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    • 57. 发明授权
    • Diamond coated parts in a plasma reactor
    • 在等离子体反应器中的金刚石涂层部件
    • US06508911B1
    • 2003-01-21
    • US09375243
    • 1999-08-16
    • Nianci HanHong ShihJennifer Y. SunLi Xu
    • Nianci HanHong ShihJennifer Y. SunLi Xu
    • H05H100
    • H01J37/32467C23C16/27H01J37/32477
    • A diamond coating formed on a bulk member used in a plasma processing chamber for processing a substrate such as a semiconductor wafer. The coating is particularly useful in a plasma etching chamber using a chlorine-based chemistry to etch metal. One class of such parts includes a dielectric chamber wall, in particular, a chamber wall through which RF or microwave energy is coupled into the chamber to support the plasma. For example, an RF inductive coil is positioned outside the chamber wall and inductively couples energy into the chamber. Exemplary substrates for the diamond coating include alumina, silicon nitride, silicon carbide, polysilicon, and a SiC/Si composite. Amorphous carbon may be substituted for diamond.
    • 在用于处理诸如半导体晶片的基板的等离子体处理室中的主体部件上形成的金刚石涂层。 该涂层在使用氯基化学蚀刻金属的等离子体蚀刻室中特别有用。 一类这样的部件包括电介质室壁,特别是室壁,RF或微波能量通过室壁耦合到室中以支撑等离子体。 例如,RF感应线圈定位在室壁外部并且将能量感应地耦合到腔室中。 用于金刚石涂层的示例性基底包括氧化铝,氮化硅,碳化硅,多晶硅和SiC / Si复合材料。 无定形碳可以代替金刚石。
    • 59. 发明授权
    • Method of cleaning a semiconductor device processing chamber after a copper etch process
    • 在铜蚀刻工艺之后清洁半导体器件处理室的方法
    • US06352081B1
    • 2002-03-05
    • US09350802
    • 1999-07-09
    • Danny Chien LuAllen ZhaoPeter HsiehHong ShihLi XuYan Ye
    • Danny Chien LuAllen ZhaoPeter HsiehHong ShihLi XuYan Ye
    • B08B900
    • H01L21/67028Y10S438/905
    • The present invention is a method for removing deposited etch byproducts from surfaces of a semiconductor processing chamber after a copper etch process. The method of the invention comprises the following general steps: (a) an oxidation step, in which interior surfaces of the processing chamber are contacted with an oxidizing plasma; (b) a first non-plasma cleaning step, in which interior surfaces of the processing chamber are contacted with an H+hfac-comprising gas; and (c) a second cleaning step, in which interior surfaces of the processing chamber are contacted with a plasma containing reactive fluorine species, whereby at least a portion of the copper etch byproducts remaining after step (b) are volatilized into gaseous species, which are removed from the processing chamber. The method of the invention is preferably performed at a chamber wall temperature of at least 150° C. in order to achieve optimum cleaning of the chamber at the chamber operating pressures typically used during the cleaning process. The dry cleaning method of the invention can be performed between wafer processing runs without opening the processing chamber, thereby minimizing potential contamination to the chamber as well as chamber downtime.
    • 本发明是在铜蚀刻工艺之后从半导体处理室的表面去除沉积的蚀刻副产物的方法。 本发明的方法包括以下一般步骤:(a)氧化步骤,其中处理室的内表面与氧化等离子体接触; (b)第一非等离子体清洗步骤,其中处理室的内表面与含H + hfac的气体接触; 和(c)第二清洁步骤,其中处理室的内表面与含有反应性氟物质的等离子体接触,由此在步骤(b)之后残留的铜蚀刻副产物的至少一部分挥发成气态物质,其中 从处理室中取出。 本发明的方法优选在至少150℃的室壁温度下进行,以便在清洁过程中通常使用的室的操作压力下实现室的最佳清洁。 本发明的干式清洗方法可以在晶片处理运行之间进行,而不会打开处理室,从而最小化对室的潜在污染以及室停机时间。