会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Adjustable solid state illumination module having array of light pixels
    • 具有光像素阵列的可调固态照明模块
    • US09041316B2
    • 2015-05-26
    • US13806676
    • 2011-06-27
    • Bo PiLi Xu
    • Bo PiLi Xu
    • H05B37/00G05F1/00H05B33/08
    • H05B33/0845H05B33/0818H05B33/0854H05B33/086
    • Techniques for constructing a solid-state lighting module that includes solid-state light emitters that emit light of different colors and are selected from separated groups of solid-state light emitters that emit light of two or more separated colors, wherein one or more solid-state light emitters are selected from each of the separated color groups of solid-state light emitters. The lighting module includes a programmable device that stores or remembers desirable optical intensities of the separated color groups of solid-state light emitters, and a control circuit that individually controls light intensity of each of the separated color groups of solid-state light emitters. The light control circuit is coupled to or in communication with the programmable device to receive the desirable optical intensities of the separated groups of solid-state light emitters and is operable to adjust the intensities of the separated color groups of solid-state light emitters based on the desirable intensities.
    • 一种用于构造固态照明模块的技术,该固态照明模块包括发射不同颜色的光的固态发光体,其选自发射两种或更多种分离颜色的光的固态发光体的分离组,其中一个或多个固 - 从固态发光体的分离颜色组中的每一个中选择状态光发射器。 照明模块包括存储或记住固态发光体的分离色组的期望光强度的可编程装置,以及分别控制固态发光体分离的各色组的光强度的控制电路。 光控制电路耦合到可编程器件或与可编程器件通信,以接收分离的固态发光体组的期望的光强度,并且可操作以基于以下方式调整固态发光器的分离色组的强度 所需的强度。
    • 4. 发明申请
    • LED PACKAGE AND METHOD OF MAKING THE SAME
    • LED封装及其制造方法
    • US20130099275A1
    • 2013-04-25
    • US13806696
    • 2011-06-27
    • Bo PiLi Xu
    • Bo PiLi Xu
    • H01L33/64H01L33/62
    • H01L33/64H01L33/486H01L33/62H01L33/641H01L33/642H01L33/644H01L2224/48247H01L2933/0075
    • LED packages and their fabrication techniques are disclosed to provide LED package with improved thermal dissipation based on one or more thermally conductive channels or studs. In one implementation, a LED package includes a plastic body structured to have a hole that penetrates through the plastic body; a metal contact formed on the plastic body at one side of the hole to cover the hole; a LED mounted to the metal contact at a location that spatially overlaps with the hole; and a stud formed in the hole in contact with the metal contact at a first end of the stud and extending to an opening of the hole at a second end of the stud, the stud being formed of a thermally conductive material to transfer heat from the LED through the metal contact and the stud to dissipate the heat at the opening of the hole via the second end of the stud.
    • LED封装及其制造技术被公开以提供基于一个或多个导热通道或螺柱的改进的散热的LED封装。 在一个实施方案中,LED封装包括塑料体,其被构造成具有穿透塑料体的孔; 形成在所述孔的一侧的所述塑料体上以覆盖所述孔的金属接触; 在与孔空间重叠的位置处安装到金属接触件的LED; 以及螺柱,其形成在所述孔中,在所述螺柱的第一端处与所述金属接触件接触并在所述螺柱的第二端处延伸到所述孔的开口,所述螺柱由导热材料形成,以将热量 LED穿过金属触点和螺柱,以通过螺柱的第二端散开孔的开口处的热量。