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    • 44. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08618551B2
    • 2013-12-31
    • US13219862
    • 2011-08-29
    • Yukie NishikawaHironori YamasakiKatsuyoshi FurukiTakashi Kataoka
    • Yukie NishikawaHironori YamasakiKatsuyoshi FurukiTakashi Kataoka
    • H01L31/0256
    • H01L33/38H01L33/14H01L33/405H01L33/42H01L2933/0016
    • According to one embodiment, a semiconductor light emitting device includes a substrate, a first electrode, a first conductivity type layer, a light emitting layer, a second conductivity type layer and a second electrode. The first conductivity type layer includes a first contact layer, a window layer having a lower impurity concentration than the first contact layer and a first cladding layer. The second conductivity type layer includes a second cladding layer, a current spreading layer and a second contact layer. The second electrode includes a narrow-line region on the second contact layer and a pad region electrically connected to the narrow-line region. Band gap energies of the first contact and window layers are larger than that of the light emitting layer. The first contact layer is provided selectively between the window layer and the first electrode and without overlapping the second contact layer as viewed from above.
    • 根据一个实施例,半导体发光器件包括衬底,第一电极,第一导电类型层,发光层,第二导电类型层和第二电极。 第一导电类型层包括第一接触层,具有比第一接触层低的杂质浓度的窗口层和第一包层。 第二导电类型层包括第二包覆层,电流扩散层和第二接触层。 第二电极包括在第二接触层上的窄线区域和电连接到窄线区域的焊盘区域。 第一触点和窗口层的带隙能量大于发光层的带隙能量。 选择性地在窗口层和第一电极之间提供第一接触层,并且从上方观察不与第二接触层重叠。
    • 45. 发明申请
    • LIGHT EMITTING ELEMENT
    • 发光元件
    • US20120104431A1
    • 2012-05-03
    • US13048046
    • 2011-03-15
    • Takashi KataokaYukie NishikawaHironori Yamasaki
    • Takashi KataokaYukie NishikawaHironori Yamasaki
    • H01L33/40
    • H01L33/14H01L33/22
    • According to one embodiment, a light emitting element includes a light emitting layer, a cladding layer, a current spreading layer, a second layer, and an electrode. The light emitting layer is capable of emitting emission light. The current spreading layer includes a surface processed layer and a first layer. The surface processed layer has a surface including convex portions and bottom portions provided adjacent to the convex portions. The first layer is provided between the surface processed layer and the cladding layer. The second layer is provided between the surface processed layer and the cladding layer and includes a region having an impurity concentration higher than an impurity concentration of the current spreading layer. The electrode is provided in a region of the surface of the surface processed layer where the convex portions and the bottom portions are not provided.
    • 根据一个实施例,发光元件包括发光层,包覆层,电流扩散层,第二层和电极。 发光层能够发射发光。 电流扩散层包括表面处理层和第一层。 表面处理层具有包括与凸部相邻设置的凸部和底部的表面。 第一层设置在表面处理层和包覆层之间。 第二层设置在表面处理层和包覆层之间,并且包括杂质浓度高于电流扩散层的杂质浓度的区域。 电极设置在表面处理层的没有设置凸部和底部的表面的区域中。
    • 47. 发明授权
    • Wireless communications apparatus and method using array antenna
    • 使用阵列天线的无线通信装置和方法
    • US07408977B2
    • 2008-08-05
    • US10931996
    • 2004-09-02
    • Kenichi HiguchiHidekazu TaokaTakashi KataokaMamoru Sawahashi
    • Kenichi HiguchiHidekazu TaokaTakashi KataokaMamoru Sawahashi
    • H04B1/00
    • H04B7/086H01Q3/2605H04B7/0617H04B7/0695H04B7/088
    • A wireless communication apparatus comprises an array antenna configured to receive a signal at multiple antenna elements; a DoA estimation unit configured to estimate directions of arrival of multiple paths contained in the received signal; an angle spread estimation unit configured to estimate an angle spread of the multiple paths; a first weighting calculation unit configured to estimate a common set of weighting factors for all the paths; a second weighting calculation unit configured to estimate an individual set of weighting factors for each of the multiple paths based on the estimated directions of arrival of the paths; a weighting unit configured to weight the received signal by multiplying the received signal by one of the common set of weighting factors or individual set of weighting factor; and a demodulator configured to demodulate the weighted signal.
    • 无线通信装置包括被配置为在多个天线元件处接收信号的阵列天线; DoA估计单元,被配置为估计包含在接收信号中的多个路径的到达方向; 角度扩展估计单元,被配置为估计所述多个路径的角度扩展; 第一加权计算单元,被配置为估计用于所有路径的公共加权因子集合; 第二加权计算单元,被配置为基于估计的路径的到达方向来估计多个路径中的每一个的各个加权因子集合; 加权单元,被配置为通过将所接收的信号乘以公共加权因子集合或单独的一组加权因子来加权所接收的信号; 以及解调器,被配置为解调所述加权信号。