会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 53. 发明授权
    • Dual layer etch stop barrier
    • 双层蚀刻停止屏障
    • US06420777B2
    • 2002-07-16
    • US09031251
    • 1998-02-26
    • Chung Hon LamEric Seung LeeFrancis Roger White
    • Chung Hon LamEric Seung LeeFrancis Roger White
    • H01L2358
    • H01L21/0217H01L21/022H01L21/02271H01L21/31116H01L21/3185Y10S438/97
    • A method for reactive ion etching of SiO2 and an etch stop barrier for use in such an etching is provided. A silicon nitride (SixNy) barrier having a Six to Ny ratio (x:y) of less than about 0.8 and preferably the stoichiometric amount of 0.75 provides excellent resilience to positive mobile ion contamination, but poor etch selectivity. However, a silicon nitride barrier having a ratio of Six to Nx (x:y) of 1.0 or greater has excellent etch selectivity with respect to SiO2 but a poor barrier to positive mobile ion contamination. A barrier of silicon nitride is formed on a doped silicon substrate which barrier has two sections. One section has a greater etch selectivity with respect to silicon dioxide than the second section and the second section has a greater resistance to transmission of positive mobile ions than the first section. One section adjacent the silicon substrate has a silicon to nitrogen ratio of less than about 0.8. The second section, formed on top of the first section is formed with the ratio of the silicon to nitrogen of greater than about 0.8. Preferably the two sections together are from about 50 to about 100 nanometers thick.
    • 提供了用于SiO 2的反应离子蚀刻的方法和用于这种蚀刻中的蚀刻阻挡层。 具有小于约0.8且优选化学计量量为0.75的六至奈比(x:y)的氮化硅(SixNy)阻挡层对正移动离子污染提供优异的回弹性,但蚀刻选择性差。 然而,六至氮(x:y)的比例为1.0或更大的氮化硅阻挡层相对于SiO 2具有优异的蚀刻选择性,但对于移动离子污染的正面阻挡性差。 在掺杂硅衬底上形成氮化硅屏障,该阻挡层具有两个部分。 一个部分相对于二氧化硅具有比第二部分更大的蚀刻选择性,并且第二部分比第一部分具有更大的对正性可移动离子透射的抵抗力。 与硅衬底相邻的一个部分的硅氮比小于约0.8。 在第一部分顶部形成的第二部分形成硅与氮的比大于约0.8。 优选地,两个部分一起为约50至约100纳米厚。
    • 54. 发明授权
    • Self-aligned junction isolation
    • 自对准结隔离
    • US06403482B1
    • 2002-06-11
    • US09605726
    • 2000-06-28
    • Nivo RovedoChung Hon Lam
    • Nivo RovedoChung Hon Lam
    • H01L21302
    • H01L29/66636H01L29/0653H01L29/41766
    • Transistors having self-aligned dielectric layers under the source/drain contacts are formed by constructing transistors up to the LDD implant; etching STI oxide selective to Si and nitride to form a self-aligned contact recess; depositing an insulating layer in the bottom of the contact recess; recessing the insulating layer to leave room for a conductive contact layer; depositing the contact layer to make contact on a vertical surface to the Si underneath the gate sidewalls; recessing the contact layer; forming interlayer dielectric and interconnect to complete the circuit.
    • 在源极/漏极触点下方具有自对准电介质层的晶体管通过构造直到LDD注入的晶体管来形成; 蚀刻对Si和氮化物有选择性的STI氧化物以形成自对准的接触凹部; 在接触凹部的底部沉积绝缘层; 使绝缘层凹陷以留下导电接触层的空间; 沉积接触层以在与栅极侧壁下方的Si的垂直表面上接触; 使接触层凹陷; 形成层间电介质和互连以完成电路。
    • 58. 发明申请
    • HIGH-ENDURANCE PHASE CHANGE MEMORY DEVICES AND METHODS FOR OPERATING THE SAME
    • 高耐久性相变记忆体装置及其操作方法
    • US20120327708A1
    • 2012-12-27
    • US13472395
    • 2012-05-15
    • Pei-Ying DUChao-I WuMing-Hsiu LeeSangbum KimChung Hon Lam
    • Pei-Ying DUChao-I WuMing-Hsiu LeeSangbum KimChung Hon Lam
    • G11C11/00
    • G11C13/0004G11C13/0021
    • Phase change based memory devices and methods for operating such devices described herein overcome the set or reset failure mode and result in improved endurance, reliability and data storage performance. A high current repair operation is carried out in response to a set or reset failure of a phase change memory cell. The higher current repair operation can provide a sufficient amount of energy to reverse compositional changes in the phase change material which can occur after repeated set and reset operations. By reversing these compositional changes, the techniques described herein can recover a memory cell which experienced a set or reset failure, thereby extending the endurance of the memory cell. In doing so, phase change based memory devices and methods for operating such devices are provided which have high cycle endurance.
    • 基于相变的存储器件和用于操作这里描述的这种器件的方法克服了设置或复位故障模式并导致改进的耐久性,可靠性和数据存储性能。 响应于相变存储单元的置位或复位故障执行高电流修复操作。 更高的电流修复操作可以提供足够的能量来反转在重复设置和复位操作之后可能发生的相变材料的组成变化。 通过颠倒这些组合变化,本文描述的技术可以恢复经历设置或复位故障的存储器单元,从而延长存储单元的耐久性。 这样做,提供了具有高循环耐久性的基于相变的存储器件和用于操作这些器件的方法。
    • 59. 发明授权
    • Area efficient neuromorphic circuits using field effect transistors (FET) and variable resistance material
    • 使用场效应晶体管(FET)和可变电阻材料的区域效率的神经元电路
    • US08311965B2
    • 2012-11-13
    • US12620624
    • 2009-11-18
    • Matthew J. BreitwischChung Hon LamDharmendra S. ModhaBipin Rajendran
    • Matthew J. BreitwischChung Hon LamDharmendra S. ModhaBipin Rajendran
    • G06F17/00
    • G06N3/0635G11C11/54G11C13/0002H01L27/285
    • A neuromorphic circuit includes a first field effect transistor in a first diode configuration establishing an electrical connection between a first gate and a first drain of the first field effect transistor. The neuromorphic circuit also includes a second field effect transistor in a second diode configuration establishing an electrical connection between a second gate and a second drain of the second field effect transistor. The neuromorphic circuit further includes variable resistance material electrically connected to both the first drain and the second drain, where the variable resistance material provides a programmable resistance value. The neuromorphic circuit additionally includes a first junction electrically connected to the variable resistance material and providing a first connection point to an output of a neuron circuit, and a second junction electrically connected to the variable resistance material and providing a second connection point to the output of the neuron circuit.
    • 神经形态电路包括在第一二极管配置中建立第一场效应晶体管的第一栅极和第一漏极之间的电连接的第一场效应晶体管。 神经形态电路还包括在第二二极管配置中建立第二场效应晶体管的第二栅极和第二漏极之间的电连接的第二场效应晶体管。 神经形态电路还包括电连接到第一漏极和第二漏极的可变电阻材料,其中可变电阻材料提供可编程电阻值。 神经形态电路还包括电连接到可变电阻材料并且提供到神经元电路的输出的第一连接点的第一结,以及电连接到可变电阻材料并且提供第二连接点到第二连接点的第二连接点 神经元电路。