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    • 1. 发明申请
    • OVERMOLDED TRANSPARENT STRUCTURE
    • US20230030440A1
    • 2023-02-02
    • US17754220
    • 2019-11-01
    • DOW GLOBAL TECHNOLOGIES LLC
    • Xuejun Liu
    • B44C5/06B44C5/00
    • A transparent injection overmolded structure (100) encapsulating a real botanical matter (70) including at least one first transparent multilayer film member (50), at least one second transparent multilayer film member (60), a real botanical matter (70) disposed and encapsulated between the surface of the first transparent multilayer film member (50) and the surface of the second transparent multilayer film member (60) forming an integral transparent multilayered encapsulation structure (30), a base member (40) for receiving and attaching to the transparent multi-layered encapsulation structure (30), and an injection overmolded transparent plastic member (20) integral with and enveloping the base member (40) and the transparent multilayered encapsulation structure (30). Wherein the at least one first transparent multilayer film (50) member includes at least one low-seal initiation temperature inner layer (51) for contacting a botanical matter (70), at least one outer bonding layer (52) for contacting and bonding to an injection overmolded transparent plastic member (20), and at least one core barrier layer (53) interposed between the inner layer (51) and outer layer (52); wherein the at least one second transparent multilayer film member (60) includes at least one low-seal initiation temperature inner layer (61) for contacting a botanical matter (70), at least one outer bonding layer (62) for contacting and bonding to an injection overmolded transparent plastic member (20), and at least one core barrier layer (63) interposed between the inner layer (61) and outer layer (62). A process for producing the transparent injection overmolded structure (100) encapsulating a real botanical matter (70) is also disclosed.