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    • 54. 发明申请
    • Design of BEOL Patterns to Reduce the Stresses on Structures Below Chip Bondpads
    • 设计BEOL模式以减少芯片贴片下方结构的应力
    • US20080233681A1
    • 2008-09-25
    • US12133442
    • 2008-06-05
    • Elie AwadMariette A. AwadKai D. Feng
    • Elie AwadMariette A. AwadKai D. Feng
    • H01L21/00
    • H01L24/02H01L23/562H01L2924/01013H01L2924/01014H01L2924/01019H01L2924/01029H01L2924/01033H01L2924/014H01L2924/14H01L2924/3025
    • A semiconductor structure comprising a substrate including a first layer comprising a first material having a first modulus of elasticity; a first structure comprising a conductor and formed within the substrate, the first structure having an upper surface; and a stress diverting structure proximate the first structure and within the first layer, the stress diverting structure providing a low mechanical stress region at the upper surface of the first structure when a physical load is applied to the first structure, wherein said low mechanical stress region comprises stress values below the stress values in areas not protected by the stress diverting structure. The stress diverting structure comprises a second material having a second modulus of elasticity less than the first modulus of elasticity, the second material selectively formed over the upper surface of the first structure for diverting mechanical stress created by the physical load applied to the first structure.
    • 一种半导体结构,包括:基板,包括第一层,所述第一层包括具有第一弹性模量的第一材料; 包括导体并形成在所述基板内的第一结构,所述第一结构具有上表面; 以及靠近所述第一结构并且在所述第一层内的应力转向结构,所述应力转向结构在向所述第一结构施加物理载荷时在所述第一结构的上表面处提供低机械应力区域,其中所述低机械应力区域 包括低于应力转移结构保护区域的应力值。 应力转向结构包括具有小于第一弹性模量的第二弹性模量的第二材料,第二材料选择性地形成在第一结构的上表面上,用于转移由施加到第一结构的物理负载产生的机械应力。