会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 43. 发明申请
    • LIGHT EMITTING DIODE DEVICE
    • 发光二极管装置
    • US20110114966A1
    • 2011-05-19
    • US12939142
    • 2010-11-03
    • Wen-Huang LiuLi-Wei ShanChen-Fu Chu
    • Wen-Huang LiuLi-Wei ShanChen-Fu Chu
    • H01L33/32H01L33/60
    • H01L33/60H01L33/22H01L33/38H01L33/405
    • A high-brightness vertical light emitting diode (LED) device having an outwardly located metal electrode. The LED device is formed by: forming the metal electrode on an edge of a surface of a LED epitaxy structure using a deposition method, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), evaporation, electro-plating, or any combination thereof; and then performing a packaging process. The composition of the LED may be a nitride, a phosphide or an arsenide. The LED of the invention has the following advantages: improving current spreading performance, reducing light-absorption of the metal electrode, increasing brightness, increasing efficiency, and thereby improving energy efficiency. The metal electrode is located on the edge of the device and on the light emitting side. The metal electrode has two side walls, among which one side wall can receive more emission light from the device in comparison with the other one.
    • 具有向外定位的金属电极的高亮度垂直发光二极管(LED)装置。 LED器件通过以下方式形成:使用诸如物理气相沉积(PVD),化学气相沉积(CVD),蒸发,电镀或沉积法的沉积方法在LED外延结构的表面的边缘上形成金属电极 其任何组合; 然后执行包装过程。 LED的组成可以是氮化物,磷化物或砷化物。 本发明的LED具有以下优点:提高电流扩散性能,降低金属电极的光吸收,增加亮度,提高效率,从而提高能量效率。 金属电极位于器件的边缘和发光侧。 金属电极具有两个侧壁,其中一个侧壁可以从另一个侧壁接收来自该装置的更多的发射光。
    • 49. 发明授权
    • Light emitting diode (LED) device having lens protective structure and method of fabrication
    • 具有透镜保护结构和制造方法的发光二极管(LED)装置
    • US09343639B2
    • 2016-05-17
    • US14093173
    • 2013-11-29
    • SemiLEDS Optoelectronics Co., Ltd.
    • David T Doan
    • H01L33/00H01L33/58H01L33/60
    • H01L33/58H01L24/97H01L33/60H01L2224/48091H01L2924/16152H01L2924/181H01L2933/0058H01L2924/00014H01L2924/00012
    • A light emitting diode (LED) device includes a substrate, a light emitting diode (LED) die mounted to the substrate configured to emit electromagnetic radiation, a lens covering the (LED) die, and a lens protective structure configured to protect the lens and a lens bonding layer from electromagnetic radiation emitted by the light emitting diode (LED) die and from reflected electromagnetic radiation within the lens. The lens protective structure can also be configured to reflect electromagnetic radiation increasing light extraction from the (LED) device. A method for fabricating the (LED) device includes the step of forming an opaque lens protective structure on the lens or on the lens bonding layer configured to protect the lens and the lens bonding layer from electromagnetic radiation emitted by the light emitting diode (LED) die and from reflected electromagnetic radiation within the lens.
    • 发光二极管(LED)装置包括:基板,安装到被配置为发射电磁辐射的基板的发光二极管(LED)裸片,覆盖(LED)裸片的透镜;以及被配置为保护透镜的透镜保护结构, 由发光二极管(LED)裸片发射的电磁辐射和透镜内的反射电磁辐射的透镜结合层。 透镜保护结构还可以被配置为反射从(LED)装置增加光提取的电磁辐射。 一种制造(LED)器件的方法包括在透镜上或透镜粘合层上形成不透明透镜保护结构的步骤,该透镜粘结层被配置为保护透镜和透镜粘合层免受由发光二极管(LED)发射的电磁辐射, 并从透镜内的反射电磁辐射中消失。