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41. 发明申请

US20050270518A1 Method for determining position of reference point 有权
标题翻译：确定参考点位置的方法
公开(公告)号：US20050270518A1
公开(公告)日：2005-12-08
申请号：US11141393
申请日：2005-06-01
申请人： Hiroyuki Sugawara , Takeshi Goto , Kounosuke Kitamura , Hiroshi Aoyama
发明人： Hiroyuki Sugawara , Takeshi Goto , Kounosuke Kitamura , Hiroshi Aoyama
IPC分类号： H05K1/02 , G03B27/32 , H05K3/00
CPC分类号： G03B27/32 , H05K1/0269 , H05K3/0008 , H05K3/0026 , H05K2201/09781 , H05K2201/09918
摘要： A method for determining a position of a reference point in which there is no influence of aberration of a camera lens or the like, but an error caused by a failure in shape of an alignment mark can be reduced. An alignment mark consisting of a plurality of pattern portions (and background portions) centering at a design reference point is provided in advance. Positions of centers of border lines of the patterns are calculated. Obtained coordinate values of the centers are averaged in each axial direction. The averaged coordinate values are regarded as coordinate values of a machining reference point. Thus, even when a defect occurs in any pattern portion, an error caused by the defect is reduced so that the accuracy in machining can be improved.
摘要翻译：可以减小用于确定在其中没有一个照相机透镜等的像差的影响的参考点的位置的方法，但由在对准标记的形状的失败的错误。预先设置由以设计基准点为中心的多个图案部分（和背景部分）构成的对准标记。计算模式边界线中心的位置。获得的中心坐标值在每个轴向平均。平均坐标值被认为是加工参考点的坐标值。因此，即使当在任何图案部分发生缺陷时，由缺陷引起的误差降低，从而可以提高加工精度。

42. 发明授权

US4949339A Multiplexer apparatus adaptable for two kinds of transmission rates 失效
标题翻译：适用于两种传输速率的多路复用器
公开(公告)号：US4949339A
公开(公告)日：1990-08-14
申请号：US240334
申请日：1988-09-06
申请人： Naohiro Shimada , Toshiyuki Nishina , Hiroyuki Sugawara
发明人： Naohiro Shimada , Toshiyuki Nishina , Hiroyuki Sugawara
IPC分类号： H04J3/07
CPC分类号： H04J3/073
摘要： A multiplexer apparatus supporting variable input bit stream rates in a single device is constructed by common use of a configurable buffer memory and a frequency dividing counter of the reference clock pulse. An externally generated selection signal corresponding to one of the variable input bit stream rates determines the length of the configurable buffer memory. The common frequency dividing counter of the reference clock pulse is designed by comparing bit patterns for the requisite initial counter values for each of the variable input bit stream rates.

43. 发明授权

US08278594B2 Method and apparatus for perforating printed circuit board 失效
标题翻译：印刷电路板穿孔方法和装置
公开(公告)号：US08278594B2
公开(公告)日：2012-10-02
申请号：US12396584
申请日：2009-03-03
申请人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
发明人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
IPC分类号： B23K26/06 , B23K26/38
CPC分类号： H05K3/0038 , B23K26/03 , B23K26/032 , B23K26/06 , B23K26/082 , C23F4/02 , H01L21/31116 , H01L21/32131 , H05K3/0035 , H05K2203/163
摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.
摘要翻译：提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。因此，获得了在导体层50i中处理窗口所需的照射脉冲数。用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。因此，在印刷电路板中处理孔。

44. 发明授权

US07831359B2 Passenger detecting device adapted for motor vehicle 有权
标题翻译：适用于机动车辆的客运检测装置
公开(公告)号：US07831359B2
公开(公告)日：2010-11-09
申请号：US11822642
申请日：2007-07-09
申请人： Hiroyuki Sugawara , Takahiro Kawakami , Masatoshi Kobayashi , Hitoshi Matsuo , Noriyuki Okawa
发明人： Hiroyuki Sugawara , Takahiro Kawakami , Masatoshi Kobayashi , Hitoshi Matsuo , Noriyuki Okawa
IPC分类号： G01G9/00 , B60R21/16
CPC分类号： G01G19/4142 , B60R21/01516 , B60R21/0152 , B60R2021/01225
摘要： A passenger detecting device includes a plurality of weight sensors, a passenger judging and data updating device and an update forbidding device. The weight sensors are arranged at different positions of a seat for respectively detecting weights acting on the seat of a motor vehicle. The passenger judging and data updating device is capable of judging a passenger on the seat based on the loads detected by the weight sensors and updating information on the passenger. The update forbidding device prevents the passenger judging and data updating device from judging the passenger or prevents the information to be updated when a sum-weight fluctuation amount is not less than a first predetermined threshold value, where the sum-weight fluctuation amount is obtained by summing up weight function amounts which are absolute values of fluctuations of the loads detected by the weight sensors.
摘要翻译：乘客检测装置包括多个重量传感器，乘客判断和数据更新装置以及更新禁止装置。重量传感器设置在座椅的不同位置，用于分别检测作用在机动车辆的座椅上的重量。乘客判断和数据更新装置能够基于由重量传感器检测到的载荷和乘客的更新信息来判断座椅上的乘客。更新禁止装置防止乘客判断和数据更新装置判断乘客，或者当总和变动量不小于第一预定阈值时，防止信息被更新，其中求和变动量通过将由重量传感器检测到的负载的波动的绝对值的权重函数量相加。

45. 发明授权

US07569026B2 Method of producing blood processing circuits and filter unit 有权
标题翻译：生产血液处理电路和过滤器的方法
公开(公告)号：US07569026B2
公开(公告)日：2009-08-04
申请号：US10574201
申请日：2004-09-29
申请人： Hiroyuki Sugawara
发明人： Hiroyuki Sugawara
IPC分类号： A61M37/00 , A61M1/00 , A61B19/00
CPC分类号： A61M1/3633 , A61M1/0222 , A61M1/0231 , A61M39/16
摘要： A bag connection comprises a first bag, a tube having a blood-drawing needle at the front end, a plurality of second bags, tubes for connecting the first and second bags, and tubes and branch connectors for connecting the second bags to each other. On the other hand, a filter unit includes a filter, and a tube connected at opposite ends thereof to the inlet and outlet of the filter. The tubes of the bag concatenation and the tube of the filter unit have respective markers attached thereto. With these markers used as marks, both tubes are aseptically connected by a tube aseptic connection device, thereby incorporating the filter unit into an intermediate portion of a tube of the bag concatenation.
摘要翻译：袋连接包括第一袋，在前端具有抽血针的管，多个第二袋，用于连接第一袋和第二袋的管，以及用于将第二袋彼此连接的管和分支连接器。另一方面，过滤器单元包括过滤器和在其相对端连接到过滤器的入口和出口的管。袋子级联的管和过滤器单元的管具有附接到其上的各自的标记。使用这些标记作为标记，两个管通过管无菌连接装置无菌连接，从而将过滤器单元并入袋连接管的中间部分。

46. 发明申请

US20090166340A1 Method and apparatus for perforating printed circuit board 失效
标题翻译：印刷电路板穿孔方法和装置
公开(公告)号：US20090166340A1
公开(公告)日：2009-07-02
申请号：US12396584
申请日：2009-03-03
申请人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
发明人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
IPC分类号： B23K26/38
CPC分类号： H05K3/0038 , B23K26/03 , B23K26/032 , B23K26/06 , B23K26/082 , C23F4/02 , H01L21/31116 , H01L21/32131 , H05K3/0035 , H05K2203/163
摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.
摘要翻译：提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。因此，获得了在导体层50i中处理窗口所需的照射脉冲数。用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。因此，在印刷电路板中处理孔。

47. 发明授权

US07531767B2 Method and apparatus for laser perforating printed circuit board 失效
标题翻译：激光穿孔印刷电路板的方法和装置
公开(公告)号：US07531767B2
公开(公告)日：2009-05-12
申请号：US11365657
申请日：2006-03-02
申请人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
发明人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
IPC分类号： B23K26/38 , G06F19/00
CPC分类号： H05K3/0038 , B23K26/03 , B23K26/032 , B23K26/06 , B23K26/082 , C23F4/02 , H01L21/31116 , H01L21/32131 , H05K3/0035 , H05K2203/163
摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.
摘要翻译：提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。因此，获得了在导体层50i中处理窗口所需的照射脉冲数。用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。因此，在印刷电路板中处理孔。

48. 发明申请

US20070224074A1 Method of manufacturing a clad material of bronze alloy and steel 失效
标题翻译：制造青铜合金和钢的复合材料的方法
公开(公告)号：US20070224074A1
公开(公告)日：2007-09-27
申请号：US11727440
申请日：2007-03-27
申请人： Hiroyuki Sugawara , Yasuo Ido , Yoshiaki Sato , Yukio Ogita , Shigemasa Hakakoshi
发明人： Hiroyuki Sugawara , Yasuo Ido , Yoshiaki Sato , Yukio Ogita , Shigemasa Hakakoshi
IPC分类号： B22F7/04
CPC分类号： B22F7/08 , B22F3/18 , B22F2998/10 , Y10T428/12021 , Y10T428/12493 , B22F7/002 , B22F3/10
摘要： A manufacturing method of a clad material composed of a bronze alloy and a steel is provided, including: scattering a bronze alloy powder on a steel back metal; sintering the bronze alloy powder to obtain a bilayer material having a porous bronze alloy layer on the steel; dry-rolling and a sintering the bilayer material so that the bronze alloy layer has a porosity of 3% or less; and wet-rolling the bilayer material with supplying a rolling oil to surfaces of rolling rolls. The clad manufactured according to this method can be heat-treated without an disadvantage in a conventional wet-rolling that entering rolling oil vaporizes in the bronze alloy layer during the heat treatment to form new voids. Therefore, it becomes possible to make a bronze alloy layer high in density in small times of rolling, thus enabling an increase in production efficiency.
摘要翻译：提供由青铜合金和钢构成的复合材料的制造方法，包括：将青铜合金粉末分散在钢背金属上; 烧结青铜合金粉末以获得在钢上具有多孔青铜合金层的双层材料; 干轧和烧结双层材料，使得青铜合金层的孔隙率为3％以下; 并通过向轧辊的表面供给轧制油将双层材料进行湿式轧制。根据该方法制造的包层可以在热处理期间在常规的湿式轧制中进行热处理，而不需要进入轧制油在青铜合金层中蒸发而形成新的空隙。因此，可以在少量轧制中使青铜合金层的密度高，从而能够提高生产效率。

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