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51. 发明授权

US5395198A Vacuum loading chuck and fixture for flexible printed circuit panels 失效
标题翻译：用于柔性印刷电路板的真空加载卡盘和夹具
公开(公告)号：US5395198A
公开(公告)日：1995-03-07
申请号：US901640
申请日：1992-06-19
申请人： Thomas P. Duffy , Lewis C. Hecht , Merritt P. Sulger, deceased , Ernst E. Thiele , Mark V. Pierson , Lawrence E. Williams
发明人： Thomas P. Duffy , Lewis C. Hecht , Merritt P. Sulger, deceased , Ernst E. Thiele , Mark V. Pierson , Lawrence E. Williams
IPC分类号： B23P21/00 , B25H3/02 , B65G49/07 , H01L21/00 , H01L21/673 , H01L21/677 , H01L21/683 , H05K3/00 , B65G49/06 , B65H1/00 , C23C16/00
CPC分类号： H01L21/67236 , H01L21/67126 , H01L21/67363 , H01L21/67376 , H01L21/67386 , H01L21/67772
摘要： Disclosed is a system for handling large area, in-process, circuit panel layers. The circuit panel layers are thin and flimsy, and require rigid support for certain processing steps. The system includes a peripheral frame fixture for surrounding and supporting the in process circuit panel layer, and a a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The peripheral frame fixture includes a bottom plate having a central opening to expose the circuit panel layer, a top frame having a corresponding central opening to expose the opposite surface of the circuit panel layer, and a compressive apparatus, as screws, bolts, or the like, for applying a z axis compressive force to the bottom plate, the top frame, and a panel layer therebetween. Optionally, the fixture may include alignment pins or fiducials for aligning the bottom plate, a panel layer, and the top frame, and a robotic interface for a robotic arm to grasp and transfer the peripheral frame fixture. The system also includes a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The loading chuck includes a peripheral edge for receiving the bottom plate of the peripheral frame fixture. This provides co-planarity of the in-process circuit panel layer, the bottom plate of the peripheral frame fixture, and the vacuum table. The vacuum table is within the area bounded by the peripheral edge of the loading chuck and the peripheral frame of the peripheral frame fixture, and is coplanar with them. The vacuum table includes slidable bearing surfaces, with vacuum apertures for drawing a vacuum to hold the panel in place, and slide actuators for moving the slidable bearing surfaces to apply x-y axis tension to a panel on the bearing surfaces.
摘要翻译：公开了一种用于处理大面积，在制程中的电路板层的系统。电路板层薄而脆弱，并且对于某些加工步骤需要刚性支撑。该系统包括用于围绕和支撑过程电路板层的外围框架固定装置，以及用于将工艺中电路板层安装在周边框架固定装置中的装载卡盘。外围框架固定装置包括具有中央开口以暴露电路板层的底板，具有相应中心开口以露出电路板层的相对表面的顶部框架，以及压缩装置，如螺钉，螺栓或用于将z轴压缩力施加到底板，顶部框架以及它们之间的面板层。可选地，固定装置可以包括用于对准底板，面板层和顶部框架的对准销或基准，以及用于机器人臂来抓握和传送外围框架固定装置的机器人界面。该系统还包括用于将工艺中电路板层安装在外围框架固定装置中的装载卡盘。装载卡盘包括用于接收外围框架固定装置的底板的外围边缘。这提供了工艺电路板层，外围框架固定装置的底板和真空工作台的共面性。真空工作台位于由装载卡盘周边边缘和外围框架固定装置的外围框架所限定的区域内，与它们共面。真空工作台包括可滑动的支承表面，具有用于拉伸真空以将面板保持在适当位置的真空孔，以及用于移动可滑动的支承表面以将x-y轴张力施加到支承表面上的面板的致动器。

52. 发明授权

US5364225A Method of printed circuit panel manufacture 失效
标题翻译：印刷电路板制造方法
公开(公告)号：US5364225A
公开(公告)日：1994-11-15
申请号：US901042
申请日：1992-06-19
申请人： Lewis C. Hecht , Merritt P. Sulger, deceased , by Ellen Sulgar, executrix , Ernst E. Thiele , Mark V. Pierson , Lawrence E. Williams
发明人： Lewis C. Hecht , Merritt P. Sulger, deceased , by Ellen Sulgar, executrix , Ernst E. Thiele , Mark V. Pierson , Lawrence E. Williams
IPC分类号： B23P21/00 , B25H3/02 , B65D51/14 , B65D85/86 , B65G49/00 , B65G49/07 , H01L21/00 , H01L21/673 , H01L21/677 , H05K3/00 , B65G65/02 , C23C13/08
CPC分类号： H01L21/67236 , H01L21/67126 , H01L21/67363 , H01L21/67376 , H01L21/67386 , H01L21/67772 , Y10S414/139
摘要： Disclosed is a method of manufacturing a printed circuit panel. The method is carried out without a cleanroom, but in a clean room environment. The first step is to place a thin, non-rigid panel in a suitable fixture, for example, for transfer and also for processing. The fixtured panel is then placed in an air tight transfer container, which has a substantially contaminant free atmosphere. The transfer container has a sealed door at one end. The transfer container is then brought into a seaiable, substantially airtight interlock with a process enclosure. This process enclosure also has a substantially contaminant free atmosphere, and a sealed door at one end. An airtight seal is formed between the transfer container and the process enclosure, and also between the surfaces of the two doors. This is to avoid introducing surface contaminants into the process enclosure and transfer container atmospheres. Next, the two doors are opened simultaneously. This is to allow the transfer of at least one panel and its fixture from the transfer container into the process enclosure. Inside the process enclosure the panel is transferred to a process station for a manufacturing process. Finally, the panel and its fixture are transferred from the process enclosure into the transfer container. This may be the same container or a different container. The doors of the process enclosure and the transfer container are then closed and sealed.
摘要翻译：公开了印刷电路板的制造方法。该方法在没有洁净室的情况下进行，但在洁净室环境中进行。第一步是将薄的非刚性面板放置在合适的夹具中，例如用于转移和加工。然后将固定面板放置在气密转移容器中，其具有基本上无污染的气氛。转移容器在一端具有密封门。然后将转移容器与过程外壳进入可检测的，基本上气密的互锁。该过程外壳还具有基本上无污染的气氛，并且在一端具有密封门。在转移容器和处理外壳之间以及两个门的表面之间形成气密密封。这是为了避免将表面污染物引入工艺外壳并转移容器环境。接下来，两扇门同时打开。这是为了允许将至少一个面板及其固定装置从转移容器传送到过程外壳中。在工艺外壳内部，面板被传送到制造过程的处理站。最后，面板及其固定装置从过程外壳转移到转移容器中。这可能是相同的容器或不同的容器。然后将过程外壳和转移容器的门关闭并密封。

53. 发明授权

US4813130A Automatic extrusion pinning method and apparatus 失效
标题翻译：自动挤压销钉法及装置
公开(公告)号：US4813130A
公开(公告)日：1989-03-21
申请号：US41399
申请日：1987-04-23
申请人： Donald Fey , John T. Legg , Mark V. Pierson
发明人： Donald Fey , John T. Legg , Mark V. Pierson
IPC分类号： B21C23/24 , B21C25/02 , B21J5/06 , B29C45/14 , B29L31/34 , H01R43/20 , H05K1/09 , H05K3/10 , H05K3/40 , H05K3/00 , B23P19/00
CPC分类号： H01R43/20 , H05K1/095 , H05K3/10 , H05K3/4069 , Y10T29/49153 , Y10T29/53209
摘要： The method and apparatus described in the disclosure utilizes the known technique of extrusion to form a plurality of very small pins, with diameters of 0.020 inch or smaller, in a substrate of electrically nonconductive material. The number of pins is 360 or more, and the electrically conductive material described in the extrusion process is copper. A pin die is formed with the same number and pattern of holes as are in a blank substrate, and it is positioned over an extrusion die with matching orifices that is fixed on an extrusion press. A head die presses the blank substrate firmly on the pin die during the extrusion operation, and when completed, the pins are sheared and the substrate is ejected as a new blank is positioned to repeat the cycle.

54. 发明授权

US08089133B2 Optical assemblies for transmitting and manipulating optical beams 有权
标题翻译：用于传输和操纵光束的光学组件
公开(公告)号：US08089133B2
公开(公告)日：2012-01-03
申请号：US10993305
申请日：2004-11-19
申请人： Dinesh Gupta , Brenda L. Peterson , Mark V. Pierson , Eugen Schenfeld , Subhash L. Shinde
发明人： Dinesh Gupta , Brenda L. Peterson , Mark V. Pierson , Eugen Schenfeld , Subhash L. Shinde
IPC分类号： H01L31/0232
CPC分类号： G02B6/3522 , G02B6/2817 , G02B6/3544 , G02B6/3574 , G02B6/3598 , G02B6/4214 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4249 , G02B6/4259 , G02B6/4269 , G02B6/4281 , G02B6/43 , H01L2924/0002 , H01L2924/00
摘要： Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.
摘要翻译：提供用于引导光束的光学立方体和光学立方体组件。光学立方体是可以适于反射，透射和/或部分地反射和透射光束的光学透明模块。光学立方体可以包括用于引导光束的双向或多方向光束引导元件。光学立方体组件可以包括附接到光学立方体的柔性芯片组件。芯片组件可以包括用于发射光束的垂直腔表面发射激光器或用于接收安装在柔性和电互连安装组件上的光束的接收器。

55. 发明授权

US06770968B2 Method for bonding heat sinks to overmolds and device formed thereby 有权
标题翻译：用于将散热器连接到包覆成型体的方法和由此形成的装置
公开(公告)号：US06770968B2
公开(公告)日：2004-08-03
申请号：US10369778
申请日：2003-02-19
申请人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
发明人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
IPC分类号： H01L2334
CPC分类号： B29C59/14 , H01L21/56 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.
摘要翻译：一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加贴附物将物品粘合到表面上。通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。等离子体可以是氧等离子体，并且粘合剂可以选自具有金属氧化物填料的热固化的硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

56. 发明授权

US06576996B2 Method for bonding heat sinks to overmolds and device formed thereby 有权
公开(公告)号：US06576996B2
公开(公告)日：2003-06-10
申请号：US09757159
申请日：2001-01-09
申请人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
发明人： Frank D. Egitto , Michael A. Gaynes , Ramesh R. Kodnani , Luis J. Matienzo , Mark V. Pierson
IPC分类号： H01L2334
CPC分类号： B29C59/14 , H01L21/56 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

57. 发明授权

US06569710B1 Panel structure with plurality of chip compartments for providing high volume of chip modules 失效
标题翻译：具有多个芯片隔间的面板结构，用于提供大量的芯片模块
公开(公告)号：US06569710B1
公开(公告)日：2003-05-27
申请号：US09205407
申请日：1998-12-03
申请人： Mark V. Pierson
发明人： Mark V. Pierson
IPC分类号： H01L2144
CPC分类号： H01L24/97 , H01L23/5385 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/00
摘要： A method of forming a plurality of individual semiconductor chip modules wherein a plurality of chips are placed in a plurality of chip compartments formed by adhering a support panel to the first surface and a cover panel to the second surface of a stiffener panel having openings defining sidewalls of the chip compartments. The resulting laminated panel structure is then cut into a plurality of modules each having at least one compartment containing at least one chip. Each chip is electrically connected to interior conductive pads on the inner surface of the support panel, and these interior pads in turn are connected by conductive paths to exterior conductive terminals deposited on the outer surface of the support panel. The electrical connections between the chip and the interior conductive pads of the support panel may be encapsulated in a polymeric material before the cover panel is adhered to the stiffener panel.
摘要翻译：一种形成多个单独的半导体芯片模块的方法，其中将多个芯片放置在通过将支撑板粘附到第一表面而形成的多个芯片隔室中，并且将盖板覆盖到具有限定侧壁的开口的加强板的第二表面的芯片隔间。然后将所得的层压板结构切成多个模块，每个模块具有至少一个包含至少一个芯片的隔室。每个芯片电连接到支撑板的内表面上的内部导电焊盘，并且这些内部衬垫又通过导电路径连接到沉积在支撑板的外表面上的外部导电端子。在盖板粘附到加强板之前，芯片和支撑板的内部导电焊盘之间的电连接可被封装在聚合材料中。

58. 发明授权

US06534848B1 Electrical coupling of a stiffener to a chip carrier 有权
公开(公告)号：US06534848B1
公开(公告)日：2003-03-18
申请号：US09657194
申请日：2000-09-07
申请人： Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
发明人： Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
IPC分类号： H01L2302
CPC分类号： H05K3/0061 , H01L21/4846 , H05K3/386 , H05K3/4038 , H05K2201/0305 , H05K2201/09554 , H05K2201/10977
摘要： A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.

59. 发明授权

US06513701B2 Method of making electrically conductive contacts on substrates 失效
公开(公告)号：US06513701B2
公开(公告)日：2003-02-04
申请号：US09879222
申请日：2001-06-12
申请人： Donald I. Mead , Mark V. Pierson
发明人： Donald I. Mead , Mark V. Pierson
IPC分类号： B23K2622
CPC分类号： H05K3/3484 , B23K1/0053 , B23K1/0056 , B23K2101/40 , H05K3/3494 , H05K2203/043 , H05K2203/0557 , H05K2203/107
摘要： A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. A reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. The mask and excess solder paste are removed.

60. 发明授权

US06497943B1 Surface metal balancing to reduce chip carrier flexing 失效
标题翻译：表面金属平衡，减少芯片载体弯曲
公开(公告)号：US06497943B1
公开(公告)日：2002-12-24
申请号：US09503395
申请日：2000-02-14
申请人： Lisa J. Jimarez , Miguel A. Jimarez , Mark V. Pierson
发明人： Lisa J. Jimarez , Miguel A. Jimarez , Mark V. Pierson
IPC分类号： B32B300
CPC分类号： B32B15/08 , B32B15/20 , B32B17/10229 , B32B2250/40 , B32B2425/00 , H01L23/142 , H01L23/49822 , H01L2224/16225 , H01L2924/00014 , H01L2924/01322 , H05K1/0271 , H05K3/4602 , H05K2201/0949 , H05K2201/09781 , H05K2201/10674 , H05K2201/10734 , Y10T428/24917 , H01L2924/00 , H01L2224/0401
摘要： A surface metal balancing structure for a chip carrier, and an associated method of fabrication, to reduce or eliminate thermally induced chip carrier flexing. A substrate, such as a chip carrier made of organic dielectric material, is formed and includes: internal circuitization layers, a plated through hole, and outer layers comprised of an allylated polyphenylene ether. A stiffener ring for mechanically stabilizing the substrate is bonded to an outer portion, such as an outer perimeter portion, of the top surface of the substrate, in light of the soft and conformal organic material of the substrate. The top and bottom surfaces of the substrate have metal structures, such as copper pads and copper circuitization, wherein a surface area (A) multiplied by a coefficient of thermal expansion (C) is greater for the metal structure at the bottom surface than for the metal structure at the top surface. A metal pattern is adjacent to the top surface so as to make the product AC of metal structures at or near the top and bottom surfaces approximately equal. The metal pattern reduces or eliminates flexing of the substrate in an elevated temperature environment, such as during a reflow of solder that couples a semiconductor chip to the substrate.
摘要翻译：用于芯片载体的表面金属平衡结构以及相关的制造方法，以减少或消除热诱导的芯片载体弯曲。形成诸如由有机电介质材料制成的芯片载体的衬底，其包括：内部电路层，电镀通孔和由烯丙基化聚苯醚构成的外层。根据衬底的软和保形有机材料，用于机械稳定衬底的加强环被结合到衬底的顶表面的外部部分，例如外周部分。衬底的顶表面和底表面具有诸如铜焊盘和铜电路的金属结构，其中在底表面处的金属结构的表面积（A）乘以热膨胀系数（C）大于对于金属结构在顶面。金属图案与顶表面相邻，以使金属结构的产品AC在顶表面和底表面处或附近大致相等。金属图案减少或消除了在升高的温度环境中的衬底的弯曲，例如在将半导体芯片耦合到衬底的焊料的回流期间。

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