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    • 47. 发明授权
    • Method of examining a sample in a charged-particle microscope
    • 在带电粒子显微镜中检查样品的方法
    • US09312098B2
    • 2016-04-12
    • US14629387
    • 2015-02-23
    • FEI Company
    • Ivan LazicEric Gerardus Theodoor BoschFaysal BoughorbelBart BuijsseKasim SaderSorin Lazar
    • H01J37/26H01J37/244H01J37/28
    • H01J37/244H01J37/26H01J37/265H01J37/28H01J2237/2446H01J2237/24465H01J2237/2802
    • Examining a sample in a charged-particle microscope of a scanning transmission type includes: Providing a beam of charged particles that is directed from a source through an illuminator so as to irradiate the sample; Providing a detector for detecting a flux of charged particles traversing the sample; Causing said beam to scan across a surface of the sample, and recording an output of the detector as a function of scan position, resulting in accumulation of a charged-particle image of the sample, Embodying the detector to comprise a plurality of detection segments; Combining signals from different segments of the detector so as to produce a vector output from the detector at each scan position, and compiling this data to yield a vector field; and Mathematically processing said vector field by subjecting it to a two-dimensional integration operation, thereby producing an integrated vector field image.
    • 在扫描透射型的带电粒子显微镜中检查样品包括:提供从源通过照射器引导以便照射样品的带电粒子束; 提供检测器,用于检测穿过样品的带电粒子的通量; 使所述光束扫描穿过样品的表面,并记录检测器的输出作为扫描位置的函数,导致样品的带电粒子图像的累积,使检测器包含多个检测段; 组合来自检测器的不同段的信号,以便在每个扫描位置产生从检测器输出的矢量,并且编译该数据以产生矢量场; 并通过使其进行二维积分操作来数字处理所述矢量场,由此产生积分矢量场图像。
    • 50. 发明授权
    • Method and apparatus for slice and view sample imaging
    • 用于切片和查看样本成像的方法和装置
    • US09218940B1
    • 2015-12-22
    • US14292606
    • 2014-05-30
    • FEI Company
    • Valerie Brogden
    • H01J37/305H01J37/26
    • H01J37/3056G01N23/2208G01N23/2251G01N23/2255H01J37/26H01J37/265H01J37/3023H01J2237/2611H01J2237/2814H01J2237/31745H01J2237/31749
    • Methods, apparatuses, and systems for slice and view processing of samples with dual beam systems. The slice and view processing includes exposing a vertical wall of a trench formed in a sample surface; capturing a first image of the wall by interrogating the wall with an interrogating beam while the wall is at a first orientation relative to the beam; capturing a second image of the wall by interrogating the wall with the beam while the wall is at a second orientation relative to the beam, wherein first distances in the first image between a reference point and surface points on the wall are different than second distances in the second image between the reference point and the surface points; determining elevations of the surface points using the first distances and the second distances; and fitting a curve to topography of the wall using the elevations.
    • 用于双光束系统的样品的切片和视图处理的方法,设备和系统。 切片和视图处理包括暴露在样品表面中形成的沟槽的垂直壁; 当所述壁相对于所述梁处于第一取向时,用询问梁询问所述壁,捕获所述壁的第一图像; 通过在所述壁相对于所述光束处于第二取向的情况下通过用所述光束询问所述壁来捕获所述壁的第二图像,其中所述第一图像中的参考点和所述壁上的表面点之间的第一距离不同于所述壁上的第二距离 参考点和表面点之间的第二个图像; 使用所述第一距离和所述第二距离确定所述表面点的高度; 并使用高程将曲线拟合到墙的地形。