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41. 发明授权

US09382621B2 Ground return for plasma processes 有权
标题翻译：等离子体工艺的接地回路
公开(公告)号：US09382621B2
公开(公告)日：2016-07-05
申请号：US12700484
申请日：2010-02-04
申请人： Soo Young Choi , Robin L. Tiner , Shinichi Kurita , John M. White , Carl A. Sorensen , Jeffrey A. Kho , Suhail Anwar , Makoto Inagawa , Gaku Furuta
发明人： Soo Young Choi , Robin L. Tiner , Shinichi Kurita , John M. White , Carl A. Sorensen , Jeffrey A. Kho , Suhail Anwar , Makoto Inagawa , Gaku Furuta
IPC分类号： C23C16/509 , C23C16/458 , H01J37/32 , H01L21/67
CPC分类号： C23C16/5096 , C23C16/4585 , H01J37/32091 , H01J37/32174 , H01J37/32568 , H01L21/67069
摘要： A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.
摘要翻译：描述了一种用于提供用于两个电极之间的电流的电对称接地或返回路径的方法和装置。该装置至少包括耦合到电极之一和处理室的侧壁和/或底部之间的射频（RF）装置。该方法包括相对于另一个电极移动一个电极，并且基于使用耦合到侧壁和电极的RF器件中的一个或两个的位移电极实现接地返回路径，耦合到腔室的底部的RF器件和电极或其组合。

42. 发明授权

US08528762B2 Electron beam welding of large vacuum chamber body having a high emissivity coating 有权
标题翻译：具有高发射率涂层的大型真空室体的电子束焊接
公开(公告)号：US08528762B2
公开(公告)日：2013-09-10
申请号：US12534534
申请日：2009-08-03
申请人： Shinichi Kurita , Mehran Behdjat , Makoto Inagawa
发明人： Shinichi Kurita , Mehran Behdjat , Makoto Inagawa
IPC分类号： B65D6/28
CPC分类号： B65D7/06 , B23K15/0006 , B65D7/38 , H01L21/67379
摘要： Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
摘要翻译：本文公开的实施例涉及已经焊接在一起的大型真空室主体。腔体可以在其中的至少一个表面上具有高发射率涂层。由于腔室主体的尺寸较大，可以通过将多个部件焊接在一起而不是从单个金属件锻造主体而形成腔体。这些部件可以在与身体的角部间隔开的位置处被焊接在一起，该位置在排空期间可能处于最大的应力下，以确保可能是身体中最弱点的焊缝不会失效。室主体的至少一个表面可以涂覆有高发射率涂层，以帮助来自加热的基底的热传递。高发射率涂层可以通过降低降低衬底温度所需的时间来增加衬底通量。

43. 外观设计

USD670372S1 Heater plate and heater element assembly 有权
标题翻译：加热板和加热器组件
公开(公告)号：USD670372S1
公开(公告)日：2012-11-06
申请号：US29403680
申请日：2011-10-10
申请人： Makoto Inagawa , Shinichi Kurita
设计人： Makoto Inagawa , Shinichi Kurita

44. 发明授权

US08182661B2 Controllable target cooling 有权
标题翻译：可控制目标冷却
公开(公告)号：US08182661B2
公开(公告)日：2012-05-22
申请号：US11190389
申请日：2005-07-27
申请人： Yoshiaki Tanase , Makoto Inagawa , Akihiro Hosokawa
发明人： Yoshiaki Tanase , Makoto Inagawa , Akihiro Hosokawa
IPC分类号： C23C14/34
CPC分类号： C23C14/3407 , H01J37/3408 , H01J37/3497 , Y10T29/49826
摘要： A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.
摘要翻译：特别适用于具有密封于主处理室的目标组件和容纳移动磁控管的真空抽吸室的大型等离子体溅射反应器的溅射靶组件。目标瓦片被粘合到的目标组件包括具有平行于主面钻出的平行冷却孔的整体板。孔的端部可以是密封的，并且垂直延伸的槽在每侧上布置成两个交错的组，并且被成对地加工成在背板的相对侧上的相应的一对冷却孔。四个歧管管被密封到四组槽，并提供反向流动的冷却剂路径。

45. 发明申请

US20120000773A1 REACTIVE SPUTTERING ZINC OXIDE TRANSPARENT CONDUCTIVE OXIDES ONTO LARGE AREA SUBSTRATES 审中-公开
标题翻译：氧化锌氧化物透明导电氧化物在大面积基材上的反应性溅射
公开(公告)号：US20120000773A1
公开(公告)日：2012-01-05
申请号：US13231182
申请日：2011-09-13
申请人： Yan Ye , Ankur Kadam , Yanping Li , Allen Ka-Ling Lau , Makoto Inagawa , Bradley O. Stimson , Akihiro Hosokawa
发明人： Yan Ye , Ankur Kadam , Yanping Li , Allen Ka-Ling Lau , Makoto Inagawa , Bradley O. Stimson , Akihiro Hosokawa
IPC分类号： C23C14/34
CPC分类号： C23C14/564 , C23C14/0063 , C23C14/35 , H01J37/3244 , H01J37/34 , H01J37/3438
摘要： The present invention generally comprises one or more cooled anodes shadowing one or more gas introduction tubes where both the cooled anodes and the gas introduction tubes span a processing space defined between one or more sputtering targets and one or more substrates within a sputtering chamber. The gas introduction tubes may have gas outlets that direct the gas introduced away from the one or more substrates. The gas introduction tubes may introduce reactive gas, such as oxygen, into the sputtering chamber for depositing TCO films by reactive sputtering. During a multiple step sputtering process, the gas flows (i.e., the amount of gas and the type of gas), the spacing between the target and the substrate, and the DC power may be changed to achieve a desired result.
摘要翻译：本发明通常包括一个或多个冷却的阳极，其遮蔽一个或多个气体导入管，其中冷却的阳极和气体引入管都跨越在溅射室内的一个或多个溅射靶和一个或多个衬底之间限定的处理空间。气体导入管可以具有引导从一个或多个基底引入的气体的气体出口。气体引入管可以将诸如氧的反应性气体引入到用于通过反应溅射沉积TCO膜的溅射室中。在多步骤溅射处理中，可以改变气体流动（即，气体的量和气体的类型），靶和基板之间的间隔以及DC功率以实现期望的结果。

46. 发明授权

US08070408B2 Load lock chamber for large area substrate processing system 有权
标题翻译：负载锁定室用于大面积基板处理系统
公开(公告)号：US08070408B2
公开(公告)日：2011-12-06
申请号：US12199341
申请日：2008-08-27
申请人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa , Suhail Anwar
发明人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa , Suhail Anwar
IPC分类号： H01L21/677
CPC分类号： H01L21/67201 , H01L21/67236
摘要： The present invention generally includes a load lock chamber for transferring large area substrates into a vacuum processing chamber. The load lock chamber may have one or more separate, environmentally isolated environments. Each processing environment may have a plurality exhaust ports for drawing a vacuum. The exhaust ports may be located at the corners of the processing environment. When a substrate is inserted into the load lock chamber from the factory interface, the environment may need to be evacuated. Due to the exhaust ports located at the corners of the environment, any particles or contaminants that may be present may be pulled to the closest corner and out of the load lock chamber without being pulled across the substrate. Thus, substrate contamination may be reduced.
摘要翻译：本发明通常包括用于将大面积基板输送到真空处理室中的负载锁定室。负载锁定室可以具有一个或多个单独的环境隔离环境。每个处理环境可以具有用于抽真空的多个排气口。排气口可以位于处理环境的拐角处。当基板从出厂界面插入加载锁定室时，环境可能需要抽真空。由于位于环境角落处的排气口，可能存在的任何颗粒或污染物可被拉到最靠近的角落并且不被拉过载体锁定室。因此，可能降低衬底污染。

47. 外观设计

USD622744S1 Load lock roller ball support 有权
标题翻译：负载锁定滚珠球支架
公开(公告)号：USD622744S1
公开(公告)日：2010-08-31
申请号：US29327945
申请日：2008-11-14
申请人： Makoto Inagawa
设计人： Makoto Inagawa

48. 发明申请

US20070267144A1 Heating and Cooling Plate for a Vacuum Chamber 有权
标题翻译：真空室的加热和冷却板
公开(公告)号：US20070267144A1
公开(公告)日：2007-11-22
申请号：US11419185
申请日：2006-05-18
申请人： Makoto Inagawa
发明人： Makoto Inagawa
IPC分类号： H01L21/306
CPC分类号： H01L21/67201 , H01L21/67109
摘要： A thin plate thermally coupled to a cooling tube is positioned between a heating plate and a substrate and is adapted to serve as a heating plate or a cooling plate for the substrate. The thin plate and heating plate may be positioned in a load lock for the expeditious heating and cooling of large-area substrates. The cooling tube may include a first conduit, a second conduit disposed inside the first conduit having substantially no contact with the first conduit and containing a working fluid, and an isolation region disposed between the first conduit and the second conduit. The working fluid may be thermally decoupled from the thin plate by evacuating the isolation region and thermally coupled to the thin plate by filling the isolation region with a heat-conducting gas.
摘要翻译：热耦合到冷却管的薄板位于加热板和基板之间，并且适于用作用于基板的加热板或冷却板。薄板和加热板可以定位在负载锁定中，以便快速加热和冷却大面积基板。冷却管可以包括第一管道，第二管道，其设置在第一管道内部，基本上不与第一管道接触并且包含工作流体，以及设置在第一管道和第二管道之间的隔离区域。工作流体可以通过排出隔离区域而与薄板热分离，并通过用导热气体填充隔离区域而与薄板热耦合。

49. 发明申请

US20070012559A1 Method of improving magnetron sputtering of large-area substrates using a removable anode 审中-公开
标题翻译：使用可移除阳极改进大面积基板的磁控管溅射的方法
公开(公告)号：US20070012559A1
公开(公告)日：2007-01-18
申请号：US11247438
申请日：2005-10-11
申请人： Akihiro Hosokawa , Hienminh Le , Makoto Inagawa , John White
发明人： Akihiro Hosokawa , Hienminh Le , Makoto Inagawa , John White
IPC分类号： C23C14/32
CPC分类号： C23C14/35 , C23C14/564 , H01J37/3408 , H01J37/3438
摘要： The present invention generally provides an apparatus and method for processing a surface of a substrate in physical vapor deposition (PVD) chamber that has an increased anode surface area to improve the deposition uniformity on large area substrates. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, the processing chamber contains one or more anode assemblies that are used to increase and more evenly distribute the anode surface area throughout the processing region of the processing chamber. In one aspect, the anode assembly contains a conductive member and conductive member support. In one aspect, the processing chamber is adapted to allow the conductive member to be removed from the processing chamber without removing any major components from the processing chamber.
摘要翻译：本发明通常提供一种用于处理物理气相沉积（PVD）室中的衬底的表面的装置和方法，其具有增加的阳极表面积以改善大面积衬底上的沉积均匀性。通常，本发明的各方面可用于平板显示处理，半导体处理，太阳能电池处理或任何其它基板处理。在一个方面，处理室包含一个或多个阳极组件，其用于增加并且更均匀地分布整个处理室的整个处理区域中的阳极表面区域。在一个方面，阳极组件包含导电构件和导电构件支撑件。在一个方面，处理室适于允许导电构件从处理室移除，而不会从处理室中移除任何主要部件。

50. 发明授权

US06918864B1 Roller that avoids substrate slippage 失效
标题翻译：避免衬底滑动的滚子
公开(公告)号：US06918864B1
公开(公告)日：2005-07-19
申请号：US09580880
申请日：2000-05-30
申请人： Brian J. Brown , Michael Sugarman , Makoto Inagawa , Daniel D. Ramar , Alexander Lerner
发明人： Brian J. Brown , Michael Sugarman , Makoto Inagawa , Daniel D. Ramar , Alexander Lerner
IPC分类号： H01L21/00 , A01B29/00
CPC分类号： H01L21/67057
摘要： A roller assembly is provided. The roller assembly comprises a groove that the includes two opposing surfaces. The roller assembly comprises either frictional surfaces positioned along the groove, or O-ring(s) coupled to the groove. The frictional surfaces may be a plurality of holes at spaced intervals along the opposing surfaces of the groove, a plurality of holes, each hole sized so as to extend into the two opposing surfaces, at spaced intervals along the opposing surfaces of the groove, or may be a bead-blasted surface or a knurled surface positioned along the opposing surfaces of the groove.
摘要翻译：提供辊组件。辊组件包括一个包括两个相对表面的槽。辊组件包括沿着凹槽定位的摩擦表面或耦合到凹槽的O形环。所述摩擦表面可以是沿所述槽的相对表面间隔开的多个孔，多个孔，每个孔的尺寸设计成沿所述槽的相对表面以间隔开的间隔延伸到所述两个相对的表面中，或者可以是沿着凹槽的相对表面定位的喷砂表面或滚花表面。

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