专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US08496991B2 Coating treatment method 有权
标题翻译：涂层处理方法
公开(公告)号：US08496991B2
公开(公告)日：2013-07-30
申请号：US13236750
申请日：2011-09-20
申请人： Kousuke Yoshihara , Tomohiro Iseki
发明人： Kousuke Yoshihara , Tomohiro Iseki
IPC分类号： B05D3/12
CPC分类号： H01L21/6715 , G03F7/162
摘要： The present invention supplies a solvent to a front surface of a substrate while rotating the substrate. The substrate is acceleratingly rotated to a first number of rotations, and a resist solution is supplied to a central portion of the substrate during the accelerating rotation and the rotation at a first number of rotations. The substrate is deceleratingly rotated to a second number of rotations, and after the number of rotations of the substrate reaches the second number of rotations, the resist solution is discharged to the substrate. The substrate is then acceleratingly rotated to a third number of rotations higher than the second number of rotations so that the substrate is rotated at the third number of rotations. According to the present invention, consumption of the resist solution can be suppressed and a high in-plane uniformity can be obtained for the film thickness of the resist film.
摘要翻译：本发明在旋转基板的同时将溶剂供给到基板的前表面。基板被加速旋转到第一转数，并且在加速旋转期间以及以第一转数旋转时，将抗蚀剂溶液供应到基板的中心部分。基板减速旋转到第二转数，并且在基板的转数达到第二转数之后，将抗蚀剂溶液排出到基板。然后将衬底加速旋转到高于第二转数的第三转数，使得衬底以第三转数旋转。根据本发明，可以抑制抗蚀剂溶液的消耗，并且可以获得抗蚀剂膜的膜厚度的高的面内均匀性。

52. 发明授权

US08480319B2 Coating and developing apparatus, coating and developing method and non-transitory tangible medium 有权
标题翻译：涂层和显影装置，涂层和显影方法以及非瞬态有形介质
公开(公告)号：US08480319B2
公开(公告)日：2013-07-09
申请号：US13221072
申请日：2011-08-30
申请人： Shinichi Hayashi , Yuichi Douki , Akira Miyata , Yuuichi Yamamoto , Kousuke Yoshihara , Nobuaki Matsuoka , Suguru Enokida
发明人： Shinichi Hayashi , Yuichi Douki , Akira Miyata , Yuuichi Yamamoto , Kousuke Yoshihara , Nobuaki Matsuoka , Suguru Enokida
IPC分类号： G03D5/00
CPC分类号： H01L21/6715 , G03F7/162 , G03F7/3021 , H01L21/67178 , H01L21/6719 , H01L21/67745
摘要： A process block is formed by arranging a heating-process related block on the side of a carrier block, a group of liquid-process related unit blocks, and a heating block on the side of an interface block, in this order from the side of the carrier block to the side of the interface block. The group of liquid-process related unit blocks is composed of: a group of unit blocks for coating films that is formed by stacking upward a unit block for an antireflection film, a unit block for a resist film, and a unit block for an upper layer film, in this order; and unit blocks for developing that are stacked on one another in the up and down direction with respect to the group of unit blocks for coating films. Liquid process modules of each of the liquid-process related unit blocks are arranged on the right and left sides of a transfer path for a substrate.
摘要翻译：通过在接口块的侧面上的载体块，一组液体处理相关单元块和加热块的侧面上布置加热处理相关块来形成处理块，从侧面载波块到接口块的一侧。一组液相处理相关单元块由以下组成：一组用于涂覆膜的单元块，其通过向上堆叠用于抗反射膜的单元块，用于抗蚀剂膜的单元块和用于上部的单元块层膜，按顺序; 以及用于显影的单元块相对于用于涂膜的单元块组在上下方向上彼此堆叠。每个液体处理相关单元块的液体处理模块布置在用于基板的传送路径的右侧和左侧。

53. 发明申请

US20120021611A1 COATING TREATMENT METHOD, NON-TRANSITORY COMPUTER STORAGE MEDIUM AND COATING TREATMENT APPARATUS 有权
标题翻译：涂层处理方法，非终端计算机存储介质和涂层处理设备
公开(公告)号：US20120021611A1
公开(公告)日：2012-01-26
申请号：US13181565
申请日：2011-07-13
申请人： Kousuke Yoshihara , Shinichi Hatakeyama
发明人： Kousuke Yoshihara , Shinichi Hatakeyama
IPC分类号： H01L21/31 , B05C11/08
CPC分类号： H01L21/6715
摘要： A coating treatment method includes: a first step of rotating a substrate at a first rotation number; a second step of rotating the substrate at a second rotation number being slower than the first rotation number; a third step of rotating the substrate at a third rotation number being faster than the second rotation number and slower than the first rotation number; a fourth step of rotating the substrate at a fourth rotation number being slower than the third rotation number; and a fifth step of rotating the substrate at a fifth rotation number being faster than the fourth rotation number. A supply of a coating solution to a central portion of the substrate is continuously performed from the first step to a middle of the second step or during the first step, and the fourth rotation number is more than 0 rpm and 500 rpm or less.
摘要翻译：一种涂布处理方法，包括：以第一转数旋转基板的第一工序; 第二步骤，以比第一转数慢的第二转数旋转衬底; 第三步骤，以比所述第二转数快并且慢于所述第一转数的第三转数旋转所述衬底; 第四步骤，以比第三转数慢的第四转数旋转衬底; 以及以比第四转数快的第五转数旋转衬底的第五步骤。从第一步骤到第二步骤的中间或第一步骤期间，连续地向基材的中心部分供给涂布液，第四转数大于0rpm，500rpm以下。

54. 发明授权

US07820243B2 Resist coating method and resist coating apparatus 有权
标题翻译：抗蚀涂层方法和抗蚀涂层设备
公开(公告)号：US07820243B2
公开(公告)日：2010-10-26
申请号：US11549793
申请日：2006-10-16
申请人： Kousuke Yoshihara , Tomohiro Iseki
发明人： Kousuke Yoshihara , Tomohiro Iseki
IPC分类号： B05D3/12
CPC分类号： H01L21/6715 , G03F7/162
摘要： A resist coating method supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then decelerates the rotation of the substrate to a second rotational speed lower than the first rotational speed, or until rotational halt, makes the deceleration smaller in the deceleration step as the rotational speed becomes closer to the second rotational speed or the rotational halt, and accelerates the rotation of the substrate to a third rotational speed higher than the second rotational speed to spin off a residue of the resist solution.
摘要翻译：抗蚀剂涂布方法在以第一旋转速度旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后将基板的旋转减速到低于第一转速的第二转速，或直到旋转停止，随着转速变得更接近于第二转速或转动停止，减速步骤中的减速度变小，并且将基板的旋转加速到高于第二转速的第三转速，以使其脱离抗蚀剂溶液的残留物。

55. 发明申请

US20090272407A1 SUBSTRATE CLEANING METHOD AND DEVELOPING APPARATUS 有权
标题翻译：基板清洗方法和开发设备
公开(公告)号：US20090272407A1
公开(公告)日：2009-11-05
申请号：US12503412
申请日：2009-07-15
申请人： Junji NAKAMURA , Kousuke Yoshihara , Kentaro Yamamura , Fumiko Iwao , Hirofumi Takeguchi
发明人： Junji NAKAMURA , Kousuke Yoshihara , Kentaro Yamamura , Fumiko Iwao , Hirofumi Takeguchi
IPC分类号： B08B3/04 , B08B1/00
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/10 , G03F7/3021 , Y10S134/902
摘要： A cleaning method of cleaning a surface of a substrate that is processed by a developing process. The method includes pouring a cleaning liquid onto a central part of the substrate. A dry area that is not wetted with the cleaning liquid is created in a central part of the substrate by stopping pouring the cleaning liquid or by shifting a cleaning liquid pouring position to which the cleaning liquid is poured from the central part while the substrate holding device is rotating. The dry area is expanded outward from the central part of the substrate by rotating the substrate holding device at a rotating speed not lower than 1500 rpm without pouring the cleaning liquid onto the dry area. The cleaning liquid is poured onto an outer area contiguously surrounding the dry area on the surface of the substrate.
摘要翻译：清洗通过显影处理处理的基材表面的清洁方法。该方法包括将清洗液倒入基材的中心部分。在基板保持装置的中心部分，通过停止注入清洗液体，或者从中央部移动清洗液注入清洗液的位置，形成未被清洗液润湿的干燥区域正在旋转。通过以不低于1500rpm的旋转速度旋转基板保持装置，将干燥区域从基板的中心部分向外扩展，而不将清洗液体倾倒到干燥区域上。将清洗液倒入围绕基材表面的干燥区域的外部区域上。

56. 发明申请

US20070071890A1 Apparatus and method of forming an applied film 有权
标题翻译：形成涂膜的装置和方法
公开(公告)号：US20070071890A1
公开(公告)日：2007-03-29
申请号：US11501740
申请日：2006-08-10
申请人： Kousuke Yoshihara , Hiroichi Inada
发明人： Kousuke Yoshihara , Hiroichi Inada
IPC分类号： B05D3/12 , B05C11/02 , B05B15/04 , B05C11/00
CPC分类号： H01L21/67051 , G03F7/162 , H01L21/6715
摘要： There is provided an apparatus including: a processing cup having an opening opened upward to allow a substrate to be loaded and unloaded, an exhaust port for exhausting an unnecessary atmosphere produced in forming a film applied on the substrate, and an aspiration port for aspirating external air; and an aspiration device aspirating the unnecessary atmosphere through the exhaust port, wherein when the substrate is accommodated in the opening of the processing cup, the substrate has a perimeter spaced from the opening by a predetermined gap, and below the substrate accommodated in the processing cup there is formed an exhaust flow path extending from the aspiration port to the exhaust port.
摘要翻译：提供了一种装置，包括：处理杯，其具有向上开口以允许衬底被装载和卸载的开口;排出端口，用于排出在形成施加在衬底上的膜时产生的不必要的气氛;以及抽吸端口，用于吸入外部空气; 以及抽吸装置，其通过所述排气口吸入不需要的气氛，其中当所述基板容纳在所述加工杯的开口中时，所述基板具有与所述开口间隔开预定间隙的周边，并且在容纳在所述加工杯中的所述基板的下方形成从抽吸口向排气口延伸的排气流路。

57. 发明授权

US06869640B2 Coating film forming method and coating film forming apparatus 失效
公开(公告)号：US06869640B2
公开(公告)日：2005-03-22
申请号：US10162606
申请日：2002-06-06
申请人： Kousuke Yoshihara , Yuichi Terashita
发明人： Kousuke Yoshihara , Yuichi Terashita
IPC分类号： H01L21/203 , B05D1/00 , B05D3/10 , G03F7/16 , H01L21/00 , B05D1/36 , B05D3/12
CPC分类号： H01L21/6715 , B05D1/005 , B05D3/104 , G03F7/162
摘要： A coating film is formed by the steps of supplying a mixture of a solvent for dissolving a coating liquid and a volatilization suppressing substance for suppressing the volatilization of the solvent onto the surface of the target substrate W, expanding the mixture onto the entire surface of the target substrate W, and supplying a coating liquid onto substantially the central portion of the target substrate W that has received the mixture while rotating the target substrate W thereby expanding the coating liquid outward in the radial direction of the target substrate W thereby forming a coating film.

58. 发明授权

US08691336B2 Coating treatment method, non-transitory computer storage medium and coating treatment apparatus 有权
标题翻译：涂层处理方法，非暂时性计算机存储介质和涂层处理装置
公开(公告)号：US08691336B2
公开(公告)日：2014-04-08
申请号：US13069522
申请日：2011-03-23
申请人： Kousuke Yoshihara , Katsunori Ichino
发明人： Kousuke Yoshihara , Katsunori Ichino
IPC分类号： B05D3/12 , G06F19/00
CPC分类号： H01L21/6715 , G03F7/162
摘要： A coating treatment method includes: a first step of discharging a coating solution from a nozzle to a central portion of a substrate while acceleratingly rotating the substrate, to apply the coating solution over the substrate; a second step of then decelerating the rotation of the substrate and continuously rotating the substrate; and a third step of then accelerating the rotation of the substrate to dry the coating solution on the substrate. In the first step, the acceleration of the rotation of the substrate is changed in the order of a first acceleration, a second acceleration higher than the first acceleration, and a third acceleration lower than the second acceleration to acceleratingly rotate the substrate at all times.
摘要翻译：一种涂布处理方法，其特征在于，包括：在将基板加速旋转的同时将涂布液从喷嘴排出到基板的中央部的第一工序，将涂布液涂布在基板上; 第二步骤，然后使基板的旋转减速并连续旋转基板; 以及第三步骤，然后加速基底的旋转以将涂层溶液干燥在基底上。在第一步骤中，基板的旋转的加速度以第一加速度，比第一加速度高的第二加速度和比第二加速度低的第三加速度的顺序改变，以一直加速旋转基板。

59. 发明授权

US08506186B2 Coating and developing apparatus, coating and developing method and non-transitory tangible medium 有权
标题翻译：涂层和显影装置，涂层和显影方法以及非瞬态有形介质
公开(公告)号：US08506186B2
公开(公告)日：2013-08-13
申请号：US13225985
申请日：2011-09-06
申请人： Shinichi Hayashi , Yuichi Douki , Akira Miyata , Yuuichi Yamamoto , Kousuke Yoshihara , Nobuaki Matsuoka , Suguru Enokida
发明人： Shinichi Hayashi , Yuichi Douki , Akira Miyata , Yuuichi Yamamoto , Kousuke Yoshihara , Nobuaki Matsuoka , Suguru Enokida
IPC分类号： G03D5/00
CPC分类号： G03F7/3021 , G03F7/162 , H01L21/67178 , H01L21/67742 , H01L21/67745
摘要： A process block including a group of liquid-process related unit blocks, a first heating-process related block arranged on a carrier block side of the group of unit blocks, and a second heating-process related block arranged on an interface block side of the group of unit blocks. The group of liquid-process unit blocks includes doubled unit blocks for preprocessing for forming an antireflection film and a resist film, doubled unit blocks for post-processing for forming an upper layer film and performing a cleaning operation before exposure, and a unit block for developing. The first heating-process related block heats a substrate coated with a resist liquid and a substrate that has been developed. The second heating-process related block heats a substrate that has been exposed but is not yet developed, a substrate on which an antireflection film has been formed and a substrate on which an upper layer film has been formed.
摘要翻译：一种处理块，包括一组液体处理相关单元块，布置在该组单位块的载体块侧的第一加热处理相关块，以及布置在该单元块的界面块侧的第二加热处理相关块单位块组。液体处理单元块组包括用于形成防反射膜和抗蚀剂膜的预处理的双重单元块，用于形成上层膜的后处理和进行曝光之前的清洁操作的双倍单位块，以及用于发展。第一加热工艺相关块加热涂覆有抗蚀剂液体和已经显影的基底的基底。第二加热处理相关块加热已经暴露但尚未显影的基板，已经形成有抗反射膜的基板和已经形成有上层膜的基板。

60. 发明授权

US08225738B2 Resist coating method and resist coating apparatus 有权
标题翻译：抗蚀涂层方法和抗蚀涂层设备
公开(公告)号：US08225738B2
公开(公告)日：2012-07-24
申请号：US13038011
申请日：2011-03-01
申请人： Kousuke Yoshihara , Tomohiro Iseki
发明人： Kousuke Yoshihara , Tomohiro Iseki
IPC分类号： B05C11/02 , G06F19/00
CPC分类号： H01L21/6715 , G03F7/162
摘要： A resist coating method supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then reduces a rotational speed of the target substrate to a second rotational speed lower than the first rotational speed, reduces the rotational speed of the target substrate to a third rotational speed lower than the second rotational speed or until rotational halt to adjust the film thickness of the resist solution, and accelerates the rotation of the target substrate to a fourth rotational speed higher than the third rotational speed to spin off a residue of the resist solution.
摘要翻译：抗蚀剂涂布方法在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后将目标基板的转速降低到低于第一转速的第二转速将目标基板的旋转速度降低到低于第二旋转速度的第三旋转速度，或者直到旋转停止，以调整抗蚀剂溶液的膜厚度，并且将目标基板的旋转加速至高于第三旋转速度以分离抗蚀剂溶液的残留物。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式