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1. 发明授权

US06699736B2 Electrical coupling of a stiffener to a chip carrier 有权
标题翻译：加强筋与芯片载体的电耦合
公开(公告)号：US06699736B2
公开(公告)日：2004-03-02
申请号：US10305643
申请日：2002-11-26
申请人： Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
发明人： Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
IPC分类号： H01L2144
CPC分类号： H05K3/0061 , H01L21/4846 , H05K3/386 , H05K3/4038 , H05K2201/0305 , H05K2201/09554 , H05K2201/10977
摘要： A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.
摘要翻译：用于将金属加强件导电耦合到芯片载体的方法和结构。衬底在其表面上具有导电焊盘，并且在衬底表面上形成粘合剂层。金属加强件被放置在粘合剂层上，其中粘合剂层将加强件机械地连接到基底表面，并将加强件电耦合到垫。然后将粘合剂层固化，例如通过在升高的温度下加压。本发明的实施例通过在焊盘上形成导电触点并在基板上设置干燥的粘合剂来形成粘合剂层，使得导电触点位于干粘合剂中的孔内。导电触头将加强件电耦合到焊盘。固化步骤包括固化干燥粘合剂和导电接触，导致干燥粘合剂将加强剂粘合到基底上。导电接触可包括导电粘合剂或金属焊料。本发明的另外的实施方案通过在基底上施加导电粘合剂形成粘合剂层，其中在将加强件放置在粘合剂层上之后，导电粘合剂将加强件机械地和电耦合到基底的表面。

2. 发明授权

US06534848B1 Electrical coupling of a stiffener to a chip carrier 有权
公开(公告)号：US06534848B1
公开(公告)日：2003-03-18
申请号：US09657194
申请日：2000-09-07
申请人： Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
发明人： Terry J. Dornbos , Raymond A. Phillips, Jr. , Mark V. Pierson , William J. Rudik , David L. Thomas
IPC分类号： H01L2302
CPC分类号： H05K3/0061 , H01L21/4846 , H05K3/386 , H05K3/4038 , H05K2201/0305 , H05K2201/09554 , H05K2201/10977
摘要： A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.

3. 发明授权

US6040631A Method of improved cavity BGA circuit package 失效
标题翻译：改进空腔BGA电路封装方法
公开(公告)号：US6040631A
公开(公告)日：2000-03-21
申请号：US238872
申请日：1999-01-27
申请人： Eric P. Dibble , Eric A. Johnson , Raymond A. Phillips, Jr.
发明人： Eric P. Dibble , Eric A. Johnson , Raymond A. Phillips, Jr.
IPC分类号： H01L21/60 , H01L21/58 , H01L23/36 , H01L23/373 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/83 , H01L23/36 , H01L23/3737 , H01L24/32 , H01L2224/29078 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/29339 , H01L2224/29347 , H01L2224/32057 , H01L2224/451 , H01L2224/48091 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/8385 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/30105
摘要： An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.
摘要翻译：提供了一种改进的接合系统，其中金属散热器结合到半导体芯片。使用两个粘合剂系统，其中第一粘合剂与第二粘合剂表现出高的粘合强度，表现出高导热性。

4. 发明授权

US06514777B2 Built-in inspection template for a printed circuit 失效
标题翻译：内置印刷电路检查模板
公开(公告)号：US06514777B2
公开(公告)日：2003-02-04
申请号：US09757523
申请日：2001-01-10
申请人： Marshall L. Brown , James A. Busby , Raymond A. Phillips, Jr. , John A. Potenza , Jirina D. Shupp , J. Robert Young
发明人： Marshall L. Brown , James A. Busby , Raymond A. Phillips, Jr. , John A. Potenza , Jirina D. Shupp , J. Robert Young
IPC分类号： H01L2166
CPC分类号： H01L22/34 , H01L2224/49113 , H01L2224/49171 , Y10T29/49131
摘要： An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
摘要翻译：用于印刷电路的改进的接合条，以便于质量检查。接合带具有功能区域和非功能区域。功能区域由具有第一尺寸宽度的接合带的区域表示。非功能区域由具有第二宽度尺寸的接合带的区域表示。第一尺寸可以比第二尺寸更宽或更窄。

5. 发明授权

US06212077B1 Built-in inspection template for a printed circuit 失效
标题翻译：内置印刷电路检查模板
公开(公告)号：US06212077B1
公开(公告)日：2001-04-03
申请号：US09237090
申请日：1999-01-25
申请人： Marshall L. Brown , James A. Busby , Raymond A. Phillips, Jr. , John A. Potenza , Jirina D. Shupp , J. Robert Young
发明人： Marshall L. Brown , James A. Busby , Raymond A. Phillips, Jr. , John A. Potenza , Jirina D. Shupp , J. Robert Young
IPC分类号： H01L2166
CPC分类号： H01L22/34 , H01L2224/49113 , H01L2224/49171 , Y10T29/49131
摘要： An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
摘要翻译：用于印刷电路的改进的接合条，以便于质量检查。接合带具有功能区域和非功能区域。功能区域由具有第一尺寸宽度的接合带的区域表示。非功能区域由具有第二宽度尺寸的接合带的区域表示。第一尺寸可以比第二尺寸更宽或更窄。

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