻译：高渗透等离子体处理系统
公开(公告)号：US20070175588A1
公开(公告)日：2007-08-02
申请号：US11679668
申请日：2007-02-27
申请人： Louis Rigali , David Hoffman , Keda Wang , William Smith
发明人： Louis Rigali , David Hoffman , Keda Wang , William Smith
IPC分类号： C23F1/00 , C23C16/00
CPC分类号： H01J37/32082 , H01L21/67069 , H01L21/67751 , H01L21/67772 , H01L21/67778 , H01L21/67781 , H01L2224/85013 , H01L2924/01078 , Y10S414/139
摘要： System and method for the plasma treatment of parts. The system and method involve energizing horizontal and vertical electrodes within a treatment chamber to generate a plasma used to treat the parts.
摘要翻译：零件等离子体处理的系统和方法。该系统和方法涉及对处理室内的水平和垂直电极进行激励以产生用于处理部件的等离子体。

56. 发明授权

US07247207B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US07247207B2
公开(公告)日：2007-07-24
申请号：US10812087
申请日：2004-03-30
申请人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
发明人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
IPC分类号： C23C16/00 , H01L21/00 , C23F1/00
CPC分类号： H01L21/6719 , H01L21/67017 , Y10S414/135 , Y10S414/139
摘要： A vacuum processing apparatus includes a vacuum processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas. The vacuum processing chamber has an axisymmetric structure, including a double wall structure, and a gate valve for sealing an opening through which the object enters the processing chamber.
摘要翻译：真空处理装置包括具有用于支撑待处理物体的处理台和使用气体进行处理的真空处理室。真空处理室具有轴对称结构，包括双壁结构，以及用于密封物体进入处理室的开口的闸阀。

57. 发明授权

US07246985B2 Work-piece processing system 有权
标题翻译：工件加工系统
公开(公告)号：US07246985B2
公开(公告)日：2007-07-24
申请号：US10826419
申请日：2004-04-16
申请人： Joseph Ferrara
发明人： Joseph Ferrara
IPC分类号： H01L21/677
CPC分类号： H01L21/67213 , H01L21/67201 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67778 , Y10S414/139
摘要： A transfer system for use with a tool for processing a work-piece at low or vacuum pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for processing of work-pieces placed at a work-piece processing station within the low pressure region. A two tier multiple work-piece isolation load lock transfers work-pieces from a higher pressure region to the lower pressure for processing and back to said higher pressure subsequent to said processing. A first robot transfers work-pieces within the low pressure region from the load locks to a processing station within the low pressure region. Multiple other robots positioned outside the low pressure region transfers work-pieces to and from the two tier work-piece isolation load locks from a source of said work-pieces prior to processing and to a destination of said work-pieces after said processing.
摘要翻译：一种用于在低或真空压力下处理工件的工具的转移系统，例如用于注入硅晶片的离子注入机。外壳限定用于处理放置在低压区域内的工件处理站的工件的低压区域。两层多件工件隔离负载锁将工件从较高压力区域转移到较低压力以进行处理，并在所述处理之后转回所述较高压力。第一机器人将低压区域内的工件从负载锁传送到低压区域内的处理站。位于低压区域之外的多个其它机器人在处理之前将工件与来自所述工件的来源的两层工件隔离负载锁转移到所述工件的所述处理之后的所述工件的目的地。

58. 发明授权

US07244086B2 Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates 有权
标题翻译：用于真空处理二维延伸基板的设备及其制造方法
公开(公告)号：US07244086B2
公开(公告)日：2007-07-17
申请号：US10713339
申请日：2003-11-14
申请人： Rainer Ostermann , Arthur Buechel , Mustapha Elyaakoubi
发明人： Rainer Ostermann , Arthur Buechel , Mustapha Elyaakoubi
IPC分类号： H01L21/677
CPC分类号： H01L21/67178 , C23C14/566 , C23C14/568 , C23C16/54 , F27B5/04 , F27B5/12 , F27B17/0025 , F27D3/0084 , F27D3/06 , F27D2003/0065 , H01L21/67017 , H01L21/67201 , H01L21/67236 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/67766 , H01L21/67772 , H01L21/67781 , Y10S414/139
摘要： A vacuum transport chamber has a transport robot arrangement. A processing arrangement has at least one processing station communicating by at least one workpiece pass-through opening with the vacuum transport chamber. A loadlock arrangement communicates by at least one workpiece pass-through opening with an atmosphere outside the vacuum transport chamber and the processing arrangement. One single loadlock and processing tower is formed by the processing arrangement and the loadlock arrangement being arranged vertically on upon the other.
摘要翻译：真空输送室具有运输机器人装置。处理装置具有至少一个与至少一个工件通过开口与真空输送室连通的处理站。负载锁定装置通过至少一个工件通过开口与真空输送室外部的气氛和处理装置连通。一个单一的装载和处理塔由处理装置形成，并且装载锁定装置垂直地布置在另一个上。

59. 发明申请

US20070140814A1 LARGE AREA SUBSTRATE TRANSFERRING METHOD 有权
标题翻译：大面积基板传输方法
公开(公告)号：US20070140814A1
公开(公告)日：2007-06-21
申请号：US11621039
申请日：2007-01-08
申请人： SHINICHI KURITA , WENDELL BLONIGAN , Y0SHIAKI TANASE
发明人： SHINICHI KURITA , WENDELL BLONIGAN , Y0SHIAKI TANASE
IPC分类号： H01L21/677
CPC分类号： H01L21/67201 , B65G49/064 , B65G49/067 , B65G49/068 , B65G2249/02 , H01L21/67236 , Y10S414/136 , Y10S414/137 , Y10S414/139
摘要： A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.
摘要翻译：提供了一种负载锁定室和用于传送大面积基板的方法。在一个实施例中，适于传送大面积衬底的负载锁定室包括多个垂直堆叠的单个衬底传送室。垂直堆叠的单个基板传送室的配置与现有技术的双槽双面基板设计相比，有助于减小尺寸和更大的通量。此外，在减少的泵送和排气速率下已经实现了增加的产量，这对应于由于颗粒和冷凝引起的底物污染的可能性降低。

60. 发明授权

US07226512B2 Load lock system for supercritical fluid cleaning 失效
标题翻译：超临界流体清洗装载锁系统
公开(公告)号：US07226512B2
公开(公告)日：2007-06-05
申请号：US10465906
申请日：2003-06-18
申请人： Michael A. Fury , Robert W. Sherrill
发明人： Michael A. Fury , Robert W. Sherrill
IPC分类号： B08B5/04
CPC分类号： H01L21/67167 , H01L21/67017 , H01L21/67201 , H01L21/67745 , Y10S134/902 , Y10S414/138 , Y10S414/139 , Y10S414/141
摘要： A substrate is transferred from an environment at about vacuum into a load lock through a first door. The substrate is then sealed within the load lock. The pressure within the load lock is raised to a high pressure above vacuum. A second door coupling the load lock to a high-pressure processing chamber is then opened and the substrate moved from the load lock into the high-pressure chamber. The substrate is then sealed within the high-pressure chamber. High-pressure processing, such as high pressure cleaning or high pressure deposition, is then performed on the substrate within the high-pressure chamber. Subsequently, the second door is opened and the substrate transferred into the load lock. The substrate is then sealed within the load lock. The pressure within the load lock is lowered to about vacuum and the first door opened. The substrate is then removed from the load lock into the environment.
摘要翻译：将基板从大约真空的环境转移到通过第一门的加载锁定中。然后将衬底密封在装载锁中。负载锁中的压力升高到高于真空的高压。然后打开将负载锁耦合到高压处理室的第二扇门，并且衬底从负载锁移动到高压室中。然后将衬底密封在高压室内。然后在高压室内的基板上进行高压处理，例如高压清洗或高压沉积。随后，打开第二扇门并将基板转移到装载锁中。然后将衬底密封在装载锁中。负载锁中的压力降低到大约真空，第一门打开。然后将衬底从负载锁移除到环境中。

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