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51. 发明申请

US20090293647A1 Sample Holder, Sample Suction Device Using the Same, and Sample Processing Method 有权
标题翻译：样品持有人，使用其的样品吸引装置和样品处理方法
公开(公告)号：US20090293647A1
公开(公告)日：2009-12-03
申请号：US12088669
申请日：2006-09-28
申请人： Takeshi Muneishi , Toshihiko Uemura , Katsuya Okumura
发明人： Takeshi Muneishi , Toshihiko Uemura , Katsuya Okumura
IPC分类号： G01N1/14 , B01L3/00
CPC分类号： H01L21/6875 , H01L21/68757
摘要： Because a sample holder 100 is composed of a plurality of convex parts 1 provided on a top face of a base substance 2, and the plurality of convex parts 1 are spherical surfaces 1a formed of a single crystal or amorphous material, frictional wear of the sample at contact parts between a sample 4 and the convex parts 1 is reduced, thereby making it possible to inhibit particle generation. Further, because a joining layer 3 is formed of a single crystal or amorphous material, there is no defect that particles scattered on the sample holder 100 fill up it, which makes it possible to easily keep it in a clean state by cleaning, and it is possible to effectively reduce reattachment of particles to the sample 4.
摘要翻译：由于样品保持器100由设置在基体2的顶面上的多个凸部1构成，多个凸部1是由单晶或非晶材料形成的球面1a，所以样品的摩擦磨损在样品4与凸部1之间的接触部分被还原，从而可以抑制颗粒的产生。此外，由于接合层3由单晶或非晶材料形成，所以不存在散布在样品架100上的颗粒填充的缺陷，这使得可以通过清洁容易地将其保持在清洁状态，并且其可以有效地减少颗粒到样品4的再附着。

52. 发明申请

US20090026368A1 APPARATUS AND METHOD FOR INSPECTING SAMPLE SURFACE 有权
标题翻译：检测样品表面的装置和方法
公开(公告)号：US20090026368A1
公开(公告)日：2009-01-29
申请号：US12162071
申请日：2007-01-24
申请人： Nobuharu Noji , Yoshihiko Naito , Hirosi Sobukawa , Masahiro Hatakeyama , Kenji Terao , Takeshi Murakami , Katsuya Okumura , Tatsuhiko Higashiki
发明人： Nobuharu Noji , Yoshihiko Naito , Hirosi Sobukawa , Masahiro Hatakeyama , Kenji Terao , Takeshi Murakami , Katsuya Okumura , Tatsuhiko Higashiki
IPC分类号： G01N23/00
CPC分类号： H01J37/29 , H01J37/045 , H01J2237/2446
摘要： Provided is a defect inspection apparatus and an inspection (or evaluation) method with highly improved accuracy, which would not be provided by the prior art, in the defect inspection apparatus used in a manufacturing process of a semiconductor device.Provided is a method for inspecting a sample surface with a projection type electron beam inspection apparatus, comprising the steps of: forming such an irradiation area on the sample surface by an electron beam generated from an electron gun 21 that has approximately a circular or elliptical shape of a size larger than a pattern on the sample surface; irradiating the electron beam substantially onto a center of the pattern on the sample surface; and forming an image on an electron detection plane of a detector from secondary electrons emanating from the sample surface in response to the irradiation of the electron beam for inspecting the sample surface.
摘要翻译：提供了在半导体器件的制造工艺中使用的缺陷检查装置中，现有技术不能提供高精度的缺陷检查装置和检查（或评价）方法。提供一种用投影型电子束检查装置检查样品表面的方法，包括以下步骤：通过由具有大致圆形或椭圆形的电子枪21产生的电子束在样品表面上形成这样的照射区域尺寸大于样品表面上的图案; 将电子束基本上照射到样品表面上的图案的中心; 以及响应于用于检查样品表面的电子束的照射，从从样品表面发射的二次电子在检测器的电子检测平面上形成图像。

53. 发明授权

US07470998B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07470998B2
公开(公告)日：2008-12-30
申请号：US11373154
申请日：2006-03-13
申请人： Katsuya Okumura , Koji Maruyama , Kazuya Nagaseki , Akiteru Rai
发明人： Katsuya Okumura , Koji Maruyama , Kazuya Nagaseki , Akiteru Rai
IPC分类号： H01L23/84 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention comprises a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure. A dielectric film formed between the first substrate and the wiring structure may be an adhesive layer.
摘要翻译：本发明涉及一种半导体器件，其中形成在诸如半导体晶片的基板上的器件的电极和诸如中介层之类的布线结构的电极通过延伸穿过衬底的连接电极相互连接，其制造方法。根据本发明的半导体器件包括：第一衬底，包括前表面和后表面;第一器件，具有形成在前表面上的第一电极; 以及形成有第二电极的布线结构，所述布线结构具有主表面。第一器件的第一电极和布线结构的第二电极通过从第一衬底的前表面延伸到后表面的连接电极彼此连接。基本上所有的第一基板的所有后表面被结合到布线结构的主表面。形成在第一基板和布线结构之间的电介质膜可以是粘合剂层。

54. 发明申请

US20080305434A1 Developing Apparatus and Developing Method 失效
标题翻译：开发设备与开发方法
公开(公告)号：US20080305434A1
公开(公告)日：2008-12-11
申请号：US11631514
申请日：2005-07-13
申请人： Takanori Nishi , Takahiro Kitano , Katsuya Okumura
发明人： Takanori Nishi , Takahiro Kitano , Katsuya Okumura
IPC分类号： G03F7/20 , G03D3/00
CPC分类号： G03F7/3021 , G03F7/26 , G03F7/38 , H01L21/67109 , H01L21/6715 , H01L21/67178
摘要： A developing apparatus has a substrate holder to hold a substrate, a heater which is provided in a substrate holder, and heats a substrate on a substrate holder for processing a resist film by PEB, a cooler to cool a substrate on a substrate holder, a developing solution nozzle to supply a developing solution to a substrate on a substrate holder, and a controller to control a heater, a cooler and a developing nozzle.
摘要翻译：显影装置具有用于保持基板的基板保持器，设置在基板保持器中的加热器，并且加热用于通过PEB处理抗蚀剂膜的基板保持器上的基板，冷却器以冷却基板保持器上的基板，显影溶液喷嘴将显影液供给到基板保持器上的基板，以及控制器，用于控制加热器，冷却器和显影喷嘴。

55. 发明申请

US20080302185A1 Microstructure Inspecting Apparatus and Microstructure Inspecting Method 审中-公开
标题翻译：微观结构检查仪器和微观结构检测方法
公开(公告)号：US20080302185A1
公开(公告)日：2008-12-11
申请号：US11662478
申请日：2005-09-09
申请人： Masami Yakabe , Toshiyuki Matsumoto , Naoki Ikeuchi , Katsuya Okumura
发明人： Masami Yakabe , Toshiyuki Matsumoto , Naoki Ikeuchi , Katsuya Okumura
IPC分类号： G01H1/00
CPC分类号： G01N29/14 , B81C99/005 , G01N29/4427 , G01N2291/2695 , G01N2291/2697
摘要： Voltage is applied to a chip TP by a voltage drive unit 30 through a probe needle P to move a movable part of a microstructure. A sound produced in response to motion of the movable part of the microstructure is detected by a microphone 3. Then, the sound detected by the microphone 3 is measured by a measurement unit 25. The control unit 20 evaluates the characteristics of the tested chip TP by comparing with a sound detected from an ideal chip TP.
摘要翻译：通过电压驱动单元30通过探针P将电压施加到芯片TP，以移动微结构的可移动部分。通过麦克风3检测响应于微结构的可动部分的运动而产生的声音。然后，由测量单元25测量由麦克风3检测到的声音。控制单元20评估测试芯片TP的特性通过与从理想芯片TP检测到的声音进行比较。

56. 发明授权

US07435769B2 Flame resistant synthetic resin composition 有权
标题翻译：耐火合成树脂组合物
公开(公告)号：US07435769B2
公开(公告)日：2008-10-14
申请号：US10550014
申请日：2004-03-24
申请人： Daishiro Kishimoto , Toru Makino , Katsuya Okumura , Juji Uchida
发明人： Daishiro Kishimoto , Toru Makino , Katsuya Okumura , Juji Uchida
IPC分类号： C08K5/34
CPC分类号： D01F6/92 , C08K5/0066 , C08K5/5313 , C08L101/00 , D01F1/07 , D01F6/90 , C08L55/02
摘要： A flame-retardant synthetic resin composition characterized by comprising 1-40 parts by weight of at least one type of organic phosphorus compound represented by the following general formula (1): (wherein R1 represents alkyl, aralkyl, etc.) with respect to 100 parts by weight of a synthetic resin.
摘要翻译：一种阻燃性合成树脂组合物，其特征在于包含1-40重量份的由以下通式（1）表示的至少一种有机磷化合物：其中R 1表示烷基，芳烷基等）相对于100重量份的合成树脂。

57. 发明授权

US07195846B2 Methods of manufacturing photomask blank and photomask 有权
标题翻译：制造光掩模坯料和光掩模的方法
公开(公告)号：US07195846B2
公开(公告)日：2007-03-27
申请号：US10724734
申请日：2003-12-02
申请人： Hideo Kaneko , Yukio Inazuki , Tetsushi Tsukamoto , Masayuki Mogi , Katsuya Okumura
发明人： Hideo Kaneko , Yukio Inazuki , Tetsushi Tsukamoto , Masayuki Mogi , Katsuya Okumura
IPC分类号： G03F1/00 , G03C5/00
CPC分类号： G03F1/82 , G03F1/26 , G03F1/32 , G03F1/68
摘要： A photomask blank having a film of at least one layer formed on a substrate is manufactured by forming a film on a substrate and irradiating the film with light from a flash lamp. A photomask is manufactured from the thus manufactured photomask blank by forming a patterned resist on the film on the blank by photolithography, etching away those portions of the film which are not covered with the resist, and removing the resist. The photomask blank and photomask have minimized warpage and improved chemical resistance.
摘要翻译：通过在基板上形成膜并用来自闪光灯的光照射薄膜来制造具有形成在基板上的至少一层的膜的光掩模坯料。通过光刻法在坯料上的膜上形成图案化的抗蚀剂，蚀刻掉未被抗蚀剂覆盖的膜的那些部分，并除去抗蚀剂，由这样制造的光掩模坯料制造光掩模。光掩模坯料和光掩模具有最小的翘曲和改善的耐化学性。

58. 发明授权

US07108589B2 Polishing apparatus and method 有权
标题翻译：抛光设备和方法
公开(公告)号：US07108589B2
公开(公告)日：2006-09-19
申请号：US11187944
申请日：2005-07-25
申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
发明人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
IPC分类号： B24B7/00
CPC分类号： B24B37/345 , B24B9/065 , B24B37/12 , H01L21/67046
摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.
摘要翻译：抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属电影。抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光用于抛光衬底的外周部分的机构。

59. 发明申请

US20050279170A1 Device for inspecting micro structure, method for inspecting micro structure and program for inspecting micro structure 失效
标题翻译：微观结构检测装置，微观结构检查方法和微观结构检查程序
公开(公告)号：US20050279170A1
公开(公告)日：2005-12-22
申请号：US11149176
申请日：2005-06-10
申请人： Katsuya Okumura , Toshiyuki Matsumoto , Naoki Ikeuchi , Masami Yakabe
发明人： Katsuya Okumura , Toshiyuki Matsumoto , Naoki Ikeuchi , Masami Yakabe
IPC分类号： B81C99/00 , G01C19/56 , G01C25/00 , G01N29/00 , G01N29/09 , G01N29/12 , G01N29/30 , G01N29/42 , G01N29/46 , G01P15/12 , G01P21/00 , H01L29/84
CPC分类号： G01C19/5719 , B81C99/005 , G01C25/005 , G01N29/12 , G01N29/30 , G01N29/42 , G01N29/46 , G01N2291/2695 , G01N2291/2697 , G01P15/123 , G01P21/00 , G01P2015/0842
摘要： Test sound wave is outputted from a speaker. A movable part of a three-axis acceleration sensor, which is a micro structure of a chip to be tested TP, moves due to the arrival of the test sound wave which is compression wave outputted from the speaker, that is, due to air vibrations. A change in the resistance value that changes in accordance with this movement is measured on the basis of an output voltage that is provided via a probe needles. A control part determines the property of the three-axis acceleration sensor on the basis of the measured property values, that is, measured data.
摘要翻译：测试声波从扬声器输出。作为被测试芯片TP的微结构的三轴加速度传感器的可动部分由于扬声器输出的压缩波的测试声波的到来而移动，即由于空气振动。基于通过探针提供的输出电压来测量根据该移动而变化的电阻值的变化。控制部件基于测量的属性值，即测量数据来确定三轴加速度传感器的特性。

60. 发明申请

US20050087853A1 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050087853A1
公开(公告)日：2005-04-28
申请号：US10855889
申请日：2004-05-28
申请人： Katsuya Okumura , Koji Maruyama , Kazuya Nagaseki , Akiteru Rai
发明人： Katsuya Okumura , Koji Maruyama , Kazuya Nagaseki , Akiteru Rai
IPC分类号： H01L23/52 , H01L21/3205 , H01L21/768 , H01L23/12 , H01L23/48 , H01L25/065 , H01L25/07 , H01L25/18 , H01L23/02 , H05K7/02
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00 , H01L2924/00012
摘要： The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention comprises a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure. A dielectric film formed between the first substrate and the wiring structure may be an adhesive layer.
摘要翻译：本发明涉及一种半导体器件，其中形成在诸如半导体晶片的基板上的器件的电极和诸如中介层之类的布线结构的电极通过延伸穿过衬底的连接电极相互连接，其制造方法。根据本发明的半导体器件包括：第一衬底，包括前表面和后表面;第一器件，具有形成在前表面上的第一电极; 以及形成有第二电极的布线结构，所述布线结构具有主表面。第一器件的第一电极和布线结构的第二电极通过从第一衬底的前表面延伸到后表面的连接电极彼此连接。基本上所有的第一基板的所有后表面被结合到布线结构的主表面。形成在第一基板和布线结构之间的电介质膜可以是粘合剂层。

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