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    • 41. 发明授权
    • Method of forming shallow trench isolation with rounded corner and divot-free by using disposable spacer
    • 通过使用一次性间隔件形成具有圆角和无凹槽的浅沟槽隔离的方法
    • US06555442B1
    • 2003-04-29
    • US10042075
    • 2002-01-08
    • Chih-Yang PaiChih-Hsing YuYeur-Luen TuChia-Shiung TsaiMin-Hwa Chi
    • Chih-Yang PaiChih-Hsing YuYeur-Luen TuChia-Shiung TsaiMin-Hwa Chi
    • H01L2176
    • H01L21/76235
    • A method of fabricating an STI, comprising the following steps. A silicon structure having a pad oxide layer formed thereover is provided. An undoped poly buffer layer is formed over the pad oxide layer. A hard mask layer is formed over the undoped poly buffer layer. The hard mask layer, the undoped poly buffer layer and the pad oxide layer are patterned to form an opening exposing a portion of the silicon structure within an active area. The opening having exposed side walls. Inorganic spacers are formed over the exposed side walls. Using the patterned hard mask layer and the spacers as hard masks, the silicon structure is etched to form an STI opening within the active area. The inorganic spacers are removed exposing the upper corners of the STI opening. Using an oxidation process, a liner oxide layer is formed within the STI opening, over the upper corners of the STI opening and at least the patterned undoped poly buffer layer exposed by the removal of the inorganic spacers. An STI oxide layer is formed over the patterned hard mask layer, filling the liner oxide layer lined STI opening. The STI oxide layer is planarized and the patterned hard mask, the patterned undoped poly buffer layer and the patterned pad oxide layer are removed to fabricate the STI having rounded corners and without substantial divots.
    • 一种制造STI的方法,包括以下步骤。 提供了具有形成在其上的衬垫氧化物层的硅结构。 在衬垫氧化物层上形成未掺杂的多晶缓冲层。 在未掺杂的多缓冲层上形成硬掩模层。 将硬掩模层,未掺杂的多晶缓冲层和焊盘氧化物层图案化以形成暴露有源区域内的硅结构的一部分的开口。 开口具有暴露的侧壁。 在暴露的侧壁上形成无机间隔物。 使用图案化的硬掩模层和间隔物作为硬掩模,蚀刻硅结构以在有效区域内形成STI开口。 去除暴露STI开口的上角的无机间隔物。 使用氧化工艺,在STI开口内,在STI开口的上角上形成衬里氧化物层,并且至少通过去除无机间隔物露出图案化的未掺杂多缓冲层。 在图案化的硬掩模层之上形成STI氧化物层,填充衬里氧化物层衬里的STI开口。 将STI氧化物层平坦化,并且去除图案化的硬掩模,图案化的未掺杂多缓冲层和图案化的衬垫氧化物层,以制造具有圆角并且没有实质上的纹理的STI。