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    • 51. 发明授权
    • Methods and systems for flash memory tunnel oxide reliability testing
    • 闪存隧道氧化物可靠性测试方法与系统
    • US06606273B1
    • 2003-08-12
    • US10121140
    • 2002-04-11
    • Xin GuoNian YangZhigang Wang
    • Xin GuoNian YangZhigang Wang
    • G11C700
    • G11C29/50004G11C16/04G11C29/006G11C29/50
    • Methods are disclosed for determining tunnel oxide reliability of flash memory devices in a wafer prior to sorting and packaging without damaging or stressing the devices. The methods comprise measuring an initial threshold voltage of a test cell having the same tunnel oxide as other flash cells on the wafer, applying an erase stress to the test cell for a first time period and a program stress to the test cell for a second time period, and measuring the final threshold voltage of the test cell. The difference between the initial and final threshold voltages is then used to determine or estimate the tunnel oxide reliability of the flash memory cells on the wafer.
    • 公开了用于在分选和包装之前确定晶片中闪存器件的隧道氧化物可靠性的方法,而不会损坏或强调器件。 该方法包括测量具有与晶片上的其它闪存单元相同的隧道氧化物的测试单元的初始阈值电压,将第一时间段的擦除应力施加到测试单元上,并且向测试单元施加程序应力第二次 周期,并测量测试单元的最终阈值电压。 然后使用初始阈值电压和最终阈值电压之间的差异来确定或估计晶片上闪存单元的隧道氧化物可靠性。
    • 52. 发明授权
    • Method to provide a higher reference voltage at a lower power supply in flash memory devices
    • 在闪存器件中的较低电源处提供较高参考电压的方法
    • US07724075B2
    • 2010-05-25
    • US11634776
    • 2006-12-06
    • Tien-Chun YangYonggang WuNian Yang
    • Tien-Chun YangYonggang WuNian Yang
    • G05F1/575
    • G11C5/147G05F3/08G11C16/30
    • A fast reference circuit having active feedback includes a bias supply circuit and a variable divider circuit connected by an active feedback path to the bias supply circuit, and a comparator circuit connected to the variable divider circuit, the bias supply circuit, and a reference node of the variable divider circuit. In one embodiment, a start-up circuit initially discharges a potential at the bias supply and comparator circuits, then initializes a reference voltage at the reference node at about zero volts to improve repeatability. In one embodiment, the variable voltage divider comprises an impendence that is trimmed based on a sheet resistance of a process used to fabricate the fast reference circuit, and further comprises a variable reference current circuit coupled to the impedance and configured to generate a current having a value based on a desired reference voltage and to conduct the current through the impedance, thereby generating the reference voltage associated therewith. The comparator circuit is configured to compare the bias supply voltage to the reference voltage, and drive the bias supply and the variable divider circuit in response to the comparison, thereby quickly stabilizing the reference voltage.
    • 具有有源反馈的快速参考电路包括偏置电源电路和通过有源反馈路径连接到偏置电源电路的可变分频器电路,以及连接到可变分频器电路,偏置电源电路和参考节点的参考节点 可变分频电路。 在一个实施例中,启动电路首先在偏置电源和比较器电路处放电,然后在约零伏特的参考节点初始化参考电压,以提高可重复性。 在一个实施例中,可变分压器包括基于用于制造快速参考电路的工艺的薄层电阻而修整的阻抗,并且还包括耦合到阻抗的可变参考电流电路,并且被配置为产生具有 基于所需参考电压的值,并且将电流传导通过阻抗,由此产生与其相关联的参考电压。 比较器电路被配置为将偏置电源电压与参考电压进行比较,并且响应于比较来驱动偏置电源和可变分频器电路,由此快速稳定参考电压。
    • 55. 发明授权
    • Efficient and accurate sensing circuit and technique for low voltage flash memory devices
    • 高效,准确的低压闪存器件感测电路和技术
    • US06898124B1
    • 2005-05-24
    • US10678446
    • 2003-10-03
    • Zhigang WangNian YangYue-Song He
    • Zhigang WangNian YangYue-Song He
    • G11C11/56G11C16/06G11C16/26
    • G11C16/26G11C11/5642
    • An exemplary sensing circuit comprises a first transistor connected to a first node, where a target memory cell has a drain capable of being connected to the first node through a selection circuit during a read operation involving the target memory cell. The sensing circuit further comprises a decouple circuit which is connected to the first transistor. The decouple circuit includes a second transistor having a gate coupled to a gate of the first transistor. The decouple circuit further has a decouple coefficient (N) greater than 1. The drain of the second transistor is connected at a second node to a reference voltage through a bias resistor. With the arrangement, the drain of the second transistor generates a sense amp input voltage at the second node such that the sense amp input voltage is decoupled from the first node.
    • 示例性感测电路包括连接到第一节点的第一晶体管,其中目标存储器单元具有能够在涉及目标存储器单元的读取操作期间通过选择电路连接到第一节点的漏极。 感测电路还包括连接到第一晶体管的去耦电路。 解耦电路包括具有耦合到第一晶体管的栅极的栅极的第二晶体管。 去耦电路还具有大于1的去耦系数(N)。第二晶体管的漏极通过偏置电阻器在第二节点连接到参考电压。 利用该布置,第二晶体管的漏极在第二节点处产生感测放大器输入电压,使得感测放大器输入电压与第一节点分离。
    • 57. 发明授权
    • Floating gate memory device with homogeneous oxynitride tunneling dielectric
    • 具有均匀氧氮化物隧道电介质的浮栅存储器件
    • US06828623B1
    • 2004-12-07
    • US10232487
    • 2002-08-30
    • Xin GuoNian YangZhigang Wang
    • Xin GuoNian YangZhigang Wang
    • H01L29788
    • H01L29/518H01L21/28273H01L29/7885
    • A memory device with homogeneous oxynitride tunneling dielectric. Specifically, the present invention describes a flash memory cell that includes a tunnel oxide dielectric layer including homogeneous oxynitride. The tunnel oxide dielectric layer separates a floating gate from a channel region that is formed between a source region and a drain region in a substrate. The flash memory cell further includes a dielectric layer that separates a control gate from the floating gate. In one case, the homogenous oxynitride is a defect free silicon nitride. The homogeneity of the oxynitride is due to the uniform distribution of nitride within the tunnel oxide dielectric layer. Further, the use of the homogeneous oxynitride can increase the dielectric constant and lower the barrier height of the tunnel oxide dielectric layer for increased performance. Also, the homogenous oxynitride supports source-side channel hot hole erasing in the flash memory cell.
    • 具有均匀氧氮化物隧道电介质的存储器件。 具体地,本发明描述了一种闪存单元,其包括包括均匀氮氧化物的隧道氧化物介电层。 隧道氧化物电介质层将浮置栅极与形成在衬底中的源极区域和漏极区域之间的沟道区域分离。 闪存单元还包括将控制栅极与浮动栅极分离的介质层。 在一种情况下,均匀的氮氧化合物是无缺陷的氮化硅。 氧氮化物的均匀性是由于氮化物在隧​​道氧化物介电层内的均匀分布。 此外,为了提高性能,使用均匀的氮氧化物可以增加介电常数并降低隧道氧化物介电层的势垒高度。 此外,均匀的氮氧化物支持闪存单元中的源极侧通道热孔擦除。
    • 58. 发明授权
    • Method of detecting and distinguishing stack gate edge defects at the source or drain junction
    • 在源极或漏极结处检测和区分堆叠栅极边缘缺陷的方法
    • US06822259B1
    • 2004-11-23
    • US10126193
    • 2002-04-19
    • Zhigang WangNian YangXin Guo
    • Zhigang WangNian YangXin Guo
    • H01L2358
    • H01L21/28273G11C16/04G11C29/006G11C2029/0403G11C2029/5002
    • A method and apparatus for testing semiconductors comprising stacked floating gate structures. A floating gate is programmed (710). An electrical stress or disturb voltage is applied to a control gate with a source and a drain in a specific set of conditions (720). Subsequent to the stressing, a drain current versus gate voltage relationship is measured (730). The sequence of programming, stressing and measuring may be repeated (740) with different conditions for source and drain. More particularly, positive and negative biases are applied to a source while a drain is held at ground, and similar biases are applied to a drain while a source is held at ground. Through inspection of the measurement information taken after this sequence of stress applications, a stack gate edge-defect may be identified (750) as associated with a source edge or a drain edge. In this novel manner, stack gate edge defects may be identified and localized via non-destructive means, and corrective actions to the semiconductor manufacturing process and/or the partially manufactured wafer may be taken.
    • 一种用于测试包括堆叠浮栅结构的半导体的方法和装置。 浮动门被编程(710)。 电应力或干扰电压在特定条件(720)中用源极和漏极施加到控制栅极。 在应力之后,测量漏极电流与栅极电压的关系(730)。 编程,应力和测量的顺序可以重复(740),具有不同的源和漏源条件。 更具体地,在将源极保持在地面的同时将漏极保持在接地处时,将正和负偏压施加到源极,并且在将源保持在地面的同时将类似的偏压施加到漏极。 通过检查在该应力应用序列之后采取的测量信息,可以将源极边缘或漏极边缘的叠栅极边缘缺陷识别(750)。 以这种新颖的方式,可以通过非破坏性手段识别和定位堆叠栅极边缘缺陷,并且可以采取对半导体制造工艺和/或部分制造的晶片的校正动作。
    • 60. 发明授权
    • Semiconductor isolation material deposition system and method
    • 半导体隔离材料沉积系统及方法
    • US06734080B1
    • 2004-05-11
    • US10159078
    • 2002-05-31
    • Nian YangJohn Jianshi WangTien-Chun Yang
    • Nian YangJohn Jianshi WangTien-Chun Yang
    • H01L2176
    • H01L21/76229
    • A semiconductor isolation material deposition system and method that facilitates convenient and efficient integrated multi-step deposition of isolation regions is presented. In one embodiment of the present invention, an integrated circuit includes densely configured component areas and sparsely configured component areas. An active area in a wafer is created and a shallow trench space is formed. A thin layer of TEOS isolation material layer is deposited on top of the active area and the shallow trench. For example, the layer of thin layer of TEOS isolation material is in a range of 4000 to 5000 angstroms thick over the top of underlying active areas. A reverse mask and pre-planarization etch is performed on the thin layer of TEOS isolation material. The remaining TEOS edge spikes between the densely configured component area and the sparsely configured component area are minimal (e.g., about 500 angstroms. The remaining excess oxidant and silicon nitride are removed utilizing chemical mechanical polishing processes. In one exemplary implementation, the present invention facilitates an integrated approach to STI fabrication processes that achieve successful high yielding results by considering the impacts of one process step on another.
    • 介绍了半导体隔离材料沉积系统及其方法,便于实现隔离区域的多步沉积。 在本发明的一个实施例中,集成电路包括密集配置的组件区域和稀疏配置的组件区域。 产生晶片中的有效区域并形成浅沟槽空间。 TEOS隔离材料层的薄层沉积在有源区域和浅沟槽的顶部。 例如,薄层的TEOS隔离材料层的厚度在下面有效区域顶部的4000至5000埃的范围内。 在TEOS隔离材料的薄层上进行反掩模和预平面化蚀刻。 在密集配置的部件区域和稀疏构造的部件区域之间的剩余的TEOS边缘尖峰是最小的(例如,约500埃),使用化学机械抛光工艺去除剩余的多余的氧化剂和氮化硅。在一个示例性实施方式中, 通过考虑一个工艺步骤对另一个工艺步骤的影响,可以获得成功的高产量结果的STI制造工艺的综合方法。