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    • 41. 发明授权
    • Nonvolatile memory element and method of manufacturing the nonvolatile memory element
    • 非易失性存储元件和制造非易失性存储元件的方法
    • US08692222B2
    • 2014-04-08
    • US13575338
    • 2011-12-12
    • Shinichi YonedaTakumi Mikawa
    • Shinichi YonedaTakumi Mikawa
    • H01L47/00
    • H01L45/146G11C13/0007G11C2213/72H01L45/1233
    • A nonvolatile memory element according to the present disclosure includes: a variable resistance element including a first electrode layer, a second electrode layer, and a variable resistance layer which is located between the first electrode layer and the second electrode layer and has a resistance value that reversibly changes based on an electrical signal applied between the first electrode layer and the second electrode layer; and a fixed resistance layer having a predetermined resistance value and stacked together with the variable resistance element. The variable resistance layer includes (i) a first transition metal oxide layer which is oxygen deficient and (ii) a second transition metal oxide layer which has a higher oxygen content atomic percentage than the first transition metal oxide layer. The predetermined resistance value ranges from 70Ω to 1000Ω inclusive.
    • 根据本公开的非易失性存储元件包括:可变电阻元件,包括位于第一电极层和第二电极层之间的第一电极层,第二电极层和可变电阻层,并且具有电阻值, 基于施加在第一电极层和第二电极层之间的电信号可逆地改变; 以及具有预定电阻值并与可变电阻元件一起堆叠的固定电阻层。 可变电阻层包括(i)缺氧的第一过渡金属氧化物层和(ii)具有比第一过渡金属氧化物层更高的氧含量原子百分比的第二过渡金属氧化物层。 预定电阻值范围为70&OHgr; 至1000&OHgr; 包括的。
    • 43. 发明授权
    • Nonvolatile semiconductor memory apparatus and manufacturing method thereof
    • 非易失性半导体存储装置及其制造方法
    • US08559205B2
    • 2013-10-15
    • US13563321
    • 2012-07-31
    • Takumi MikawaTakeshi Takagi
    • Takumi MikawaTakeshi Takagi
    • G11C17/00
    • H01L27/101G11C13/0007G11C2213/32G11C2213/72G11C2213/73H01L27/0688H01L27/112H01L27/115H01L27/2409H01L27/2418H01L27/2463H01L27/2481H01L45/04H01L45/1233H01L45/146H01L45/1683
    • A nonvolatile semiconductor memory apparatus including a substrate, lower-layer electrode wires provided on the substrate, an interlayer insulating layer provided with contact holes at locations respectively opposite to the lower-layer electrode wires, resistance variable layers which are respectively connected to the lower-layer electrode wires; and non-ohmic devices which are respectively provided on the resistance variable layers. The non-ohmic devices each has a laminated-layer structure including plural semiconductor layers, a laminated-layer structure including a metal electrode layer and an insulator layer, or a laminated-layer structure including a metal electrode layer and a semiconductor layer. One layer of the laminated-layer structure is embedded to fill each of the contact holes and the semiconductor layer or the insulator layer which is the other layer of the laminated-layer structure has a larger area than an opening of each of the contact holes and is provided on the interlayer insulating layer.
    • 一种非易失性半导体存储装置,包括基板,设置在基板上的下层电极布线,在与下层电极布线分别相对的位置设置有接触孔的层间绝缘层,分别与下层电极布线连接的电阻变化层, 层电极线; 以及分别设置在电阻变化层上的非欧姆器件。 非欧姆性器件各自具有包括多个半导体层的层压层结构,包括金属电极层和绝缘体层的层叠层结构,或者包括金属电极层和半导体层的层叠结构。 嵌入层叠层结构的一层以填充每个接触孔,作为层叠层结构的另一层的半导体层或绝缘体层的面积比每个接触孔的开口大, 设置在层间绝缘层上。
    • 50. 发明申请
    • NONVOLATILE MEMORY DEVICE
    • 非易失性存储器件
    • US20120292588A1
    • 2012-11-22
    • US13503770
    • 2011-12-15
    • Satoru FujiiHaruyuki SoradaTakumi Mikawa
    • Satoru FujiiHaruyuki SoradaTakumi Mikawa
    • H01L47/00
    • H01L45/145H01L27/2418H01L27/2463H01L27/2481H01L45/08H01L45/1233H01L45/146H01L45/1616H01L45/1625H01L45/1683
    • A nonvolatile memory device including: a strip-shaped first electrode line (151); a third interlayer insulating layer (16); a variable resistance layer having a stacked structure including a first variable resistance layer (18a) comprising an oxygen-deficient transition metal oxide and formed in a memory cell hole (29) to cover a bottom and a side face, and a second variable resistance layer (18b) comprising an oxygen- and/or nitrogen-deficient transition metal oxynitride having a different oxygen content than the first variable resistance layer; a first electrode (19) formed in the memory cell hole; and a strip-shaped first line (22) formed in a direction crossing the first electrode line (151) to cover at least an opening of the memory cell hole, and z>(x+y) is satisfied when the transition metal is represented by M and compositions of the first and the second variable resistance layers by MOz and MOxNy, respectively.
    • 一种非易失性存储器件,包括:带状第一电极线(151); 第三层间绝缘层(16); 具有堆叠结构的可变电阻层,包括由缺氧过渡金属氧化物构成的第一可变电阻层(18a),形成在存储单元孔(29)中以覆盖底部和侧面;以及第二可变电阻层 (18b),其包含氧含量低于所述第一可变电阻层的氧和/或氮缺乏的过渡金属氮氧化物; 形成在所述存储单元孔中的第一电极(19) 以及沿着与第一电极线(151)交叉的方向形成的带状第一线(22),以覆盖存储单元孔的至少一个开口,并且当表示过渡金属时,满足z>(x + y) 分别由M和第一和第二可变电阻层的组成分别由MOz和MOxNy组成。