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    • 41. 发明申请
    • SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 固态成像装置及其制造方法
    • US20120133011A1
    • 2012-05-31
    • US13363801
    • 2012-02-01
    • Risako UenoKazuhiro SuzukiHideyuki FunakiYoshinori Iida
    • Risako UenoKazuhiro SuzukiHideyuki FunakiYoshinori Iida
    • H01L31/0232H01L31/18
    • H01L27/1464H01L27/14621H01L27/14627H01L27/1463H01L27/14689
    • A solid-state imaging device according to an embodiment includes: a plurality of pixels arranged on a first face of a first semiconductor layer, each of the pixels including a photoelectric conversion element converting light entering through a second face of the first semiconductor layer on the opposite side from the first face into a signal charge, the photoelectric conversion element having a pn junction formed with a first semiconductor region formed on the first face and a second semiconductor region formed on a surface of the first semiconductor region; pixel separating regions separating the pixels from one another and formed between the pixels, each of the pixel separating regions including a second semiconductor layer covering faces in contact with the photoelectric conversion elements, and an insulating film with a lower refractive index than a refractive index of the second semiconductor layer to cover the second semiconductor layer.
    • 根据实施例的固态成像装置包括:布置在第一半导体层的第一面上的多个像素,每个像素包括光电转换元件,其转换通过第一半导体层的第二面进入的光 所述光电转换元件具有形成在所述第一面上形成的第一半导体区域的pn结,以及形成在所述第一半导体区域的表面上的第二半导体区域; 像素分离区域,彼此分离并形成在像素之间,每个像素分隔区域包括覆盖与光电转换元件接触的面的第二半导体层,以及折射率低于折射率的绝缘膜 第二半导体层覆盖第二半导体层。
    • 42. 发明申请
    • SOLID-STATE IMAGING DEVICE
    • 固态成像装置
    • US20110156186A1
    • 2011-06-30
    • US12875546
    • 2010-09-03
    • Yoshinori IidaRisako UenoKazuhiro SuzukiHideyuki Funaki
    • Yoshinori IidaRisako UenoKazuhiro SuzukiHideyuki Funaki
    • H01L31/0232
    • H01L27/1463H01L27/1464
    • Certain embodiments provide a solid-state imaging device including: a plurality of pixels provided on a semiconductor substrate, each of the pixels having a semiconductor region that converts incident light from a side of a first face of the semiconductor substrate into signal charges and stores the signal charges; a readout circuit provided on a side of a second face that is the opposite side from the first face, and reading out the signal charges stored in the pixels; and a pixel separation structure provided between adjacent ones of the pixels in the semiconductor substrate, the pixel separation structure including a stack film buried in a trench extending from the first face, the stack film including a first insulating film provided along side faces and a bottom face of the trench, and a fixed charge film provided in the trench to cover the first insulating film and retaining fixed charges that are non-signal charges.
    • 某些实施例提供了一种固态成像装置,包括:设置在半导体衬底上的多个像素,每个像素具有半导体区域,该半导体区域将来自半导体衬底的第一面侧的入射光转换成信号电荷并将其存储 信号充电 读出电路,设置在与第一面相反一侧的第二面的一侧,并读出存储在像素中的信号电荷; 以及设置在所述半导体衬底中的相邻像素之间的像素分离结构,所述像素分离结构包括埋置在从所述第一面延伸的沟槽中的叠层膜,所述堆叠膜包括沿侧面设置的第一绝缘膜和底部 并且设置在沟槽中的固定电荷膜以覆盖第一绝缘膜并且保持作为非信号电荷的固定电荷。
    • 44. 发明授权
    • Bolometer type uncooled infrared ray sensor and method for driving the same
    • 分光光度计型非制冷红外线传感器及其驱动方法
    • US07737400B2
    • 2010-06-15
    • US12206234
    • 2008-09-08
    • Hideyuki FunakiYoshinori IidaHiroto Honda
    • Hideyuki FunakiYoshinori IidaHiroto Honda
    • G01J5/20
    • H04N5/33G01J5/20G01J5/22G01J2005/0048H04N5/3575H04N5/361H04N5/363H04N5/3651
    • A bolometer type uncooled infrared ray sensor includes: an image pickup region having detection pixels arranged in a matrix form on a semiconductor substrate to detect incident infrared rays; a plurality of row selection lines provided in the image pickup region; current sources capable of letting constant currents flow through the respective row selection lines; a plurality of signal lines provided in the image pickup region; voltage readout circuits provided so as to respectively correspond to the signal lines to read out signal voltages generated on the respectively corresponding signal lines; coupling capacitances respectively provided between the respective signal lines and the corresponding voltage readout circuits; and a calculator which calculates a difference between two signal voltages read out by the voltage readout circuits, corresponding to outputs of the same detection pixel for two different current values supplied from the current sources.
    • 测辐射计型非冷却红外线传感器包括:具有以矩阵形式布置在半导体衬底上的检测像素的摄像区域,以检测入射的红外线; 设置在图像拾取区域中的多个行选择线; 能够使恒定电流流过各行选择线的电流源; 设置在所述摄像区域中的多条信号线; 电压读出电路,分别对应于信号线,以读出分别对应的信号线上产生的信号电压; 分别设置在各信号线和对应的电压读出电路之间的耦合电容; 以及计算器,其计算由电压读出电路读出的两个信号电压之间的差值,对应于从电流源提供的两个不同电流值的相同检测像素的输出。
    • 45. 发明申请
    • SEMICONDUCTOR APPARATUS
    • US20090127639A1
    • 2009-05-21
    • US12206101
    • 2008-09-08
    • Kazuhiro SuzukiYoshinori IidaHideyuki Funaki
    • Kazuhiro SuzukiYoshinori IidaHideyuki Funaki
    • H01L25/00
    • G01C19/5719B81C1/00238B81C2203/0109B81C2203/019
    • A semiconductor apparatus includes: a first chip including a MEMS device which has a structure supported in midair therein, and having first pads and a first joining region electrically connected to the MEMS device on a top face thereof; a second chip including a circuit having a semiconductor device electrically connected to the MEMS device therein, and having second pads and a second joining region electrically connected to the semiconductor device on a top face thereof, the second chip being disposed in opposition to the first chip so as to oppose the second pads and the second joining region respectively to the first pads and the first joining region; electrical connection parts which electrically connect the first pads to the second pads, respectively; and joining parts provided between the first joining region and the second joining region opposed to the first joining region to join the first chip and the second chip to each other.
    • 半导体装置包括:第一芯片,其包括具有支撑在其中空间的结构的MEMS器件,并且具有第一焊盘和在其顶面上电连接到MEMS器件的第一接合区域; 第二芯片,包括具有与其中的MEMS器件电连接的半导体器件的电路,并且具有在其顶面上与半导体器件电连接的第二焊盘和第二接合区域,第二芯片设置成与第一芯片相对 以便分别将第二焊盘和第二接合区域与第一焊盘和第一接合区域相对; 分别将第一焊盘电连接到第二焊盘的电连接部分; 以及设置在第一接合区域和与第一接合区域相对的第二接合区域之间的接合部分,以将第一芯片和第二芯片彼此接合。