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    • 51. 发明授权
    • Synchronous pulse plasma etching equipment and method of fabricating a semiconductor device
    • 同步脉冲等离子体蚀刻设备及制造半导体器件的方法
    • US08460508B2
    • 2013-06-11
    • US12591602
    • 2009-11-24
    • Ken TokashikiHong ChoJeong-Dong Choe
    • Ken TokashikiHong ChoJeong-Dong Choe
    • H01L21/3065H01L21/302C23C16/00C23C16/50C23C16/52
    • H01J37/32165H01J37/32082H01J37/32174
    • Synchronous pulse plasma etching equipment includes a first electrode and one or more second electrodes configured to generate plasma in a plasma etching chamber. A first radio frequency power output unit is configured to apply a first radio frequency power having a first frequency and a first duty ratio to the first electrode, and to output a control signal including information about a phase of the first radio frequency power. At least one second radio frequency power output unit is configured to apply a second radio frequency power having a second frequency and a second duty ratio to a corresponding second electrode among the second electrodes. The second radio frequency power output unit is configured to control the second radio frequency power to be synchronized with the first radio frequency power or to have a phase difference from the first radio frequency power in response to the control signal.
    • 同步脉冲等离子体蚀刻设备包括第一电极和被配置为在等离子体蚀刻室中产生等离子体的一个或多个第二电极。 第一射频功率输出单元被配置为向第一电极施加具有第一频率和第一占空比的第一射频功率,并且输出包括关于第一射频功率的相位的信息的控制信号。 至少一个第二射频功率输出单元被配置为将具有第二频率和第二占空比的第二射频功率应用于第二电极中的对应的第二电极。 第二射频功率输出单元被配置为响应于控制信号控制与第一射频功率同步的第二射频功率或者与第一射频功率相位差。
    • 55. 发明授权
    • Method of forming a contact in semiconductor device
    • 在半导体器件中形成接触的方法
    • US06271108B1
    • 2001-08-07
    • US09313258
    • 1999-05-18
    • Jeong-Dong Choe
    • Jeong-Dong Choe
    • H01L2144
    • H01L21/76897
    • The present invention relates to a method of forming a contact in semiconductor device, more particularly, to a method of forming a borderless contact in semiconductor device which minimizes loss of field oxide on forming a contact hole, reducing leakage current at an interface between an active area and a field area and preventing another loss of silicon and silicide in the active area by forming a barrier layer on a field oxide layer for separating devices in order to enhance a process margin of forming the contact hole in the active area due to a reduced design rule and an increased device integrity. The present invention includes the steps of forming a trench on a semiconductor substrate wherein the trench defines an active area and a field area, filling up the trench with an insulating layer, forming a barrier layer just on the insulating layer, forming a transistor in the active layer wherein the transistor has an impurity diffusion region, forming an insulating interlayer on a surface of the substrate including the transistor and the barrier layer, and forming at least a contact hole by removing a predetermined portion of the insulating interlayer wherein the contact hole exposes both a portion of the impurity diffusion region and another portion of the barrier layer.
    • 本发明涉及一种在半导体器件中形成接触的方法,更具体地说,涉及一种在半导体器件中形成无边界接触的方法,该方法使形成接触孔的场氧化物的损耗最小化,减少了在活性物质之间的界面处的泄漏电流 区域和场区,并通过在用于分离器件的场氧化物层上形成阻挡层来防止有源区中的硅和硅化物的另一损失,以便增强由于减少了在有源区中形成接触孔的工艺余量 设计规则和增加的设备完整性。 本发明包括在半导体衬底上形成沟槽的步骤,其中沟槽限定有源区和场区,用绝缘层填充沟槽,在绝缘层上形成阻挡层,在绝缘层上形成晶体管 活性层,其中所述晶体管具有杂质扩散区,在包括所述晶体管和所述阻挡层的所述衬底的表面上形成绝缘中间层,并且通过去除所述绝缘中间层的预定部分形成至少接触孔,其中所述接触孔暴露 杂质扩散区域的一部分和势垒层的另一部分。
    • 57. 发明申请
    • METHODS OF MANUFACTURING CHARGE TRAP-TYPE NON-VOLATILE MEMORY DEVICES
    • 制造电荷陷波型非易失性存储器件的方法
    • US20100173469A1
    • 2010-07-08
    • US12651781
    • 2010-01-04
    • Hak-Sun LeeKyoung-Sub ShinJeong-Dong Choe
    • Hak-Sun LeeKyoung-Sub ShinJeong-Dong Choe
    • H01L21/76
    • H01L27/11568
    • Some methods are directed to manufacturing charge trap-type non-volatile memory devices. An isolation layer pattern can be formed that extends in a first direction in a substrate. A recess unit is formed in the substrate by recessing an exposed surface of the substrate adjacent to the isolation layer pattern. A tunnel insulating layer and a charge trap layer are sequentially formed on the substrate. The tunnel insulating layer and the charge trap layer are patterned to form an isolated island-shaped tunnel insulating layer pattern and an isolated island-shaped charge trap layer pattern by etching defined regions of the substrate, the isolation layer pattern, the tunnel insulating layer, and the charge trap layer until a top surface of the charge trap layer that is disposed on a bottom surface of the recess unit is aligned with a top surface of the isolation layer pattern. A blocking insulating layer is formed that covers the charge trap layer pattern, the isolation layer pattern, and a defined region of the substrate interposed between the charge trap patterns. A gate electrode pattern is formed on the blocking insulating layer to face the charge trap layer pattern. This manufacturing process may reduce charge spreading between unit memory cells and/or may prevent/avoid reduction in the breakdown voltage of the blocking insulating layer.
    • 一些方法涉及制造电荷陷阱型非易失性存储器件。 可以形成在衬底中沿第一方向延伸的隔离层图案。 通过使邻近隔离层图案的基板的暴露表面凹陷而在基板中形成凹部单元。 隧道绝缘层和电荷陷阱层依次形成在基板上。 图案化隧道绝缘层和电荷陷阱层,通过蚀刻衬底的限定区域,隔离层图案,隧道绝缘层,隔离层状图案,隔离层状图案,隧道绝缘层, 并且电荷陷阱层直到设置在凹陷单元的底表面上的电荷陷阱层的顶表面与隔离层图案的顶表面对准。 形成了覆盖电荷陷阱层图案,隔离层图案和插入在电荷阱图案之间的基板的限定区域的阻挡绝缘层。 在阻挡绝缘层上形成面对电荷陷阱层图案的栅电极图案。 该制造过程可以减小单元存储单元之间的电荷扩展和/或可以防止/避免阻塞绝缘层的击穿电压的降低。
    • 60. 发明申请
    • Synchronous pulse plasma etching equipment and method of fabricating a semiconductor device
    • 同步脉冲等离子体蚀刻设备及制造半导体器件的方法
    • US20100130018A1
    • 2010-05-27
    • US12591602
    • 2009-11-24
    • Ken TokashikiHong ChoJeong-Dong Choe
    • Ken TokashikiHong ChoJeong-Dong Choe
    • H01L21/3065
    • H01J37/32165H01J37/32082H01J37/32174
    • Synchronous pulse plasma etching equipment includes a first electrode and one or more second electrodes configured to generate plasma in a plasma etching chamber. A first radio frequency power output unit is configured to apply a first radio frequency power having a first frequency and a first duty ratio to the first electrode, and to output a control signal including information about a phase of the first radio frequency power. At least one second radio frequency power output unit is configured to apply a second radio frequency power having a second frequency and a second duty ratio to a corresponding second electrode among the second electrodes. The second radio frequency power output unit is configured to control the second radio frequency power to be synchronized with the first radio frequency power or to have a phase difference from the first radio frequency power in response to the control signal.
    • 同步脉冲等离子体蚀刻设备包括第一电极和被配置为在等离子体蚀刻室中产生等离子体的一个或多个第二电极。 第一射频功率输出单元被配置为向第一电极施加具有第一频率和第一占空比的第一射频功率,并且输出包括关于第一射频功率的相位的信息的控制信号。 至少一个第二射频功率输出单元被配置为将具有第二频率和第二占空比的第二射频功率应用于第二电极中的对应的第二电极。 第二射频功率输出单元被配置为响应于控制信号控制与第一射频功率同步的第二射频功率或者与第一射频功率相位差。