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1. 发明申请

US20080017516A1 FORMING A CHAMBER COMPONENT HAVING A YTTRIUM-CONTAINING COATING 有权
标题翻译：形成含有YTTRIUM的涂料的室内组分
公开(公告)号：US20080017516A1
公开(公告)日：2008-01-24
申请号：US11766723
申请日：2007-06-21
申请人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Sun
发明人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Sun
IPC分类号： C25D5/16
CPC分类号： C25D3/54 , C23C16/4404 , C23C16/4411 , C23C28/321 , C23C28/322 , C23C28/34 , C23C28/345 , C23C28/3455 , C23C28/36 , C23C28/42 , C23C30/00 , C23C30/005 , C25D3/44 , C25D3/56 , C25D5/18 , C25D5/50 , H01J37/32477 , H01L21/67115 , Y10T428/12458 , Y10T428/12611 , Y10T428/12618 , Y10T428/12667 , Y10T428/12736 , Y10T428/12778 , Y10T428/12806
摘要： A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.
摘要翻译：形成能够在处理室中暴露于等离子体的组分的方法包括在表面上形成包括表面和电镀钇以及任选的铝或锆的结构。此后，可以将电镀层退火以氧化钇和其它电镀物质。

2. 发明授权

US08114525B2 Process chamber component having electroplated yttrium containing coating 有权
标题翻译：处理室组件具有电镀含钇的涂层
公开(公告)号：US08114525B2
公开(公告)日：2012-02-14
申请号：US12151842
申请日：2008-05-08
申请人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
发明人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
IPC分类号： B32B15/04 , B32B15/20 , B01J19/02 , B05C11/00
CPC分类号： C25D3/54 , C23C16/4404 , C23C16/4411 , C23C28/321 , C23C28/322 , C23C28/34 , C23C28/345 , C23C28/3455 , C23C28/36 , C23C28/42 , C23C30/00 , C23C30/005 , C25D3/44 , C25D3/56 , C25D5/18 , C25D5/50 , H01J37/32477 , H01L21/67115 , Y10T428/12458 , Y10T428/12611 , Y10T428/12618 , Y10T428/12667 , Y10T428/12736 , Y10T428/12778 , Y10T428/12806
摘要： A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating can include zirconium oxide, or can have an oxide layer thereon. In another embodiment the electroplated coating comprises a first species and is coated with a second electroplated coating comprising a second species that is different from the first species. The electroplated coating is resistant to corrosion in the plasma. In another embodiment, the electroplated coating has an interface having a thickness with a first concentration gradient of an yttrium-containing species and a second concentration gradient of a second species. An electroplated coating having a layer comprising first and second concentration gradients of first and second metals can be formed by varying the concentration of the first and second metal electrolyte species in the electroplating bath to electroplate the coating.
摘要翻译：能够在处理室中暴露于等离子体的组分具有包含含钇物质的电镀涂层的结构。电镀涂层可以包括氧化锆，或者可以在其上具有氧化物层。在另一个实施方案中，电镀涂层包括第一种，并涂覆有包含与第一种不同的第二物质的第二电镀涂层。电镀涂层耐等离子体腐蚀。在另一个实施方案中，电镀涂层具有具有包含钇的物质的第一浓度梯度和第二种类的第二浓度梯度的厚度的界面。具有包含第一和第二金属的第一和第二浓度梯度的层的电镀涂层可以通过改变电镀浴中的第一和第二金属电解质种类的浓度以电镀该涂层来形成。

3. 发明授权

US07371467B2 Process chamber component having electroplated yttrium containing coating 失效
标题翻译：处理室组件具有电镀含钇的涂层
公开(公告)号：US07371467B2
公开(公告)日：2008-05-13
申请号：US10824123
申请日：2004-04-13
申请人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
发明人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
IPC分类号： B32B15/04 , B32B15/20 , B01J19/02 , B05C11/00 , G03F7/16
CPC分类号： C25D3/54 , C23C16/4404 , C23C16/4411 , C23C28/321 , C23C28/322 , C23C28/34 , C23C28/345 , C23C28/3455 , C23C28/36 , C23C28/42 , C23C30/00 , C23C30/005 , C25D3/44 , C25D3/56 , C25D5/18 , C25D5/50 , H01J37/32477 , H01L21/67115 , Y10T428/12458 , Y10T428/12611 , Y10T428/12618 , Y10T428/12667 , Y10T428/12736 , Y10T428/12778 , Y10T428/12806
摘要： A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating is resistant to corrosion in the plasma, and can have a compositional gradient of yttrium-containing species through a thickness of the coating. In one embodiment, the coating is formed by electroplating a layer comprising yttrium onto the surface, and then electroplating a second layer onto the first layer, and annealing the first and second layers. The second layer can comprise aluminum or zirconium. In another embodiment, the coating is formed by electroplating a layer comprising a mixture of aluminum and yttrium onto the surface and annealing the layer.
摘要翻译：能够在处理室中暴露于等离子体的组分具有包含含钇物质的电镀涂层的结构。电镀涂层在等离子体中具有耐腐蚀性，并且可以通过涂层的厚度具有包含钇的物质的组成梯度。在一个实施例中，通过将包含钇的层电镀到表面上，然后将第二层电镀到第一层上，并对第一和第二层退火来形成涂层。第二层可以包括铝或锆。在另一个实施方案中，通过将包含铝和钇的混合物的层电镀在表面上并使层退火来形成涂层。

4. 发明申请

US20120138472A1 METHOD OF FORMING A PROCESS CHAMBER COMPONENT HAVING ELECTROPLATED YTTRIUM CONTAINING COATING 审中-公开
标题翻译：形成包含电镀铝酸盐的工艺室组分的方法
公开(公告)号：US20120138472A1
公开(公告)日：2012-06-07
申请号：US13372435
申请日：2012-02-13
申请人： Nianci HAN , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
发明人： Nianci HAN , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
IPC分类号： C25D5/10 , C25D5/50
CPC分类号： C25D3/54 , C23C16/4404 , C23C16/4411 , C23C28/321 , C23C28/322 , C23C28/34 , C23C28/345 , C23C28/3455 , C23C28/36 , C23C28/42 , C23C30/00 , C23C30/005 , C25D3/44 , C25D3/56 , C25D5/18 , C25D5/50 , H01J37/32477 , H01L21/67115 , Y10T428/12458 , Y10T428/12611 , Y10T428/12618 , Y10T428/12667 , Y10T428/12736 , Y10T428/12778 , Y10T428/12806
摘要： Methods of fabricating a chamber component capable of being exposed to a plasma in a process chamber includes: providing a component structure composed of metal; immersing the surface of the component structure in an electroplating bath comprising first metal electrolyte species and second metal electrolyte species; forming a cathode by connecting the component structure to a negative terminal of a voltage source; immersing in the electroplating bath, an anode comprising an inert material or material to be electroplated, and connecting the anode to a positive terminal of the voltage source; and electroplating a layer having a concentration gradient of the first metal, second metal, or both.
摘要翻译：制造能够在处理室中暴露于等离子体的室部件的方法包括：提供由金属构成的部件结构; 将组件结构的表面浸入包括第一金属电解质种类和第二金属电解质种类的电镀浴中; 通过将部件结构连接到电压源的负端来形成阴极; 浸渍在电镀浴中，包含惰性材料或待电镀材料的阳极，并将阳极连接到电压源的正端子; 以及电镀具有第一金属，第二金属或两者的浓度梯度的层。

5. 发明授权

US07833401B2 Electroplating an yttrium-containing coating on a chamber component 有权
标题翻译：在腔室部件上电镀含钇的涂层
公开(公告)号：US07833401B2
公开(公告)日：2010-11-16
申请号：US11766723
申请日：2007-06-21
申请人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
发明人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
IPC分类号： C25D5/10 , C25D5/50 , C25D3/54
CPC分类号： C25D3/54 , C23C16/4404 , C23C16/4411 , C23C28/321 , C23C28/322 , C23C28/34 , C23C28/345 , C23C28/3455 , C23C28/36 , C23C28/42 , C23C30/00 , C23C30/005 , C25D3/44 , C25D3/56 , C25D5/18 , C25D5/50 , H01J37/32477 , H01L21/67115 , Y10T428/12458 , Y10T428/12611 , Y10T428/12618 , Y10T428/12667 , Y10T428/12736 , Y10T428/12778 , Y10T428/12806
摘要： A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.
摘要翻译：形成能够在处理室中暴露于等离子体的组分的方法包括在表面上形成包括表面和电镀钇以及任选的铝或锆的结构。此后，可以将电镀层退火以氧化钇和其它电镀物质。

6. 发明申请

US20080223725A1 Process chamber component having electroplated yttrium containing coating 有权
标题翻译：处理室组件具有电镀含钇的涂层
公开(公告)号：US20080223725A1
公开(公告)日：2008-09-18
申请号：US12151842
申请日：2008-05-08
申请人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
发明人： Nianci Han , Li Xu , Hong Shih , Yang Zhang , Danny Lu , Jennifer Y. Sun
IPC分类号： C25D5/00 , B29C31/00 , C23C16/00
CPC分类号： C25D3/54 , C23C16/4404 , C23C16/4411 , C23C28/321 , C23C28/322 , C23C28/34 , C23C28/345 , C23C28/3455 , C23C28/36 , C23C28/42 , C23C30/00 , C23C30/005 , C25D3/44 , C25D3/56 , C25D5/18 , C25D5/50 , H01J37/32477 , H01L21/67115 , Y10T428/12458 , Y10T428/12611 , Y10T428/12618 , Y10T428/12667 , Y10T428/12736 , Y10T428/12778 , Y10T428/12806
摘要： A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating can include zirconium oxide, or can have an oxide layer thereon. In another embodiment the electroplated coating comprises a first species and is coated with a second electroplated coating comprising a second species that is different from the first species. The electroplated coating is resistant to corrosion in the plasma. In another embodiment, the electroplated coating has an interface having a thickness with a first concentration gradient of an yttrium-containing species and a second concentration gradient of a second species. An electroplated coating having a layer comprising first and second concentration gradients of first and second metals can be formed by varying the concentration of the first and second metal electrolyte species in the electroplating bath to electroplate the coating.
摘要翻译：能够在处理室中暴露于等离子体的组分具有包含含钇物质的电镀涂层的结构。电镀涂层可以包括氧化锆，或者可以在其上具有氧化物层。在另一个实施方案中，电镀涂层包括第一种，并涂覆有包含与第一种不同的第二物质的第二电镀涂层。电镀涂层耐等离子体腐蚀。在另一个实施方案中，电镀涂层具有具有包含钇的物质的第一浓度梯度和第二种类的第二浓度梯度的厚度的界面。具有包含第一和第二金属的第一和第二浓度梯度的层的电镀涂层可以通过改变电镀浴中的第一和第二金属电解质种类的浓度以电镀该涂层来形成。

7. 发明授权

US06413389B1 Method for recovering metal from etch by-products 失效
标题翻译：从蚀刻副产物中回收金属的方法
公开(公告)号：US06413389B1
公开(公告)日：2002-07-02
申请号：US09467295
申请日：1999-12-17
申请人： Hong Shih , Danny Lu , Nianci Han , Li Xu , Diana Ma
发明人： Hong Shih , Danny Lu , Nianci Han , Li Xu , Diana Ma
IPC分类号： C02F1461
CPC分类号： C22B11/042 , Y02P10/214
摘要： A method and assembly for recovering a metal from by-products produced from etching a metal (e.g., platinum, iridium, aluminum, etc.) in a plasma processing chamber. The method includes recovering from the plasma processing chamber a deposit of the by-products containing the metal. The deposit is dissolved in an acid, and the metal is recovered from the acid by inserting a working electrode, a reference electrode, and a counter electrode into the acid and applying a difference in potential between the working and reference electrodes to cause current to flow through the working and counter electrodes and the metal to be removed from the liquid and deposit on the working electrode. The metal is removed from the working electrode to recover the metal. The assembly for recovering the metal from the by-products includes a potentiostat for effecting a difference in potential between the working and reference electrodes and causing current to flow through the working and counter electrodes in response to the difference in potential between the working and reference electrodes.
摘要翻译：一种用于从在等离子体处理室中蚀刻金属（例如，铂，铱，铝等）产生的副产物中回收金属的方法和组件。该方法包括从等离子体处理室回收含有金属的副产物的沉积物。将沉积物溶解在酸中，通过将工作电极，参比电极和对电极插入酸中并在工作电极和参考电极之间施加电位差以使电流流动从酸中回收金属通过工作电极和对电极以及从液体中除去的金属沉积在工作电极上。从工作电极上除去金属以回收金属。用于从副产物中回收金属的组件包括用于实现工作电极和参考电极之间的电位差的恒电位仪，并且响应于工作电极和参考电极之间的电位差而导致电流流过工作电极和对电极。

8. 发明授权

US06623595B1 Wavy and roughened dome in plasma processing reactor 失效
标题翻译：等离子体处理反应堆中波浪和粗糙圆顶
公开(公告)号：US06623595B1
公开(公告)日：2003-09-23
申请号：US09536478
申请日：2000-03-27
申请人： Nianci Han , Hong Shih , Li Xu , Yan Ye
发明人： Nianci Han , Hong Shih , Li Xu , Yan Ye
IPC分类号： C23F100
CPC分类号： H01J37/32458 , C23C16/4404 , H01J37/321
摘要： A ceramic dome for in a plasma processing chamber having an RF coil disposed outside of said dome. The interior of the dome is formed with macroscopic grooves, and the grooves are roughened into a microscopic structure. The roughening provides increased adhesion to a residue film deposited on the dome during plasma processing. The macroscopic grooves increase the effective area of the dome and thus decreases the thickness of deposited film. The grooves may be formed by machining a green form of the ceramic material cast prior to sintering. The roughening may be formed by bead blasting the machined green form. Thereafter, the green form is fired to form a sintered ceramic dome.
摘要翻译：一种用于等离子体处理室的陶瓷圆顶，其具有设置在所述圆顶外侧的RF线圈。圆顶的内部形成有宏观的凹槽，并且凹槽被粗糙化成微观结构。在等离子体处理过程中，粗糙化对沉积在穹顶上的残留膜提供增加的粘合力。宏观沟槽增加了圆顶的有效面积，从而减小了沉积膜的厚度。凹槽可以通过在烧结之前加工铸造的陶瓷材料的绿色形成。粗糙化可以通过喷砂加工的绿色形式来形成。此后，烧成绿色形状以形成烧结的陶瓷圆顶。

9. 发明申请

US20080110760A1 Process chamber component having yttrium-aluminum coating 有权
标题翻译：具有钇铝涂层的工艺室部件
公开(公告)号：US20080110760A1
公开(公告)日：2008-05-15
申请号：US11982039
申请日：2007-10-31
申请人： Nianci Han , Li Xu , Hong Shih
发明人： Nianci Han , Li Xu , Hong Shih
IPC分类号： C25D3/56
CPC分类号： C25D3/54 , C23C16/4404 , C23C16/4411 , C23C28/321 , C23C28/322 , C23C28/34 , C23C28/345 , C23C28/3455 , C23C28/36 , C23C28/42 , C23C30/00 , C23C30/005 , C25D3/44 , C25D3/56 , C25D5/18 , C25D5/50 , H01J37/32477 , H01L21/67115 , Y10T428/12458 , Y10T428/12611 , Y10T428/12618 , Y10T428/12667 , Y10T428/12736 , Y10T428/12778 , Y10T428/12806
摘要： A method of manufacturing a substrate processing chamber component comprises forming a chamber component comprising a metal alloy comprising yttrium and aluminum, and anodizing an exposed surface of the metal alloy.
摘要翻译：制造基板处理室部件的方法包括：形成包括由钇和铝构成的金属合金的阳极氧化金属合金的暴露表面的室部件。

10. 发明授权

US06942929B2 Process chamber having component with yttrium-aluminum coating 失效
标题翻译：处理室具有钇铝涂层的部件
公开(公告)号：US06942929B2
公开(公告)日：2005-09-13
申请号：US10042666
申请日：2002-01-08
申请人： Nianci Han , Li Xu , Hong Shih
发明人： Nianci Han , Li Xu , Hong Shih
IPC分类号： C23C16/44 , H01J37/32 , B32B15/00 , B32B15/04 , B32B15/20 , C23C16/00
CPC分类号： H01J37/32477 , C23C16/4404 , Y10T428/12458 , Y10T428/12667 , Y10T428/12736 , Y10T428/12764 , Y10T428/13 , Y10T428/26
摘要： A substrate processing chamber component is a structure having an integral surface coating comprising an yttrium-aluminum compound. The component may be fabricated by forming a metal alloy comprising yttrium and aluminum into the component shape and anodizing its surface to form an integral anodized surface coating. The chamber component may be also formed by ion implanting material in a preformed metal shape. The component may be one or more of a chamber wall, substrate support, substrate transport, gas supply, gas energizer and gas exhaust.
摘要翻译：衬底处理室组件是具有包含钇铝化合物的整体表面涂层的结构。该组件可以通过将包含钇和铝的金属合金形成为组件形状并对其表面进行阳极氧化以形成整体的阳极氧化表面涂层来制造。腔室部件也可以由预先形成的金属形状的离子注入材料形成。该部件可以是室壁，衬底支撑件，衬底输送，气体供应，气体激发器和排气中的一个或多个。

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