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51. 发明申请

US20050172724A1 Pressure sensor 失效
标题翻译：压力传感器
公开(公告)号：US20050172724A1
公开(公告)日：2005-08-11
申请号：US11046792
申请日：2005-02-01
申请人： Minekazu Sakai , Yasutoshi Suzuki
发明人： Minekazu Sakai , Yasutoshi Suzuki
IPC分类号： G01L9/00 , G01L9/06 , G01L19/00 , G01L19/06 , H01L29/84
CPC分类号： G01L9/0054 , G01L19/0627 , G01L19/0636
摘要： A pressure sensor includes a semiconductor substrate and a pedestal member such as a glass pedestal. The semiconductor substrate has a diaphragm for detecting a pressure and a thick portion positioned around the diaphragm. The pedestal member has one surface bonded to the thick portion of the semiconductor substrate and the other surface opposite to the one surface. In the pressure sensor, the pedestal member has a through hole through which pressure is introduced to the diaphragm. The through hole penetrates through the pedestal member from an opening of the other surface to the one surface of the pedestal member, and the through hole has a hole diameter that becomes smaller from the one surface toward the other surface of the pedestal member. Accordingly, it can effectively restrict foreign materials such as dusts from being introduced into the through hole of the pressure sensor.
摘要翻译：压力传感器包括半导体基板和诸如玻璃基座的基座构件。半导体衬底具有用于检测压力的膜片和位于膜片周围的厚壁部分。基座构件具有一个表面，其结合到半导体衬底的厚部分，另一个表面与该表面相对。在压力传感器中，基座构件具有通向该隔膜的压力的通孔。通孔从另一个表面的开口穿过基座构件到基座构件的一个表面，并且通孔具有从基座构件的一个表面朝向另一个表面变小的孔直径。因此，能够有效地将诸如灰尘的异物引入压力传感器的通孔中。

52. 发明授权

US06785117B2 Capacitive device 有权
标题翻译：电容器件
公开(公告)号：US06785117B2
公开(公告)日：2004-08-31
申请号：US10386100
申请日：2003-03-12
申请人： Minekazu Sakai , Toshiyuki Tsuchiya , Hirofumi Funabashi , Norio Fujitsuka , Yasuichi Mitsushima
发明人： Minekazu Sakai , Toshiyuki Tsuchiya , Hirofumi Funabashi , Norio Fujitsuka , Yasuichi Mitsushima
IPC分类号： H01G700
CPC分类号： G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/082
摘要： A capacitive device includes a substrate, a movable electrode, and a fixed electrode. The movable electrode is located above a surface of the substrate and is movable with respect to the substrate along directions that are substantially orthogonal to the surface. The fixed electrode is stationary with respect to the substrate. When the movable electrode is displaced in a first direction that is substantially orthogonal to the surface, the total sum of area-distance quotients in the overlap between the electrodes remains substantially unchanged or decreases to provide a first reduction rate that is substantially zero or more. On the other hand, when the movable electrode is displaced in a second direction that is substantially opposite to the first direction, the total sum of area-distance quotients remains substantially unchanged or decreases to provide a second reduction rate that is substantially zero or more. The reduction rates are different from each other.
摘要翻译：电容器件包括衬底，可动电极和固定电极。可移动电极位于基板的表面上方并且能够沿与基板正交的方向相对于基板移动。固定电极相对于基板是静止的。当可移动电极在基本上与表面正交的第一方向上位移时，电极之间的重叠中的面积 - 距离商的总和基本上保持不变或减小，以提供基本为零或更大的第一减小率。另一方面，当可移动电极在与第一方向基本相反的第二方向上移位时，面积 - 距离商的总和基本上保持不变或减小，从而提供基本为零或更大的第二减小率。缩减率彼此不同。

53. 发明授权

US06444543B2 Semiconductor sensor device and method of manufacturing the same 有权
标题翻译：半导体传感器装置及其制造方法
公开(公告)号：US06444543B2
公开(公告)日：2002-09-03
申请号：US09866709
申请日：2001-05-30
申请人： Minekazu Sakai , Hiroshige Sugito , Hiroshi Muto , Motoki Ito , Tsuyoshi Fukada
发明人： Minekazu Sakai , Hiroshige Sugito , Hiroshi Muto , Motoki Ito , Tsuyoshi Fukada
IPC分类号： H01L21301
CPC分类号： B81C1/00896 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： Plural semiconductor chips such as acceleration sensor chips formed on the first surface of a substrate are separated into individual pieces by dicing the substrate from the second surface thereof. A groove surrounding each sensor chip, along which the sensor chip is diced out, is formed at the same time the sensor chip is formed on the first surface. Before dicing, a protecting sheet covering the first surface is pasted along the sidewalls and the bottom wall of the groove. The groove is made sufficiently wide to ensure that the protecting sheet is bent along the walls of the groove without leaving a space between the groove and the protecting sheet. Thus, dicing dusts generated in the dicing process are prevented from being scattered and entering the sensor chip.
摘要翻译：通过从基板的第二表面切割基板，形成在基板的第一表面上的加速度传感器芯片的多个半导体芯片被分离成单独的部件。在传感器芯片形成在第一表面上的同时形成围绕传感器芯片的每个传感器芯片周围的凹槽，该传感器芯片被切出。在切割之前，覆盖第一表面的保护片沿着凹槽的侧壁和底壁粘贴。所述凹槽被制成足够宽以确保保护片沿着凹槽的壁弯曲，而不会在凹槽和保护片之间留下空间。因此，防止在切割工艺中产生的切割粉尘被散射并进入传感器芯片。

54. 发明授权

US06430999B1 Semiconductor physical quantity sensor including frame-shaped beam surrounded by groove 有权
公开(公告)号：US06430999B1
公开(公告)日：2002-08-13
申请号：US09818624
申请日：2001-03-28
申请人： Minoru Murata , Minekazu Sakai
发明人： Minoru Murata , Minekazu Sakai
IPC分类号： G01P1500
摘要： A semiconductor physical quantity sensor has a beam connecting a movable portion and a support substrate for displacing the movable portion in a displacement direction. The beam has a rectangular frame shape with a hollow portion and is surrounded by a groove. The groove has opposing intervals at both sides of the beam in the displacement direction, and the opposing intervals are equal to an interval of the hollow portion in the displacement direction. Accordingly, etching rates at the groove and the hollow portion become approximately equal to each other, reducing processing variation of the beam.

55. 发明授权

US06169316A Semiconductor pressure sensor including sensor chip fixed to package by adhesive 失效
标题翻译：半导体压力传感器包括通过粘合剂固定到包装上的传感器芯片
公开(公告)号：US06169316A
公开(公告)日：2001-01-02
申请号：US09287012
申请日：1999-04-06
申请人： Minekazu Sakai , Yasutoshi Suzuki
发明人： Minekazu Sakai , Yasutoshi Suzuki
IPC分类号： H01L2982
CPC分类号： G01L19/146 , G01L19/147
摘要： In a semiconductor pressure sensor, adhesive having a Young's modulus of equal to or less than 1×104 Pa such as silicone system gel is disposed between a bottom wall of a casing and a bottom wall of a sensor chip, and a space between side walls of the sensor chip and side walls of the casing is filled with adhesive having a Young's modulus of equal to or larger than 1×104 Pa, such as silicone system adhesive or epoxy system adhesive. Accordingly, temperature characteristics of the sensor chip can be improved without causing pressure leakage.
摘要翻译：在半导体压力传感器中，在壳体的底壁和传感器芯片的底壁之间设置有等于或小于1×10 4 Pa的杨氏模量的粘合剂，例如硅酮体系凝胶，并且在侧壁之间的空间传感器芯片和壳体的侧壁填充有杨氏模量等于或大于1×10 4 Pa的粘合剂，例如硅氧烷系粘合剂或环氧树脂体系粘合剂。因此，可以提高传感器芯片的温度特性，而不会引起压力泄漏。

56. 发明授权

US09513245B2 Capacitive humidity sensor 有权
标题翻译：电容式湿度传感器
公开(公告)号：US09513245B2
公开(公告)日：2016-12-06
申请号：US14116149
申请日：2012-05-22
申请人： Minekazu Sakai , Naohisa Niimi
发明人： Minekazu Sakai , Naohisa Niimi
IPC分类号： G01R27/26 , G01N27/22 , G01N27/04
CPC分类号： G01N27/223 , G01N27/048 , G01N27/225 , H01L2224/48137 , H01L2224/8592
摘要： A humidity sensor includes a detection device with a capacitance changing with humidity at a first ratio and a reference device with a capacitance changing with humidity at a second ratio smaller than the first ratio. The detection device has detection electrodes facing each other with a first gap and a detection humidity-sensitive film covering the detection electrodes. The reference device has reference electrodes facing each other with a second gap and a reference humidity-sensitive film covering the reference electrodes. The detection humidity-sensitive film and the reference humidity-sensitive film are made from the same material and have the same thickness. The detection electrodes and the reference electrodes are made from the same material and have the same width and thickness. The second ratio peaks when the second gap is equal to a predetermined value. The second gap is smaller than the first gap and the predetermined value.
摘要翻译：一种湿度传感器包括具有以第一比例的湿度变化的电容的检测装置和具有以比第一比率小的第二比例的湿度变化的电容的参考装置。检测装置具有检测电极，第一间隙面对彼此，检测用湿敏膜覆盖检测电极。参考装置具有彼此面对的具有第二间隙的参考电极和覆盖参考电极的参考湿度敏感膜。检测用湿度敏感膜和基准湿度敏感膜由相同的材料制成，厚度相同。检测电极和参考电极由相同的材料制成并且具有相同的宽度和厚度。当第二间隙等于预定值时，第二比率达到峰值。第二间隙小于第一间隙和预定值。

57. 发明授权

US09239309B2 Humidity sensor and method of manufacturing the same 有权
标题翻译：湿度传感器及其制造方法
公开(公告)号：US09239309B2
公开(公告)日：2016-01-19
申请号：US14115901
申请日：2012-05-30
申请人： Naohisa Niimi , Minekazu Sakai
发明人： Naohisa Niimi , Minekazu Sakai
IPC分类号： G01N27/22 , G01N27/12
CPC分类号： G01N27/223 , G01N27/121
摘要： A humidity sensor includes a humidity detention section, a pad section, and a dam section. The humidity detention section includes a pair of detection electrodes facing each other on a predetermined surface of a substrate and a humidity-sensitive film covering the detection electrodes. The pad section is spaced from the humidity detection section on the surface and covered with a protection gel section. The dam section is located between the humidity detection section and the pad section on the surface. The dam section includes a dam wire that is made from the same material as the detection electrodes and a dam humidity-sensitive film that is made from the same material as the humidity-sensitive film and covers at least part of the dam wire.
摘要翻译：湿度传感器包括湿度滞留部分，垫部分和坝部分。湿度滞留部分包括在基板的预定表面上彼此面对的一对检测电极和覆盖检测电极的湿敏膜。垫部分与表面上的湿度检测部分间隔开并用保护凝胶部分覆盖。水坝段位于湿度检测部分和表面上的垫部分之间。坝段包括由与检测电极相同的材料制成的坝线，以及由与湿敏膜相同的材料制成并覆盖至少一部分坝线的水坝湿度敏感膜。

58. 发明授权

US08225660B2 Dynamic quantity sensor and method of manufacturing the same 有权
标题翻译：动态量传感器及其制造方法
公开(公告)号：US08225660B2
公开(公告)日：2012-07-24
申请号：US12792404
申请日：2010-06-02
申请人： Minekazu Sakai , Takashi Katsumata , Yoshiaki Murakami
发明人： Minekazu Sakai , Takashi Katsumata , Yoshiaki Murakami
IPC分类号： G01P9/04 , G01P1/02 , G01C19/56
CPC分类号： G01C19/5747 , B81B2207/012 , B81C99/0045 , G01C25/00 , H01L29/84
摘要： A dynamic quantity sensor includes a sensor chip, a base member, and bumps. The sensor chip includes a semiconductor substrate, a sensor part, and sensor pads electrically coupled with the sensor part. The base member includes a base substrate and base pads disposed on the base substrate. The bumps mechanically and electrically couple the sensor pads and the base pads, respectively, in a state where the sensor chip is curved with respect to the base member. The sensor pads include input pads and output pads. The first surface of the semiconductor substrate includes a first portion and a second portion. The first portion is closer to the base substrate than the second portion is. At least one of the input pads is disposed on the first portion and at least one of the output pads is disposed on the second portion.
摘要翻译：动态量传感器包括传感器芯片，基底构件和凸块。传感器芯片包括半导体衬底，传感器部分和与传感器部件电耦合的传感器衬垫。基座构件包括基底基板和设置在基底基板上的基座垫。在传感器芯片相对于基座构件弯曲的状态下，凸块分别机械地和电耦接传感器焊盘和基座。传感器焊盘包括输入焊盘和输出焊盘。半导体衬底的第一表面包括第一部分和第二部分。第一部分比第二部分更靠近基底基板。至少一个输入焊盘设置在第一部分上，并且至少一个输出焊盘设置在第二部分上。

59. 发明申请

US20080093740A1 Capacitive semiconductor sensor 失效
标题翻译：电容半导体传感器
公开(公告)号：US20080093740A1
公开(公告)日：2008-04-24
申请号：US11882135
申请日：2007-07-31
申请人： Minekazu Sakai , Michihiro Masuda , Kimiharu Kayukawa
发明人： Minekazu Sakai , Michihiro Masuda , Kimiharu Kayukawa
IPC分类号： H01L27/148
CPC分类号： G01P15/125 , B81B2201/0235 , B81C1/0023 , G01P1/023 , G01P15/0802 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2924/00014 , H01L2924/16195 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A capacitive semiconductor sensor includes a sensor chip, a circuit chip, a plurality of bumps, and a plurality of dummy bumps. The sensor chip includes a dynamic quantity detector, which has a detection axis in one direction. The circuit chip includes a signal processing circuit. The sensor chip and the circuit chip are coupled by flip-chip bonding through the plurality of bumps. Furthermore, the sensor chip and the circuit chip are mechanically coupled through the plurality of dummy bumps.
摘要翻译：电容半导体传感器包括传感器芯片，电路芯片，多个凸块和多个虚拟凸块。传感器芯片包括具有一个方向的检测轴的动态量检测器。电路芯片包括信号处理电路。传感器芯片和电路芯片通过多个凸块的倒装芯片接合来耦合。此外，传感器芯片和电路芯片通过多个虚拟凸块机械耦合。

60. 发明授权

US07155977B2 Semiconductor dynamic quantity sensor 有权
标题翻译：半导体动量传感器
公开(公告)号：US07155977B2
公开(公告)日：2007-01-02
申请号：US11253579
申请日：2005-10-20
申请人： Minekazu Sakai
发明人： Minekazu Sakai
IPC分类号： G01P15/00 , G01P15/125
CPC分类号： G01P15/125 , G01P2015/0814
摘要： A capacitance type semiconductor dynamic quantity sensor includes a substrate having a support layer and a semiconductor layer mounted on the support layer, a weight portion displaceable in a predetermined direction, movable electrodes joined to the weight portion so as to be displaceable integrally with the weight portion, fixed electrodes disposed so as to confront the movable electrodes and beam-shaped beam portions that are deformable elastically to displace the weight portion. When a dynamic quantity is applied, the distance between each movable electrode and each fixed electrode being varied, and the applied dynamic quantity being detected on the basis of the capacitance variation between both the electrodes which is caused by the variation of this distance. The thickness h2 of the beam portion is set to be larger than the thickness h1 of the movable electrode.
摘要翻译：电容型半导体动态量传感器包括：具有支撑层和安装在支撑层上的半导体层的基板，可沿预定方向移位的重量部分，连接到重物部分的可移动电极，可与重物部分一体地移动设置成面对可弹性变形以移动重物部分的可动电极和梁形梁部分的固定电极。当施加动态量时，每个可移动电极和每个固定电极之间的距离是变化的，并且基于由该距离的变化引起的两个电极之间的电容变化而检测所施加的动态量。梁部的厚度h 2被设定为大于可动电极的厚度h 1。

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