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    • 43. 发明授权
    • Optical part holding unit
    • 光学部件保持单元
    • US07428110B2
    • 2008-09-23
    • US10589606
    • 2005-02-17
    • Tamotsu TamadaKazunori NomiShigeru Sakamoto
    • Tamotsu TamadaKazunori NomiShigeru Sakamoto
    • G02B7/02
    • G02B7/003
    • It is an object to provide an optical component holding unit whereby the positioning accuracy can be improved while reducing cost through facilitated assembling and ensuring reproducibility.The fitting between a cross-sectionally noncircular-shaped rectangular convex portion 8a and a rectangular hole and the fitting between a cross-sectionally circular-shaped circular convex portion 11a and a circular hole, which surround or form opening portions 22a and 22b for allowing passage of light, guide adjacent optical component holding units 35 to predetermined positions and couples the units detachably to each other for positioning in the three-dimensional direction, while the fitting between the rectangular convex portion 8a and the rectangular hole and the fitting between spring pins 13a and fitting holes restrain the adjacent optical component holding units 35 relatively in the rotation direction for positioning in the rotation direction.
    • 本发明的目的是提供一种光学部件保持单元,由此可以通过便于组装降低成本并确保再现性来提高定位精度。 横截面非圆形矩形凸部8a和矩形孔之间的配合以及围绕或形成开口部分22a和22的横截面圆形圆形凸部11a和圆形孔之间的配合 b,用于允许光通过,将相邻的光学部件保持单元35引导到预定位置,并且将单元可拆卸地彼此联接以在三维方向上定位,同时矩形凸部8a和矩形孔之间的配合以及 弹簧销13a和装配孔之间的配合在相对旋转方向上相对地限制相邻的光学部件保持单元35,以沿旋转方向定位。
    • 49. 发明授权
    • Microscope and sample observation method
    • 显微镜和样品观察法
    • US07110172B2
    • 2006-09-19
    • US10880100
    • 2004-06-30
    • Hirotoshi TeradaIkuo ArataMasaharu TokiwaHiroshi TanabeShigeru Sakamoto
    • Hirotoshi TeradaIkuo ArataMasaharu TokiwaHiroshi TanabeShigeru Sakamoto
    • G02B21/00
    • G02B21/0016G02B21/33Y10S359/90
    • For a semiconductor device S as an inspected object, there are provided an image acquisition part 1, an optical system 2 including an objective lens 20, and a solid immersion lens (SIL) 3 movable between an insertion position including an optical axis from the semiconductor device S to the objective lens 20 and a standby position off the optical axis. Then observation is carried out in two control modes consisting of a first mode in which the SIL 3 is located at the standby position and in which focusing and aberration correction are carried out based on a refractive index no and a thickness to of a substrate of the semiconductor device S, and a second mode in which the SIL 3 is located at the insertion position and in which focusing and aberration correction are carried out based on the refractive index no and thickness t0 of the substrate, and a refractive index n1, a thickness d1, and a radius of curvature R1 of SIL 3. This provides a microscope and a sample observation method capable of readily performing observation of the sample necessary for an analysis of microstructure or the like of the semiconductor device.
    • 对于作为检查对象的半导体装置S,提供了图像获取部分1,包括物镜20的光学系统2和在包括来自半导体的光轴的插入位置之间可移动的固体浸没透镜(SIL)3 装置S到物镜20和离开光轴的待机位置。 然后在两个控制模式中进行观察,该两种控制模式包括SIL 3位于待机位置的第一模式,并且基于第一模式的基板的折射率no和厚度对其执行聚焦和像差校正 半导体器件S和第二模式,其中SIL 3位于插入位置,并且基于衬底的折射率no和厚度t 0 0进行聚焦和像差校正, 和折射率n 1 1,厚度d 1,以及SIL 3的曲率半径R 1 1。 这提供了能够容易地观察对半导体器件的微细结构等的分析所需的样品的显微镜和样品观察方法。