专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08278594B2 Method and apparatus for perforating printed circuit board 失效
标题翻译：印刷电路板穿孔方法和装置
公开(公告)号：US08278594B2
公开(公告)日：2012-10-02
申请号：US12396584
申请日：2009-03-03
申请人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
发明人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
IPC分类号： B23K26/06 , B23K26/38
CPC分类号： H05K3/0038 , B23K26/03 , B23K26/032 , B23K26/06 , B23K26/082 , C23F4/02 , H01L21/31116 , H01L21/32131 , H05K3/0035 , H05K2203/163
摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.
摘要翻译：提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。因此，获得了在导体层50i中处理窗口所需的照射脉冲数。用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。因此，在印刷电路板中处理孔。

2. 发明申请

US20090166340A1 Method and apparatus for perforating printed circuit board 失效
标题翻译：印刷电路板穿孔方法和装置
公开(公告)号：US20090166340A1
公开(公告)日：2009-07-02
申请号：US12396584
申请日：2009-03-03
申请人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
发明人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
IPC分类号： B23K26/38
CPC分类号： H05K3/0038 , B23K26/03 , B23K26/032 , B23K26/06 , B23K26/082 , C23F4/02 , H01L21/31116 , H01L21/32131 , H05K3/0035 , H05K2203/163
摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.
摘要翻译：提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。因此，获得了在导体层50i中处理窗口所需的照射脉冲数。用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。因此，在印刷电路板中处理孔。

3. 发明授权

US07531767B2 Method and apparatus for laser perforating printed circuit board 失效
标题翻译：激光穿孔印刷电路板的方法和装置
公开(公告)号：US07531767B2
公开(公告)日：2009-05-12
申请号：US11365657
申请日：2006-03-02
申请人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
发明人： Kunio Arai , Hiroyuki Sugawara , Hiroaki Ashizawa , Hiromi Nishiyawa
IPC分类号： B23K26/38 , G06F19/00
CPC分类号： H05K3/0038 , B23K26/03 , B23K26/032 , B23K26/06 , B23K26/082 , C23F4/02 , H01L21/31116 , H01L21/32131 , H05K3/0035 , H05K2203/163
摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.
摘要翻译：提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。因此，获得了在导体层50i中处理窗口所需的照射脉冲数。用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。因此，在印刷电路板中处理孔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式