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    • 44. 发明申请
    • Buffer layer and growth method for subsequent epitaxial growth of III-V nitride semiconductors
    • 用于III-V族氮化物半导体后续外延生长的缓冲层和生长方法
    • US20030012984A1
    • 2003-01-16
    • US09904129
    • 2001-07-11
    • Tetsuzo Ueda
    • B32B009/00C30B023/02
    • H01L21/0262C30B7/005C30B25/18C30B29/40C30B29/403C30B29/406H01L21/0237H01L21/02381H01L21/0242H01L21/02447H01L21/02458H01L21/02472H01L21/02502H01L21/0254H01L21/02623
    • An improved epitaxial wafer and growth method of III-V nitrides (III-V compound semiconductor which contains nitrogen as a group-V element, written as InGaAlBNAsP alloy, typically GaN, AlN, InN, or ternary alloy system of two of the three) on large diameter substrates with flat surfaces and better crystal quality is provided. A III-V nitrides alloy thin film is formed by spin-coating on substrates. Liquid containing group III elements and nitrogen is spread on substrates. Then the substrate is coated with thin film from the liquid by spinning it at certain rotation speeds. The film and substrate is annealed to crystallize the spin-coated film in a gas atmosphere, where the gas atmosphere includes a gas, where the gas includes nitrogen as an element. This film is used as a buffer layer for subsequent epitaxial growth of large area III-V nitrides to obtain flat surfaces together with good crystal quality and uniformity. Oxide buffer layer such as zinc oxide, magnesium oxide, aluminum oxide is also spin-coated and annealed in a gas atmosphere in which a gas contains oxygen as an clement. III-V Nitride is overgrown on the crystallized oxide buffer layer.
    • III-V族氮化物的改进的外延晶片和生长方法(III-V族化合物半导体,其含有氮作为V族元素,被称为InGaAlBNAsP合金,典型地为GaN,AlN,InN或三种合金中的两种的三元合金系) 在具有平坦表面的大直径基材和更好的晶体质量的情况下提供。 通过在基板上旋涂形成III-V族氮化物合金薄膜。 含有III族元素和氮的液体扩散在基材上。 然后,通过在一定的转速下旋转基板,从液体中涂覆薄膜。 对膜和衬底进行退火,以在气体气氛中气旋气氛中结晶旋涂,其中气体气体包括气体,其中气体包括氮作为元素。 该膜用作缓冲层,用于随后的大面积III-V氮化物的外延生长,以获得平坦的表面以及良好的晶体质量和均匀性。 氧化锌,氧化镁,氧化铝等氧化物缓冲层也在气体含有氧气的气体气氛中旋涂,退火。 III-V氮化物在结晶的氧化物缓冲层上长满。