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    • 52. 发明授权
    • Variable layout design for multiple voltage applications
    • 多电压应用的可变布局设计
    • US06903389B1
    • 2005-06-07
    • US10868606
    • 2004-06-15
    • Chun-Hui TaiLi-Chun Tien
    • Chun-Hui TaiLi-Chun Tien
    • H01L27/02H01L27/10H01L27/118
    • H01L27/11807H01L27/0207
    • An integrated circuit it comprises a logic cell. The logic cell is without nwell contacts and comprises top and bottom voltage supply wires. The integrated circuit also comprises a first filler cell comprising top and d bottom voltage supply wires and an nwell region coupled to the bottom voltage supply wire. The integrated circuit further comprises a second filler cell with an nwell region coupled to a top voltage supply wire. The integrated circuit still further comprises a third filler cell comprising top and bottom voltage supply wires. The third filler cell also comprising a pair of nwell regions. One of nwell regions is coupled to the top voltage supply wire and the other nwell region is coupled to the bottom voltage supply wire. The standard cell and the filler cells each comprise a PRboundary overlapping a top portion of the nwell region in each cell by a first distance.
    • 其集成电路包括逻辑单元。 逻辑单元没有nwell触点,并且包括顶部和底部电压电源线。 集成电路还包括第一填充单元,其包括顶部和底部电压电源线以及耦合到底部电压电源线的nwell区域。 集成电路还包括具有耦合到顶部电压电源线的nwell区域的第二填充单元。 集成电路还包括包括顶部和底部电压电源线的第三填充单元。 第三填充单元还包括一对nwell区域。 n个区域中的一个耦合到顶部电压电源线,另一个nwell区域耦合到底部电压电源线。 标准单元和填充单元每个都包括与每个单元格中的nwell区域的顶部重叠第一距离的PR边界。
    • 54. 发明授权
    • Efficient semiconductor device cell layout utilizing underlying local connective features
    • 利用潜在的本地连接特征的高效半导体器件单元布局
    • US08816403B2
    • 2014-08-26
    • US13238294
    • 2011-09-21
    • Jung-Hsuan ChenMay ChangChiting ChengLi-Chun Tien
    • Jung-Hsuan ChenMay ChangChiting ChengLi-Chun Tien
    • H01L27/118H01L23/522
    • H01L27/0207H01L2027/11859
    • Provided are semiconductor device cells, methods for forming the semiconductor device cells and a layout style for the semiconductor device cells. The device cells may be repetitive cells used throughout an integrated circuit. The layout style utilizes an area at the polysilicon level that is void of polysilicon and which can accommodate conductive leads therein or thereover. The conductive leads are formed of material typically used for contacts or vias and are disposed beneath the first metal interconnect level which couples device cells to one another. The subjacent local conductive leads may form subjacent signal lines allowing for additional power mesh lines to be included within the limited number of metal tracks that can be accommodated within a device cell and in accordance with metal track design spacing rules.
    • 提供半导体器件单元,用于形成半导体器件单元的方法和用于半导体器件单元的布局样式。 器件单元可以是整个集成电路中使用的重复单元。 布局样式利用多晶硅级别的无多晶硅的区域,并且可以容纳其中或其中的导电引线。 导电引线由通常用于触点或通孔的材料形成,并且设置在将器件单元彼此耦合的第一金属互连级之下。 下面的局部导电引线可以形成下面的信号线,允许额外的功率网线包括在可以容纳在器件单元内并根据金属轨道设计间隔规则的有限数量的金属轨道内。